公开(公告)号：US20170016954A1

公开(公告)日：2017-01-19

申请号：US15179641

申请日：2016-06-10

Applicant: Translarity, Inc.

Inventor： Nikolai Kalnin ,  Christopher T. Lane ,  David Ekstrom ,  Morgan T. Johnson ,  Douglas A. Preston

IPC: G01R31/28 ,  G01R1/04 ,  H01L21/67 ,  H01L21/66 ,  H01L21/683 ,  H01L21/677

CPC classification number: G01R31/2891 ,  F04B37/14 ,  G01R1/0466 ,  G01R31/2893 ,  H01L21/67144 ,  H01L21/67242 ,  H01L21/677 ,  H01L21/6838 ,  H01L22/14

Abstract: Systems and methods for testing semiconductor wafers using a wafer translator are disclosed herein. In one embodiment, an apparatus for testing semiconductor dies on a wafer includes a wafer translator having a wafer-side facing toward the wafer, and an inquiry-side facing away from the wafer-side. The wafer has an active side facing the translator. The apparatus includes a peripheral seal configured to seal a space between the wafer translator and the wafer, and a valve in a fluidic communication with the space between the wafer translator and the wafer.

Abstract translation: 本文公开了使用晶片转换器测试半导体晶片的系统和方法。 在一个实施例中，用于在晶片上测试半导体管芯的装置包括具有晶片侧面向晶片的晶片转换器和面向晶片侧的查询侧。 晶片具有面向平移器的有源侧。 该装置包括构造成密封晶片转换器和晶片之间的空间的外围密封件，以及与晶片转换器和晶片之间的空间流体连通的阀。

公开(公告)号：US20160314993A1

公开(公告)日：2016-10-27

申请号：US15137722

申请日：2016-04-25

Applicant: Brooks Automation, Inc.

Inventor： Alexander G. Krupyshev ,  John Underwood

IPC: H01L21/677 ,  H01L21/67

CPC classification number: H01L21/677 ,  H01L21/67126 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201

Abstract: A workpiece handling module including a first housing member and a second housing member pivotally movable relative to the first member forming a housing having an access side and a second side opposite the access side and side walls, a first portion of the side walls is carried by the first member and a second portion of the side walls is carried by the second member, and at least one of the first and second housing members includes at least one sealable opening for allowing ingress and egress of workpieces to and from an interior chamber formed by the first and second housing members in a closed configuration, and the second portion of the side walls adjacent the access side and carried by the second member is greater than the first portion of the side walls adjacent the access side and carried by the first member.

Abstract translation: 一种工件处理模块，包括第一壳体构件和第二壳体构件，所述第二壳体构件可相对于第一构件枢转运动，所述第一构件形成具有入口侧的壳体和与入口侧和侧壁相对的第二侧，侧壁的第一部分由 所述第一构件和所述侧壁的第二部分由所述第二构件承载，并且所述第一和第二壳体构件中的至少一个包括至少一个可密封的开口，用于允许工件进入和离开由内部腔室形成的内部腔室 所述第一和第二壳体构件处于闭合构型，并且邻近所述进入侧并由所述第二构件承载的所述侧壁的第二部分大于邻近所述进入侧并由所述第一构件承载的所述侧壁的第一部分。

公开(公告)号：US20160233118A1

公开(公告)日：2016-08-11

申请号：US15132674

申请日：2016-04-19

Applicant: EBARA CORPORATION

Inventor： Ryuichi KOSUGE ,  Hiroaki NISHIDA ,  Tadakazu SONE ,  Hideo AIZAWA ,  Tomohiro TANAKA

IPC: H01L21/673 ,  B65G47/90 ,  H01L21/67

CPC classification number: H01L21/67313 ,  B24B37/345 ,  B65G47/901 ,  H01L21/67092 ,  H01L21/677 ,  H01L21/68707 ,  H01L21/68728 ,  H01L21/68735

Abstract: A workpiece transport device for transporting a workpiece having a substrate layer and a layer to be processed on a portion of the substrate layer is provided. This workpiece transport device has a workpiece holding mechanism arranged to operate so as to hold and release the workpiece. The workpiece holding mechanism has at least one tapered workpiece holding surface on which the substrate layer of the workpiece is held in a state where the layer to be processed is positioned below the substrate layer. The tapered workpiece holding surface is formed so that a clearance equal to or larger than a predetermined distance R exists between the workpiece holding surface and the layer to be processed of the workpiece when the workpiece is held by the workpiece holding mechanism.

Abstract translation: 提供了一种用于在衬底层的一部分上传送具有衬底层和待加工层的工件的工件传送装置。 该工件输送​​装置具有工件保持机构，该工件保持机构被布置成操作以保持和释放工件。 工件保持机构具有至少一个锥形工件保持表面，工件的基底层保持在其上待处理层位于基底层下方的状态下。 当工件被工件保持机构保持时，锥形工件保持表面形成为在工件保持表面和待加工的被加工层之间存在等于或大于预定距离R的间隙。

公开(公告)号：US09401294B2

公开(公告)日：2016-07-26

申请号：US14058436

申请日：2013-10-21

Applicant: Brooks Automation, Inc.

