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公开(公告)号：US07834273B2
公开(公告)日：2010-11-16
申请号：US11480824
申请日：2006-07-06
Applicant: Michimasa Takahashi , Yukinobu Mikado , Takenobu Nakamura , Masakazu Aoyama
Inventor： Michimasa Takahashi , Yukinobu Mikado , Takenobu Nakamura , Masakazu Aoyama
IPC: H01L23/48
CPC classification number: H01L23/48 , H01L2924/0002 , H05K1/115 , H05K3/00 , H05K3/4602 , H05K3/4652 , H05K2201/0352 , H05K2201/0394 , H05K2201/09563 , H05K2201/096 , H05K2201/09709 , H05K2201/09827 , Y10T29/49124 , H01L2924/00
Abstract: A multilayer printed wiring board comprises a plurality of insulating layers which is about 100 μm or less in thickness and a plurality of conductor circuits formed on the insulating layers. Each of a plurality of viaholes electrically connecting conductor circuits on the insulating layers to each other is formed tapered inwardly from the surface of the insulating layer and the viaholes are disposed opposite to each other to form a multistage stacked vias.
Abstract translation: 多层印刷线路板包括厚度为约100μm以下的多个绝缘层和在绝缘层上形成的多个导体电路。 将绝缘层上的导体电路彼此电连接的多个通孔中的每一个从绝缘层的表面向内形成为锥形，并且通孔彼此相对设置以形成多级堆叠通孔。
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公开(公告)号：US20100159647A1
公开(公告)日：2010-06-24
申请号：US12611231
申请日：2009-11-03
Applicant: Sotaro ITO , Michimasa Takahashi , Yukinobu Mikado
Inventor： Sotaro ITO , Michimasa Takahashi , Yukinobu Mikado
IPC: H01L21/56
CPC classification number: H05K1/0218 , H01L23/49822 , H01L23/5389 , H01L23/552 , H01L24/24 , H01L24/82 , H01L2224/04105 , H01L2224/12105 , H01L2224/2402 , H01L2224/73267 , H01L2224/82039 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15157 , H01L2924/1517 , H01L2924/15331 , H01L2924/15788 , H01L2924/3025 , H01L2924/3511 , H05K1/183 , H05K1/185 , H05K3/4652 , H05K2201/09981 , H05K2203/0733 , Y10T29/49155 , H01L2924/00
Abstract: A multilayer printed circuit board, wherein, on a resin-insulating layer that houses a semiconductor element, another resin-insulating layer and a conductor circuit are formed with conductor circuits electrically connected through a via hole, wherein a electromagnetic shielding layer is formed on a resin-insulating layer surrounding a concave portion for housing a semiconductor element or on the inner wall surface of the concave portion, and the semiconductor element is embedded in the concave portion.
Abstract translation: 一种多层印刷电路板，其中，在容纳半导体元件的树脂绝缘层，另一树脂绝缘层和导体电路上形成有通过通孔电连接的导体电路，其中电磁屏蔽层形成在 环绕用于容纳半导体元件的凹部或凹部的内壁面的树脂绝缘层，并且半导体元件嵌入在凹部中。
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公开(公告)号：US20100155130A1
公开(公告)日：2010-06-24
申请号：US12713249
申请日：2010-02-26
Applicant: Michimasa Takahashi , Yukinobu Mikado , Takenobu Nakamura , Masakazu Aoyama
Inventor： Michimasa Takahashi , Yukinobu Mikado , Takenobu Nakamura , Masakazu Aoyama
IPC: H05K1/11
CPC classification number: H05K3/421 , H05K1/115 , H05K3/423 , H05K3/4602 , H05K3/4652 , H05K2201/0394 , H05K2201/09563 , H05K2201/096 , H05K2201/09709 , H05K2201/09863 , H05K2203/0733 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , Y10T428/31511
Abstract: A multilayer printed wiring board comprises insulating layers and conductor layers being stacked alternately on each other. The conductor layers are electrically connected to each other through viaholes formed in the insulating layers. Each of the viaholes is formed to bulge in a direction generally orthogonal to the direction of thickness of the insulating layer. The multilayer printed wiring board is to have electronic components such as a capacitor, IC and the like mounted on the surface layer thereof.
