公开(公告)号：US20090091889A1

公开(公告)日：2009-04-09

申请号：US11973518

申请日：2007-10-09

申请人： Todd P. Oman ,  Kevin M. Gertiser ,  Ronald M. Shearer

发明人： Todd P. Oman ,  Kevin M. Gertiser ,  Ronald M. Shearer

IPC分类号： H05K7/20

CPC分类号： H05K1/18 ,  H05K1/0209 ,  H05K2201/0949 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10515 ,  H05K2201/10522

摘要： A power electronic module includes heat generating power electronic devices mounted on a circuit board within a connector outline circumscribing circuit board through-holes for receiving pin terminals of a connector assembly. The power electronic devices are thermally and electrically coupled to the circuit board through-holes and connector pin terminals to dissipate heat generated by the power electronic devices.

摘要翻译： 电力电子模块包括安装在连接器轮廓外接电路板通孔内的电路板上的发热电力电子装置，用于接收连接器组件的针端子。 电力电子设备被热和电耦合到电路板通孔和连接器引脚端子，以散发由电力电子设备产生的热量。

公开(公告)号：US20090059470A1

公开(公告)日：2009-03-05

申请号：US12280692

申请日：2007-03-13

申请人： Kazuki Morita ,  Tatehiko Inoue ,  Shusaku Kawasaki ,  Toshiyuki Kitagawa ,  Tooru Ninomiya

发明人： Kazuki Morita ,  Tatehiko Inoue ,  Shusaku Kawasaki ,  Toshiyuki Kitagawa ,  Tooru Ninomiya

IPC分类号： H01G4/224

CPC分类号： H01G2/06 ,  H01G2/106 ,  H01G2/12 ,  H01G9/008 ,  H01G9/08 ,  H01G9/26 ,  H05K1/18 ,  H05K3/284 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/10015 ,  H05K2201/10295 ,  H05K2201/10424 ,  H05K2201/10446 ,  H05K2201/10462 ,  H05K2201/10606 ,  H05K2201/10962 ,  H05K2203/1361

摘要： According to the configuration and the manufacturing method of forming a moisture proof agent on both surfaces of a circuit substrate after soldering a capacitor connection pin in a vertical direction to the circuit substrate, and electrically connecting the capacitor so as to be in a perpendicular direction to the length direction of the capacitor connection pin at the upper space of the circuit substrate, the possibility of the moisture proof agent attaching to the capacitor is eliminated, the productivity enhances since the moisture proof agent can be easily formed on both surfaces of the circuit substrate, and a capacitor unit of miniaturized and low height configuration is realized since the capacitor is mounted in the horizontal direction in the upper space with respect to the circuit substrate.

摘要翻译： 根据在电容器连接引脚沿垂直方向焊接到电路基板之后，在电路基板的两面上形成防潮剂的结构和制造方法，并且将电容器电连接到与 在电路基板的上部空间处的电容器连接针的长度方向，与电容器连接的防潮剂的可能性被消除，由于可以容易地在电路基板的两个表面上形成防潮剂，因此提高了生产率 并且由于电容器相对于电路基板在上部空间中沿水平方向安装，所以实现了小型化和低高度配置的电容器单元。

公开(公告)号：US20080291647A1

公开(公告)日：2008-11-27

申请号：US12124933

申请日：2008-05-21

申请人： Hiroyuki HIROTA ,  Takashi HASEGAWA

发明人： Hiroyuki HIROTA ,  Takashi HASEGAWA

IPC分类号： H05K5/00 ,  H04M1/00

CPC分类号： H04M1/0277 ,  H04M1/0214 ,  H04M1/026 ,  H04M1/03 ,  H05K3/32 ,  H05K3/325 ,  H05K2201/10083 ,  H05K2201/1031 ,  H05K2201/10446 ,  H05K2201/10962 ,  Y02P70/611

摘要： A portable electronic device includes a case, a circuit board in the case, an electronic component in the case. The electronic component includes a connection terminal and a portion facing a side surface of the circuit board. The portable electronic device also includes a terminal member for connecting the circuit board and the connection terminal of the electronic component.

摘要翻译： 便携式电子设备包括壳体，壳体中的电路板，壳体中的电子部件。 电子部件包括连接端子和面向电路板的侧面的部分。 便携式电子设备还包括用于连接电路板和电子部件的连接端子的端子部件。

公开(公告)号：US20080285242A1

公开(公告)日：2008-11-20

申请号：US12103992

申请日：2008-04-16

申请人： Mikhail Charny ,  David J. Royle

发明人： Mikhail Charny ,  David J. Royle

IPC分类号： H05K1/02

CPC分类号： H05K1/0271 ,  H05K1/18 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10189 ,  H05K2201/10446

摘要： Printed circuit boards (PCB's) with edge connectors undergo bending stresses whenever the edge connectors are plugged into mating connectors. The bending stresses causes deformation of the printed circuit board, which can have deleterious effects on electrical components thereon. Slots are provided on the PCB to enable the portion of the PCB surrounding the edge connector to bend relative to the remainder of the PCB, thereby confine the bending to a localized area between the ends of the slots, and isolate the electrical components from any stresses caused thereby.