Inventor： Christopher Hofmeister ,  Alexander Krupyshev ,  Ulysses Gilchrist

IPC: H01L21/677 ,  H01L21/67

CPC classification number: H01L21/677 ,  H01L21/6719 ,  H01L21/67201 ,  H01L21/67742 ,  H01L21/67766 ,  H01L21/67775

Abstract: A substrate processing system including a load port module configured to hold at least one substrate container for storing and transporting substrates, a substrate processing chamber, an isolatable transfer chamber capable of holding an isolated atmosphere therein configured to couple the substrate processing chamber and the load port module, and a substrate transport mounted at least partially within the transfer chamber having a drive section fixed to the transfer chamber and having a SCARA arm configured to support at least one substrate, the SCARA arm being configured to transport the at least one substrate between the at least one substrate container and the processing chamber with but one touch of the at least one substrate, wherein the SCARA arm comprises a first arm link, a second arm link, and at least one end effector serially pivotally coupled to each other, where the first and second arm links have unequal lengths.

公开(公告)号：US09368382B2

公开(公告)日：2016-06-14

申请号：US14223553

申请日：2014-03-24

Applicant: Brooks Automation, Inc.

Inventor： Gerald M. Friedman ,  Michael L. Bufano ,  Christopher Hofmeister ,  Ulysses Gilchrist ,  William Fosnight

IPC: B65G47/10 ,  H01L21/677 ,  B65G47/50 ,  H01L21/67

CPC classification number: H01L21/677 ,  B65G47/50 ,  H01L21/67276 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  Y10S414/14

Abstract: A substrate processing apparatus is provided. The apparatus has a casing, a low port interface and a carrier holding station. The casing has processing devices within for processing substrates. The load port interface is connected to the casing for loading substrates into the processing device. The carrier holding station is connected to the casing. The carrier holding station is adapted for holding at least one substrate transport carrier so the at least one substrate transport carrier is capable of being coupled to the load port interface without lifting the at least one substrate transport carrier off the carrier holding station. The carrier holding station is arranged to provide a substantially simultaneous swap section for substantially simultaneous replacement of the substrate transport carrier from the carrier holding station.

Abstract translation: 提供了一种基板处理装置。 该装置具有壳体，低端口接口和载体保持站。 壳体具有用于处理基板的处理装置。 负载端口接口连接到外壳，用于将基板装载到处理设备中。 托架保持站连接到外壳。 载体保持站用于保持至少一个基板输送载体，使得至少一个基板输送载体能够耦合到负载端口接口，而不将至少一个基板传输载体从载体保持站提起。 载体保持站布置成提供基本上同时的交换部分，用于基本上同时从载体保持站更换基板传输载体。

公开(公告)号：US20160111586A1

公开(公告)日：2016-04-21

申请号：US14882737

申请日：2015-10-14

Applicant: Luis Alejandro Rey-Garcia ,  Peter G. Ragay

Inventor： Luis Alejandro Rey-Garcia ,  Peter G. Ragay

IPC: H01L31/18 ,  H05B3/00 ,  H01L21/677 ,  H01L31/028 ,  H01L21/67

CPC classification number: H01L31/1868 ,  H01J65/04 ,  H01L21/67115 ,  H01L21/67173 ,  H01L21/677 ,  H01L21/6776 ,  H01L31/028 ,  H01L31/0288 ,  H01L31/186 ,  H01L31/1864 ,  H01L31/1876 ,  H05B1/0233 ,  H05B3/0047

Abstract: Reduction of solar wafer LID by exposure to continuous or intermittent High-Intensity full-spectrum Light Radiation, HILR, by an Enhanced Light Source, ELS, producing 3-10 Sols, optionally in the presence of forming gas or/and heating to within the range of from 100° C.-300° C. HILR is provided by ELS modules for stand-alone bulk/continuous processing, or integrated in wafer processing lines in a High-Intensity Light Zone, HILZ, downstream of a wafer firing furnace. A finger drive wafer transport provides continuous shadowless processing speeds of 200-400 inches/minute in the integrated furnace/HILZ. Wafer dwell time in the peak-firing zone is 1-2 seconds. Wafers are immediately cooled from peak firing temperature of 850° C.-1050° C. in a quench zone ahead of the HILZ-ELS modules. Dwell in the HILZ is from about 10 sec to 5 minutes, preferably 10-180 seconds. Intermittent HILR exposure is produced by electronic control, a mask, rotating slotted plate or moving belt.