Abstract translation: 多层印刷布线板包括彼此交替堆叠的绝缘层和导体层。 导体层通过形成在绝缘层中的通孔彼此电连接。 每个通孔形成为沿与绝缘层的厚度方向大致正交的方向凸出。 该多层印刷线路板具有安装在其表面层上的诸如电容器，IC等的电子部件。
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公开(公告)号：US20100139967A1
公开(公告)日：2010-06-10
申请号：US12537656
申请日：2009-08-07
Applicant: Michimasa Takahashi
Inventor： Michimasa Takahashi
CPC classification number: H05K1/142 , H05K3/0052 , H05K3/429 , H05K3/4602 , H05K3/4691 , H05K3/4694 , H05K2201/0187 , H05K2201/0715 , H05K2201/09127 , H05K2201/09972 , H05K2203/063 , Y10T29/49155
Abstract: A wiring board includes an insulating board, wiring sub boards, and insulating layers having via holes in which conductors are formed by plating. The insulating board and the wiring sub boards are horizontally laid out. The insulating layers are laid out to respectively cover a first boundary portion between the insulating board and each of the wiring sub boards, and a second boundary portion between the wiring sub boards, and continuously extend from the insulating board to wiring sub boards. Resins which constitute the insulating layers are filled in the first boundary portion and the second boundary portion. The conductors are electrically connected to the wiring layers.
Abstract translation: 布线板包括绝缘板，布线子板以及具有通过电镀形成导体的通孔的绝缘层。 绝缘板和布线子板水平布置。 绝缘层布置成分别覆盖绝缘板和每个布线子板之间的第一边界部分和布线子板之间的第二边界部分，并且从绝缘板连续延伸到布线子板。 构成绝缘层的树脂填充在第一边界部分和第二边界部分中。 导体电连接到布线层。
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Patent Agency Ranking
公开(公告)号：US20090242241A1
公开(公告)日：2009-10-01
申请号：US12403220
申请日：2009-03-12
Applicant: Michimasa Takahashi , Masakazu Aoyama
Inventor： Michimasa Takahashi , Masakazu Aoyama
CPC classification number: H05K3/4691 , H05K3/4602 , H05K3/4652 , H05K2201/055 , H05K2201/09127 , H05K2201/09536 , H05K2203/063 , H05K2203/308 , Y10T29/49124
Abstract: A flex-rigid wiring board includes a first rigid substrate, a second rigid substrate arranged at a distance from the first rigid substrate to provide a space between the first and second rigid substrates and a flexible substrate. The flexible substrate includes a first tip portion connected to the first rigid substrate, and a second tip portion connected to the second rigid substrate such that the first and second rigid substrates are connected to each other by way of the flexible substrate. At least one bending portion is formed between the first and second tip portions of the flexible substrate, each of the at least one bending portions is provided in the space between the first and second rigid substrates.
Abstract translation: 柔性刚性布线板包括第一刚性基板，布置在与第一刚性基板相距一定距离处的第二刚性基板，以在第一和第二刚性基板之间提供空间和柔性基板。 柔性基板包括连接到第一刚性基板的第一末端部分和连接到第二刚性基板的第二末端部分，使得第一和第二刚性基板通过柔性基板相互连接。 至少一个弯曲部分形成在柔性基板的第一和第二末端部分之间，所述至少一个弯曲部分中的每一个设置在第一和第二刚性基板之间的空间中。
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公开(公告)号：US20080283287A1
公开(公告)日：2008-11-20
申请号：US12050646
申请日：2008-03-18
Applicant: Michimasa Takahashi , Masakazu Aoyama
Inventor： Michimasa Takahashi , Masakazu Aoyama
CPC classification number: H05K3/4691 , H05K1/0373 , H05K3/0032 , H05K3/429 , H05K3/4602 , H05K3/4652 , H05K2201/0187 , H05K2201/0209 , H05K2201/09536 , H05K2203/1536
Abstract: A wiring board and method of forming a wiring board including a first substrate, a second substrate having a smaller mounting area than a mounting area of the first substrate, and a base substrate laminated between the first substrate and the second substrate, such that the first substrate extends beyond an edge of the second substrate. An IVH (Interstitial Via Hole) or through hole penetrates the base substrate and vias are formed in at least one of the first substrate or the second substrate.