摘要翻译： 当边缘连接器插入配对连接器时，具有边缘连接器的印刷电路板（PCB）经受弯曲应力。 弯曲应力导致印刷电路板的变形，这可能对其上的电气部件产生有害影响。 在PCB上提供插槽以使围绕边缘连接器的PCB的部分相对于PCB的其余部分弯曲，从而将弯曲限制在狭槽的端部之间的局部区域，并且将电气部件与任何应力隔离 由此引起。

公开(公告)号：US07439449B1

公开(公告)日：2008-10-21

申请号：US10409837

申请日：2003-04-09

申请人： Dev E. Kumar ,  Giorgio Giaretta ,  Stefano Schiaffino ,  Donald A. Ice

发明人： Dev E. Kumar ,  Giorgio Giaretta ,  Stefano Schiaffino ,  Donald A. Ice

IPC分类号： H05K1/00

CPC分类号： H05K1/0253 ,  G02B6/4292 ,  H01L23/055 ,  H01L23/10 ,  H01L2924/0002 ,  H01S5/02212 ,  H01S5/02415 ,  H05K1/0203 ,  H05K1/0219 ,  H05K1/0393 ,  H05K1/141 ,  H05K1/147 ,  H05K3/3447 ,  H05K2201/10121 ,  H05K2201/10219 ,  H05K2201/10446 ,  H01L2924/00

摘要： Flexible printed circuit boards interconnect to adjacent electronic devices through one or more of high speed data, low speed data, high current, and ground lines and pads. The design of the high speed data pads and traces and adjacent ground pads and traces maintains a desired impedance in the flexible circuit and at the transition from the flexible circuit to a printed circuit board, a ceramic header, or other device to ensure high speed operation. The pads are preferably arranged in a two dimensional geometry such that a connecting area of the flexible circuit is narrower than it would preferably be if the pads were arranged linearly. The two dimensional array also allows the use of the high current thermoelectric cooler pads, which require large surface areas that may otherwise not fit in a conventional linear array.

摘要翻译： 柔性印刷电路板通过高速数据，低速数据，高电流和接地线和焊盘中的一个或多个互连到相邻电子器件。 高速数据焊盘和迹线以及相邻接地焊盘和迹线的设计在柔性电路中保持所需的阻抗，并且在柔性电路到印刷电路板，陶瓷集管或其他器件的过渡期间保持高速运行 。 垫优选地布置成二维几何形状，使得柔性电路的连接区域比优选地如果衬垫线性排列的那样较窄。 二维阵列还允许使用大电流热电冷却器垫，其需要大的表面积，否则其不适合常规线性阵列。

公开(公告)号：US20080250435A1

公开(公告)日：2008-10-09

申请号：US12073713

申请日：2008-03-07

申请人： Pyo Kim ,  Young-Sun Yoo ,  Dong-Woo Rhee ,  Sang-Kyu Lee

发明人： Pyo Kim ,  Young-Sun Yoo ,  Dong-Woo Rhee ,  Sang-Kyu Lee

IPC分类号： G11B17/03

CPC分类号： G11B33/12 ,  G11B33/123 ,  H05K1/0215 ,  H05K1/141 ,  H05K3/0061 ,  H05K3/3442 ,  H05K2201/09145 ,  H05K2201/09781 ,  H05K2201/10151 ,  H05K2201/10409 ,  H05K2201/10446 ,  H05K2203/167

摘要： An optical disk apparatus is disclosed which includes a first printed circuit board, on which a first circuit pattern is formed; a rotor, on which an optical disk may be placed, and which is electrically connected with the first circuit pattern; a second printed circuit board, which is stacked adjacent to the rotor on a surface of the first printed circuit board, and on which a second circuit pattern is formed; a sensor unit, which is mounted on the second printed circuit board in electrical connection with the second circuit pattern, and which is configured to sense a rotation of the optical disk; and a support plate, which supports the first printed circuit board and the rotor. In this optical disk apparatus, a separate printed circuit board can be utilized to support the sensor unit, whereby manufacturing costs can be reduced and working efficiency can be improved.

摘要翻译： 公开了一种光盘装置，其包括形成有第一电路图案的第一印刷电路板; 转子，其上可以放置光盘，并且与第一电路图案电连接; 第二印刷电路板，其在所述第一印刷电路板的表面上与所述转子相邻地堆叠，并且其上形成有第二电路图案; 传感器单元，其安装在与第二电路图案电连接的第二印刷电路板上，并且被配置为感测光盘的旋转; 以及支撑第一印刷电路板和转子的支撑板。 在该光盘装置中，可以使用单独的印刷电路板来支撑传感器单元，由此可以降低制造成本并且可以提高工作效率。

公开(公告)号：US20080237813A1

公开(公告)日：2008-10-02

申请号：US12049646

申请日：2008-03-17

申请人： Shoichi Chikamichi

发明人： Shoichi Chikamichi

IPC分类号： H01L23/00

CPC分类号： H05K1/0231 ,  H01L23/49838 ,  H01L23/50 ,  H01L2924/0002 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/10446 ,  H01L2924/00

摘要： A printed circuit board includes a source interconnect and a ground interconnect, and the circuit board has a two-dimensional geometry having a corner. Protruding portions are provided in circumferences of the source interconnect and the ground interconnect in regions except the corner in plan view, and the source interconnect and the ground interconnect are connected to a common first decoupling capacitor in each of the protruding portions.

