摘要:
Disclosed is a Cu—Fe—P alloy capable of enabling high strength, high electrical conductivity, and excellent softening resistance to coexist. The Cu—Fe—P alloy is suitable for use as a constituent material of a lead frame for a semiconductor device. With the Cu—Fe—P alloy with strength rendered higher by micronizing Fe-containing compounds, when enhancing softening resistance by increasing Sn content so as to exceed 0.5 mass %, at least one element selected from the group consisting of Ni, Mg, Ca, Al, Si, and Cr, in trace amounts, are caused to be additionally contained to thereby check cracking likely to occur at the time of forging and hot rolling in a process of producing the copper alloy, as a result of an increase in the Sn content.
摘要:
The invention describes a friction bearing with a steel support shell and a lead-free bearing metal layer on the basis of copper with the main alloy elements of tin and zinc, which layer is applied to the support shell. In order to combine advantageous sliding properties with favorable mechanical resilience it is proposed that the bearing metal layer has a share of tin of 2.5 to 11% by weight and a share of zinc of 0.5 to 5% by weight, with the sum total of the shares of tin and zinc being between 3 and 13% by weight.
摘要:
Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu, or other materials and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.
摘要:
An alloy, especially for spectacle frames, jewelry and for other metal parts to be worn on the body or on items of clothing in contact with said body. The alloy consists of the following components: Sn 8-14 wt. %, Zn 1-8 wt. %, Mn 0.001-3 wt. %, P 0.001 0.3 wt. %, Fe 0.001 0.5%, the remainder being Cu.
摘要:
Brass consists essentially of Cu, Sn, Bi, Fe, Ni and P in weight ratios respectively of 58.0-63.2%, 0.3-2.0%, 0.7-2.5%, 0.05-0.3%, 0.10-0.50% and 0.05-0.15% plus the balance of Zn and unavoidable impurities to exhibit excellent tolerance for dezincification, hot forgeability and machinability.
摘要:
A copper base alloy consisting essentially of tin in an amount from about 1.0 to 11.0% by weight, phosphorous in an amount from about 0.01 to 0.35% by weight, iron in an amount from about 0.01 to about 0.8% by weight, and the balance essentially copper, including phosphide particles uniformly distributed throughout the matrix, is described. The alloy is characterized by an excellent combination of physical properties. The process of forming the copper base alloy described herein includes casting, homogenizing, rolling, process annealing and stress relief annealing.
摘要:
Lead-free metallurgy powder for use in manufacturing a shaped bronze part by powder metallurgy techniques which consists essentially of a substantially homogeneous blend of metal powders having about 90 parts copper, about 10 parts tin and an amount of bismuth in the range from an amount effective to improve the machinability of the shaped bronze part up to about 5% weight are disclosed. Lead-free metallurgy powder for use in manufacturing a shaped brass part by powder metallurgy techniques which consists essentially of a substantially homogeneous blend of metal powders about 70-90 parts copper, about 10-30 parts zinc and an amount of bismuth in the range from an amount effective to improve the machinability of the shaped brass part up to about 5% weight are also disclosed.
摘要:
A copper base alloy for terminals that is of the Cu-Ni-Sn-P or Cu-Ni-Sn-P-Zn system and that has a tensile strength of at least 50 kgf/mm.sup.2, a spring limit of at least 40 kgf/mm.sup.2, a stress relaxation of not more than 10% and a conductivity of at least 30% IACS is provided. Terminals the spring portion or the entire part of which is produced from that copper base alloy, having an insertion/extraction force of 0.2-3 kgf and a resistance of not more than 3 m.OMEGA. at low voltage and current as initial performance, with the added characteristic that the terminals will experience not more than 20% stress relaxation are also provided. The alloy is superior to the conventional bronze, phosphor bronze and Cu-Sn-Fe-P alloys for terminals in terms of tensile strength, spring limits, stress relaxation characteristic and conductivity and, hence, the terminals manufactured from those alloys have higher performance and reliability than the terminals made of the conventional copper base alloys for terminals.
摘要翻译:用于Cu-Ni-Sn-P或Cu-Ni-Sn-P-Zn系的端子用铜基合金,其拉伸强度为至少50kgf / mm 2,弹簧极限为至少40kgf / mm2,应力松弛不大于10%,电导率至少为30%IACS。 端子弹簧部分或其整个部分由该铜基合金制成,其具有0.2-3kgf的插入/拉伸力和在低电压和电流下不超过3m欧姆电阻作为初始性能,其中 还提供了终端将经历不超过20%的应力松弛的特征。 在拉伸强度,弹簧极限,应力松弛特性和导电性方面,该合金优于常规的青铜,磷青铜和Cu-Sn-Fe-P合金,因此,由这些合金制造的端子具有更高的性能和 可靠性高于由常规铜基合金端子制成的端子。
摘要:
A slide bearing comprising a copper-nickel-tin alloy consisting essentially of______________________________________ 4-8% by wt nickel, 4-8% by wt tin, 0.005-1.0 by wt zinc, 0.005-0.5 by wt iron, 0.005-1.0 by wt lead, ______________________________________ the remainder being copper and common impurities, the alloy having a multi-phase granular state with a preferred linear orientation and including:at least one of discontinuous gamma phase precipitations and continuous gamma phase precipitations, the precipitations being formed followed cold forming of the alloy by heat treatment at a temperature of 300.degree. to 450.degree. C. for 10 minutes to 50 hours so as to provide about 0.1 to about 30 volume % of the gamma phase in the alloy,up to 15 volume % of highly concentrated tin and nickel grain areas (GSnNi) characterized by the atomic formula Cu.sub.43 Ni.sub.17 Sn.sub.40,up to 15 volume % of highly concentrated tin and nickel grain areas (GSn) characterized by the atomic formula Cu.sub.80 Ni.sub.6 Sn.sub.14,a highly concentrated lead-containing phase, andthe remainder a mixed copper crystal.
摘要:
Worm gearing having improved wear and strength properties comprises a Cu, 8.0-13.0 w/o Sn, 3.5-5.0 w/o Ni alloy aged in the as-cast condition to strengthen the dendritic microstructural constituent (e.g., alpha phase) while retaining the as-cast, relatively hard interdendritic constituents. The overall Ni concentration of the alloy does not exceed about 5 w/o and the Ni concentration across individual as-cast dendrites is decreased at the dendrite edges (grain boundaries) to hinder formation of a discontinuous, embrittling grain boundary product that is deleterious to these properties.