Abstract translation: 一种布线板以及形成布线板的方法，所述布线板包括第一基板，具有比所述第一基板的安装面积小的安装面积的第二基板以及层叠在所述第一基板和所述第二基板之间的基底基板， 衬底延伸超过第二衬底的边缘。 IVH（间隙通孔）或通孔穿透基底基板，并且通孔形成在第一基板或第二基板中的至少一个中。
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公开(公告)号：US20080283276A1
公开(公告)日：2008-11-20
申请号：US12050771
申请日：2008-03-18
Applicant: Michimasa Takahashi , Masakazu Aoyama
Inventor： Michimasa Takahashi , Masakazu Aoyama
CPC classification number: H05K3/4691 , H05K1/0373 , H05K3/0032 , H05K3/429 , H05K3/4602 , H05K3/4652 , H05K2201/0187 , H05K2201/0209 , H05K2201/09536 , H05K2203/1536 , Y10T29/49126 , Y10T29/49165
Abstract: A wiring board and a method of forming a wiring board including a first substrate, a second substrate having a smaller mounting area than a mounting area of the first substrate, and a base substrate laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate. An IVH (Interstitial Via Hole) penetrates the base substrate.
Abstract translation: 一种布线板和形成布线板的方法，该布线板包括第一基板，具有比第一基板的安装面积小的安装面积的第二基板以及层叠在第一基板和第二基板之间的基底基板， 衬底延伸超过第二衬底的边缘。 IVH（间隙通孔）穿透基底。
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公开(公告)号：US20070154741A1
公开(公告)日：2007-07-05
申请号：US11480851
申请日：2006-07-06
Applicant: Michimasa Takahashi , Yukinobu Mikado , Takenobu Nakamura , Masakazu Aoyama
Inventor： Michimasa Takahashi , Yukinobu Mikado , Takenobu Nakamura , Masakazu Aoyama
CPC classification number: H05K3/421 , H05K1/115 , H05K3/423 , H05K3/4602 , H05K3/4652 , H05K2201/0394 , H05K2201/09563 , H05K2201/096 , H05K2201/09709 , H05K2201/09863 , H05K2203/0733 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , Y10T428/31511
Abstract: A multilayer printed wiring board comprises insulating layers and conductor layers being stacked alternately on each other. The conductor layers are electrically connected to each other through viaholes formed in the insulating layers. Each of the viaholes is formed to bulge in a direction generally orthogonal to the direction of thickness of the insulating layer. The multilayer printed wiring board is to have electronic components such as a capacitor, IC and the like mounted on the surface layer thereof.
Abstract translation: 多层印刷布线板包括彼此交替堆叠的绝缘层和导体层。 导体层通过形成在绝缘层中的通孔彼此电连接。 每个通孔形成为沿与绝缘层的厚度方向大致正交的方向凸出。 该多层印刷线路板具有安装在其表面层上的诸如电容器，IC等的电子部件。
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99.发明申请公开(公告)号：US20060102384A1
公开(公告)日：2006-05-18
申请号：US11250531
申请日：2005-10-17
Applicant: Yasuhiro Watanabe , Michimasa Takahashi , Masakazu Aoyama , Takenobu Nakamura , Hiroyuki Yanagisawa
Inventor： Yasuhiro Watanabe , Michimasa Takahashi , Masakazu Aoyama , Takenobu Nakamura , Hiroyuki Yanagisawa
CPC classification number: H05K1/113 , H01L23/49816 , H01L23/49822 , H01L2224/16 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01025 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/15174 , H01L2924/15311 , H01L2924/19105 , H01L2924/19106 , H05K1/114 , H05K3/243 , H05K3/28 , H05K3/282 , H05K3/4614 , H05K2201/0391 , H05K2201/10674 , H05K2203/0574 , Y10T29/49117 , Y10T29/49124 , Y10T29/49147 , Y10T29/49155 , Y10T29/49156 , Y10T29/49204 , H01L2224/0401
Abstract: This invention provides a multilayer printed wiring board in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can be improved. No corrosion resistant layer is formed on a solder pad 60B on which a component is to be mounted so as to obtain flexibility. Thus, if an impact is received from outside when a related product is dropped, the impact can be buffered so as to protect any mounted component from being removed. On the other hand, land 60A in which the corrosion resistant layer is formed is unlikely to occur contact failure even if a carbon pillar constituting an operation key makes repeated contacts.
Abstract translation: 本发明提供了一种通过提高可靠性而获得电连接性和功能性的多层印刷线路板，特别是可提高落下试验的可靠性。 在要安装部件的焊料垫60B上没有形成耐腐蚀层，以获得柔性。 因此，如果在相关产品掉线时从外部接收到冲击，则可以缓冲影响，以保护所安装的组件不被移除。 另一方面，即使构成操作键的碳柱重复接触，也可能不形成耐腐蚀层的焊盘60A接触不良。
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