摘要翻译： 印刷电路板包括源互连和接地互连，并且电路板具有具有拐角的二维几何形状。 在平面图中的角部以外的区域中，在源极互连和接地互连的周围设置突出部，并且源极互连和接地互连连接到每个突出部中的公共第一去耦电容器。

公开(公告)号：US20080198619A1

公开(公告)日：2008-08-21

申请号：US11798043

申请日：2007-05-09

申请人： Ming-Chuan Chen ,  Kuo-Ann Chu

发明人： Ming-Chuan Chen ,  Kuo-Ann Chu

IPC分类号： F21S4/00

CPC分类号： F21V19/0085 ,  G02F1/133604 ,  H05K3/325 ,  H05K2201/10113 ,  H05K2201/10393 ,  H05K2201/10446 ,  H05K2201/10916

摘要： A tube installation of a backlight module allowing fast and easy assembly and disassembly of tube without depending on a soldering process is comprised of a substrate, multiple tubes and a locating means; a terminal of each tube being provided with a conductor comprised of a first bending portion and a second bending portion with a terminal of the second bending portion serving as a contact portion; the locating means being placed below the substrate for the contact portion to contact the substrate so to secure the tube to where above the substrate.

摘要翻译： 背光模块的管装置包括：基板，多个管和定位装置，其能够快速且容易地组装和拆卸管而不依赖于焊接工艺。 每个管的端子设置有由第一弯曲部和第二弯曲部构成的导体，第二弯曲部的端子用作接触部; 所述定位装置被放置在所述基板的下方以使所述接触部分接触所述基板，从而将所述管固定到所述基板上方的位置。

公开(公告)号：US20080196929A1

公开(公告)日：2008-08-21

申请号：US12003225

申请日：2007-12-20

申请人： Hisashi Takamatsu ,  Takeshi Yamashita ,  Hideyuki Kuwano ,  Osamu Kagaya ,  Hiroyuki Arima

发明人： Hisashi Takamatsu ,  Takeshi Yamashita ,  Hideyuki Kuwano ,  Osamu Kagaya ,  Hiroyuki Arima

IPC分类号： H05K1/02

CPC分类号： G02B6/4201 ,  G02B6/4271 ,  G02B6/4277 ,  G02B6/4279 ,  G02B6/4281 ,  G02B6/4283 ,  H05K1/0219 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/0393 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/09663 ,  H05K2201/10121 ,  H05K2201/10446

摘要： An optical transmitter module is described. The optical transmitter module includes a lead pin for electrically connecting the inside and outside of a housing, and a flexible printed circuit board connected to the lead pin. The flexible printed circuit board has a signal pattern and two ground conductor patterns to be connected to an optical modulation element, a laser terminal pattern to be connected to a semiconductor laser, a Peltier terminal pattern to be connected to a Peltier element, and two covering conductive layers in addition to a layer on which such patterns are formed. The covering conductive layers cover all the patterns except for the signal pattern.

摘要翻译： 描述了光发射机模块。 光发射机模块包括用于电连接壳体的内部和外部的引脚和连接到引脚的柔性印刷电路板。 柔性印刷电路板具有要连接到光调制元件的信号图案和两个接地导体图案，要连接到半导体激光器的激光端子图案，要连接到珀耳帖元件的珀耳帖端子图案，以及两个覆盖 除了形成这种图案的层之外的导电层。 覆盖导电层覆盖除了信号图案之外的所有图案。

公开(公告)号：US20080158474A1

公开(公告)日：2008-07-03

申请号：US11743310

申请日：2007-05-02

申请人： Jaemo Chung ,  Jinhee Sung ,  Sunghwan Kim

发明人： Jaemo Chung ,  Jinhee Sung ,  Sunghwan Kim

IPC分类号： G02F1/1335 ,  G02F1/13

CPC分类号： H05K1/0274 ,  G02F1/133615 ,  G02F1/13452 ,  H05K1/189 ,  H05K2201/0112 ,  H05K2201/10106 ,  H05K2201/10446

摘要： A flexible circuit board of a liquid crystal display device includes a first insulating film, a plurality of conductive patterns formed on the first insulating film, a second insulating film formed on the first insulating film to cover the conductive pattern, a plurality of light sources coupled to the conductive pattern, and an upper light absorbing layer formed on an outer circumference of the light source to absorb light emitted from the light source, wherein the upper light absorbing layer is formed in a triangle shape on one side of the light source.

摘要翻译： 液晶显示装置的柔性电路板包括第一绝缘膜，形成在第一绝缘膜上的多个导电图案，形成在第一绝缘膜上以覆盖导电图案的第二绝缘膜，多个光源耦合 以及形成在光源的外周上的上光吸收层，以吸收从光源发射的光，其中上光吸收层在光源的一侧形成三角形形状。