利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

123 条记录 (耗时 0.04 秒)

    Semiconductor optical amplifier and optical module using the same
    111.
    发明申请
    Semiconductor optical amplifier and optical module using the same 有权
    半导体光放大器和光模块使用相同

    公开(公告)号：US20060165363A1

    公开(公告)日：2006-07-27

    申请号：US11375466

    申请日：2006-03-13

    申请人： Hiroyuki Kamiyama ,  Kenji Uchida ,  Seiji Sumi

    发明人： Hiroyuki Kamiyama ,  Kenji Uchida ,  Seiji Sumi

    IPC分类号： G02B6/10 ,  H01S3/00

    CPC分类号： H01S5/026 ,  H01S5/0262 ,  H01S5/50

    摘要： The present invention provides a polarization dependency-free, gain-saturated high function semiconductor optical amplifier and optical module at industrially low cost. The gist of the present invention is to structurally separate the optical signal propagating waveguide from another optical waveguide which serves as a lasing optical cavity for optical amplification in such a manner that the two optical waveguides are formed in the same plane but not parallel to each other.

    摘要翻译： 本发明提供了一种无偏振无关，增益饱和的高功能半导体光放大器和光模块，工业成本低。 本发明的要点是将光信号传播波导与用作光放大的激光光学腔的另一光波导结构地分开，使得两个光波导形成在同一平面上但不彼此平行 。

    Semiconductor optical device and manufacturing method thereof
    112.
    发明申请
    Semiconductor optical device and manufacturing method thereof 有权
    半导体光学器件及其制造方法

    公开(公告)号：US20050286828A1

    公开(公告)日：2005-12-29

    申请号：US11031003

    申请日：2005-01-10

    申请人： Yasushi Sakuma ,  Katsuya Motoda ,  Kenji Uchida ,  Ryu Washino

    发明人： Yasushi Sakuma ,  Katsuya Motoda ,  Kenji Uchida ,  Ryu Washino

    IPC分类号： G02B6/12 ,  G02B6/136 ,  H01L21/3065 ,  H01L31/10 ,  H01S5/223

    CPC分类号： G02B6/136 ,  G02B2006/12097

    摘要： In a dry etching step for an organic material film, a fluorine-containing member is disposed to the periphery of a semiconductor substrate disposed on a lower electrode or a tray for wafer transportation to form fluorine (fluoro-radicals) from the member per se in addition to the fluoric gas added to the etching gas, with a purpose of removing reaction products, thereby removing reaction products deposited on the semiconductor substrate efficiently and stably.

    摘要翻译： 在有机材料膜的干式蚀刻工序中，在设置在下部电极或用于晶片输送的托盘上的半导体基板的周围配置含氟部件，从该部件本身形成氟（氟自由基） 除了添加到蚀刻气体中的氟气外，还具有去除反应产物的目的，从而有效且稳定地除去沉积在半导体衬底上的反应产物。

    Solid-state imaging device, semiconductor wafer and camera module
    114.
    发明申请
    Solid-state imaging device, semiconductor wafer and camera module 审中-公开
    固态成像装置，半导体晶片和相机模块

    公开(公告)号：US20050264677A1

    公开(公告)日：2005-12-01

    申请号：US11143700

    申请日：2005-06-01

    申请人： Kenji Uchida

    发明人： Kenji Uchida

    IPC分类号： H01L27/14 ,  H01L31/0203 ,  H04N5/225 ,  H04N5/335 ,  H04N5/372 ,  H04N5/374

    CPC分类号： H01L27/14618 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14649 ,  H01L2224/48091 ,  H01L2924/16235 ,  H01L2924/00014

    摘要： A light-permeable lid provided oppositely to a photodetector of a solid-state imaging element includes a glass substrate, and an infrared-ray shielding film formed on one side of the glass substrate. The light-permeable lid is disposed so that the side of the light-permeable lid (glass substrate) forming the infrared-ray shielding film is positioned at the opposite side of the side facing the photodetector of the solid-state imaging element. If dust mixes in the infrared-ray shielding film or dust deposits to the film, since the distance from the photodetector to dust (infrared-ray shielding film) is longer, the photodetector is less susceptible to adverse influence of the dust and occurrence of defect due to the dust can be decreased.

    摘要翻译： 与固态成像元件的光电检测器相对设置的透光性盖包括玻璃基板和形成在玻璃基板一侧的红外线屏蔽膜。 透光性盖被配置为使形成红外线屏蔽膜的透光性盖（玻璃基板）的一侧位于与固体摄像元件的光检测器相对的一侧的相对侧。 如果红外线屏蔽膜中的灰尘混合或灰尘沉积到膜上，由于从光电检测器到灰尘（红外线屏蔽膜）的距离较长，因此光电检测器不易受到灰尘的不利影响和缺陷的发生 由于灰尘可以减少。

    Optical semiconductor device increasing productivity and method of fabricating the same
    115.
    发明授权
    Optical semiconductor device increasing productivity and method of fabricating the same 有权
    提高生产率的光学半导体器件及其制造方法

    公开(公告)号：US06829266B2

    公开(公告)日：2004-12-07

    申请号：US10406719

    申请日：2003-04-03

    申请人： Kenji Uchida ,  Koki Hirasawa

    发明人： Kenji Uchida ,  Koki Hirasawa

    IPC分类号： H01S304

    CPC分类号： H01S5/02244 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01S5/02212 ,  H01S5/02248 ,  H01S5/0683 ,  H01S5/4031 ,  H01S5/4087 ,  H01L2924/00014

    摘要： An optical semiconductor device includes: an insulating base; and a lead structure which further includes: a flange supported on a first surface of the insulating base; at least a first type lead supported by the insulating base; at least an island for mounting at least an optical semiconductor element thereon, which is electrically connected to the at least first type lead; and at least a connection part extending between the at least island and the flange. The flange, the at least connection part, and the at least island comprise a single united part of the lead structure. The flange, the at least connection part, the at least island, and the at least first type lead comprise a same conductive material.