Abstract translation: 通过暴露于连续或间歇性高强度全光谱光辐射（通过增强型光源ELS）ELS生产3-10 Sols，可任选地在形成气体或/和加热的情况下，减少太阳能晶片LID 范围为100°C-300°C。HILR由ELS模块提供，用于独立的散装/连续加工，或集成在晶圆加热炉下游的高强度光区HILZ的晶圆处理生产线中。 手指驱动晶片传输在集成炉/ HILZ中提供200-400英寸/分钟的连续无阴影处理速度。 峰值放电区的晶圆停留时间为1-2秒。 在HILZ-ELS模块之前的淬火区域中，立即从峰值烧制温度850°C-1050°C冷却晶片。 在HILZ中停留约10秒至5分钟，优选10-180秒。 间歇HILR曝光是通过电子控制，面罩，旋转开槽板或移动带产生的。

公开(公告)号：US20160111317A1

公开(公告)日：2016-04-21

申请号：US14980317

申请日：2015-12-28

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Shinya FUKAYAMA ,  Yukifumi OYAMA ,  Satoshi TSUKIYAMA ,  Masatoshi FUKUDA

IPC: H01L21/683 ,  H01L21/677 ,  H01L25/00 ,  H01L23/00

CPC classification number: H01L21/6838 ,  H01L21/677 ,  H01L24/75 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/7565 ,  H01L2224/81191

Abstract: A semiconductor manufacturing apparatus includes: a collet which sucks a semiconductor chip having a main surface on which a bump is formed, and an actuator which transfers the sucked semiconductor chip onto a mounting substrate or another semiconductor chip by driving the collet. A recessed portion for avoiding a contact between the collet and the bump is formed on a suction surface of the collet which sucks the semiconductor chip.

公开(公告)号：US09275883B2

公开(公告)日：2016-03-01

申请号：US14216330

申请日：2014-03-17

Applicant: YAS Co., LTD

Inventor： Kwang-Ho Jeong

IPC: B65G35/00 ,  B65G51/03 ,  H01L21/677

CPC classification number: H01L21/677 ,  H01L21/67709

Abstract: The intent of this invention is to provide an apparatus for substrate transportation that is to carry the substrate without any mechanical contact when the substrate is required to be transported in various manufacturing processes including semiconductor, display and the like.

Abstract translation: 本发明的目的是提供一种用于基板输送的装置，当基板需要在包括半导体，显示器等的各种制造工艺中被输送时，其将承载基板而没有任何机械接触。

公开(公告)号：US09252036B2

公开(公告)日：2016-02-02

申请号：US14810409

申请日：2015-07-27

Applicant: KABUSHIKI KAISHA YASKAWA DENKI

Inventor： Masatoshi Furuichi ,  Yoshiki Kimura

IPC: H01L21/677

CPC classification number: H01L21/68707 ,  H01L21/677 ,  H01L21/67706 ,  H01L21/67715 ,  H01L21/67766 ,  Y10S414/137

Abstract: A substrate transfer system includes a substrate transfer robot disposed in a robot installment area defined between a first apparatus and a second apparatus. The first apparatus includes a first cassette, a second cassette and a first wall. The second apparatus includes a second wall. The substrate transfer robot transfers a substrate from each of the first cassette and the second cassette to the second apparatus. The substrate transfer robot includes a hand and an arm. The arm includes a first arm rotatable about a center of rotation. The first cassette is closer to the center of rotation than the second cassette. The arm moves with being partially disposed beyond the second wall in plan view and the arm moves without being disposed beyond the second wall in plan view when taking out the substrate from the first cassette.

Abstract translation: 衬底传送系统包括设置在第一装置和第二装置之间限定的机器人安装区域中的衬底传送机器人。 第一装置包括第一盒，第二盒和第一壁。 第二装置包括第二壁。 基板传送机构将基板从第一盒和第二盒中的每一个传送到第二装置。 基板传送机器人包括手和臂。 臂包括可围绕旋转中心旋转的第一臂。 第一盒比第二盒更接近旋转中心。 臂在平面图中部分地设置在第二壁之外移动，并且当从第一盒取出基板时，臂在平面图中移动而不设置在第二壁之外。

公开(公告)号：US09245767B2

公开(公告)日：2016-01-26

申请号：US14025678

申请日：2013-09-12

Applicant: APPLIED Materials, Inc.

Inventor： Vincent Steffan Francischetti ,  Gregory J. Wilson ,  Kyle M. Hanson ,  Paul Wirth ,  Robert B. Moore

IPC: H05B3/68 ,  F26B19/00 ,  H01L21/324 ,  H01L21/67 ,  H01L21/677

CPC classification number: H01L21/324 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/677 ,  H01L21/67748

Abstract: An anneal module for annealing semiconductor material wafers and similar substrates reduces particle contamination and oxygen ingress while providing uniform heating including for 500° C. processes. The anneal module may include a process chamber formed in a metal body having internal cooling lines. A hot plate has a pedestal supported on a thermal choke on the body. A gas distributor in the lid over the hot plate flows gas uniformly over the wafer. A transfer mechanism moves a hoop to shift the wafer between the hot plate and a cold plate.

Abstract translation: 用于退火半导体材料晶片和类似衬底的退火模块减少了颗粒污染和氧气进入，同时提供包括500℃工艺的均匀加热。 退火模块可以包括形成在具有内部冷却线的金属体中的处理室。 热板具有支撑在身体上的热扼流圈上的基座。 热板上的盖子中的气体分布器将气体均匀地流过晶片。 传送机构移动环以在热板和冷板之间移动晶片。