    摘要翻译： 光学半导体器件包括：绝缘基底; 以及引线结构，其还包括：支撑在所述绝缘基底的第一表面上的凸缘; 至少一个第一类型的引线，由绝缘基座支撑; 至少一个用于至少安装光学半导体元件的岛，其至少与第一类型的引线电连接; 以及至少在至少岛和凸缘之间延伸的连接部分。 凸缘，至少连接部分和至少岛包括引线结构的单一组合部分。 凸缘，至少连接部分，至少岛和至少第一类型的引线包括相同的导电材料。

    Optoelectronic devices
    119.
    发明授权
    Optoelectronic devices 失效
    光电器件

    公开(公告)号：US5157679A

    公开(公告)日：1992-10-20

    申请号：US642006

    申请日：1991-01-16

    申请人： Masahiko Kondow ,  Toshihiro Kawano ,  Shigekazu Minagawa ,  Shin Satoh ,  Kenji Uchida ,  Toshiaki Tanaka ,  Takashi Kajimura

    发明人： Masahiko Kondow ,  Toshihiro Kawano ,  Shigekazu Minagawa ,  Shin Satoh ,  Kenji Uchida ,  Toshiaki Tanaka ,  Takashi Kajimura

    IPC分类号： H01L33/00 ,  H01L33/16 ,  H01S5/20 ,  H01S5/223 ,  H01S5/30 ,  H01S5/32 ,  H01S5/323

    CPC分类号： H01L33/16 ,  H01L33/0062 ,  H01S5/32325 ,  H01S5/2059 ,  H01S5/2231 ,  H01S5/305 ,  H01S5/3202

    摘要： An optielectronic device comprising a substrate crystal whose crystal plane is a (n11) plane tilted from the (100) plane toward the [110] direction, or [110] direction where (n>1). When the substrate is applied to an AlGaInP semiconductor laser, the optical device can be cleaved into a rectangular shape, as in the case of a (100) substrate crystal, resulting in easy handling of the chips and also is effective for making the lasting wavelength shorter, lowering the threshold current density for lasing, improving the continuous lasing temperature, etc. Furthermore, semiconductor lasers of different lasing wavelengths can be prepared under good control. Furthermore, a doping efficiency having no dependence on a tilt angle can be obtained by proper selection of a dopant. For example, Si is suitable as an n-type dopant entering sites of group III atom on an (n11) A plane (n.gtoreq.2).

    摘要翻译： 一种光电装置，其包括晶体面，其晶面是从（100）面朝向[110]方向或（110）方向倾斜的（n11）面，其中（n> 1）。 当将衬底施加到AlGaInP半导体激光器时，如在（100）衬底晶体的情况下，光学器件可以被切割成矩形形状，从而易于处理芯片，并且对于使持久波长有效 更短，降低激光器的阈值电流密度，改善连续激光温度等。此外，可以在良好的控制下制备不同激光波长的半导体激光器。 此外，通过适当选择掺杂剂可以获得不依赖于倾斜角的掺杂效率。 例如，Si适合作为在（n11）A平面（n> = = 2）上进入III族原子的位置的n型掺杂剂。

    Method for mounting electronic parts on printed boards
    120.
    发明授权
    Method for mounting electronic parts on printed boards 失效
    将电子部件安装在印刷电路板上的方法

    公开(公告)号：US4980970A

    公开(公告)日：1991-01-01

    申请号：US523415

    申请日：1990-05-15

    申请人： Kenji Uchida ,  Kiyomi Ohkubo ,  Makoto Matumoto

    发明人： Kenji Uchida ,  Kiyomi Ohkubo ,  Makoto Matumoto

    IPC分类号： B23P21/00 ,  H05K13/00

    CPC分类号： H05K13/0053 ,  Y10T29/49131 ,  Y10T29/49137 ,  Y10T29/53004 ,  Y10T29/53091 ,  Y10T29/53178

    摘要： A method for mounting electronic parts on a printed board using a computer, an optical indicator controlled by the computer to optically indicate a position of insertion on the printed board into which an electronic part is to be inserted, and a parts locator having a plurality of pockets and controlled by the computer to rotate and open only one pocket is disclosed. Parts taken out at random from a parts box are put into opened pockets of a parts locator, or after the parts are inserted into the positions of insertion on the printed board indicated by the optical indicator, the remaining parts are put into the opened pockets of the parts locator. Subsequent mounting work can be performed only by taking out the parts from the pockets of the parts locator and inserting the parts into the optically indicated positions.