公开(公告)号：US20050244621A1

公开(公告)日：2005-11-03

申请号：US11117505

申请日：2005-04-29

申请人： Kunio Arai ,  Haruo Akahoshi

发明人： Kunio Arai ,  Haruo Akahoshi

IPC分类号： B32B3/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/06 ,  H05K3/42 ,  H05K3/46

CPC分类号： H05K3/4679 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/06 ,  H05K3/062 ,  H05K3/421 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0112 ,  H05K2201/09845 ,  H05K2201/09918 ,  H05K2203/0315 ,  H05K2203/0346 ,  H05K2203/0554 ,  Y10T428/24917

摘要： The invention is to provide a printed circuit board in which advance of packaging density of the printed circuit board and reduction in production cost can be attained while processing quality can be made uniform, a method for processing the printed circuit board and a method for producing the printed circuit board. There is provided a printed circuit board including an alternate laminate of electric conductor layers and electrically insulating layers, wherein a coating layer capable of absorbing laser light but insoluble in an etching solution dissolving the electric conductor layers is provided on a front surface of a first one of the electric conductor layers. In this case, the coating layer may be provided on a front surface of a rear one of the electric conductor layers. Each of the electric conductor layers may contain Cu as a main component while the coating layer may contain CuO as a main component. The coating layer may have a thickness not thinner than 0.6 μm.

摘要翻译： 本发明提供一种印刷电路板，其中能够使加工质量均匀的印刷电路板的封装密度的提高和生产成本的降低，印刷电路板的处理方法和制造方法 印刷电路板。 提供了一种印刷电路板，其包括导电层和电绝缘层的交替叠层，其中在第一个的前表面上设置有能够吸收激光但不溶于溶解导电层的蚀刻溶液的涂层 的导电层。 在这种情况下，涂层可以设置在后导体层的前表面上。 每个导电体层可以包含Cu作为主要成分，而涂层可以包含CuO作为主要成分。 涂层可以具有不小于0.6μm的厚度。

公开(公告)号：US06884962B2

公开(公告)日：2005-04-26

申请号：US10385801

申请日：2003-03-11

申请人： Todd E. Lizotte

发明人： Todd E. Lizotte

IPC分类号： B23K26/06 ,  B23K26/073 ,  G02B27/09

CPC分类号： B23K26/066 ,  B23K26/0734 ,  B33Y30/00 ,  G02B27/09 ,  G02B27/0927 ,  G02B27/0944 ,  G02B27/0955

摘要： An improved beam for use in ablating a surface to be processed. The improved beam front has a profile with a plurality of undulation and the plurality of undulations define a plurality of annular peaks and annular valleys. An intensity of each annular peak is about 10 percent greater than an intensity of each annular valley whereby the undulation of the improved beam facilitates formation of a substantially uniform feature in the surface to be processed. A method of utilizing an improved beam to form the desired feature in a surface to be processed is also disclosed. To reduce energy losses, a fourier transform is performed on the supplied laser beam. Before striking the surface, this beam passes through a focusing lens which performs a reverse fourier transform and retransforms the wave front substantially back to its originally wave form and intensity.

摘要翻译： 用于烧蚀待处理表面的改进梁。 改进的光束前端具有多个起伏的轮廓，并且多个波纹限定多个环形峰和环形谷。 每个环形峰的强度比每个环形谷的强度大约10％，由此改进的光束的起伏有助于在待处理的表面中形成基本均匀的特征。 还公开了一种利用改进光束在待处理表面中形成期望特征的方法。 为了减少能量损失，对所提供的激光束进行傅立叶变换。 在撞击表面之前，该光束通过聚焦透镜，该聚焦透镜执行反向光栅变换，并将波前面基本上重新恢复到原来的波形和强度。

公开(公告)号：US20040217093A1

公开(公告)日：2004-11-04

申请号：US10854214

申请日：2004-05-27

申请人： Hitachi Via Mechanics, Ltd.

发明人： Kunio Arai ,  Kazuhisa Ishii

IPC分类号： B23K026/00 ,  B23K026/14

CPC分类号： B23K26/0846 ,  B23K26/18 ,  B23K26/382 ,  B23K26/40 ,  B23K2101/35 ,  B23K2103/12 ,  B23K2103/172 ,  B23K2103/42 ,  B23K2103/50 ,  H05K1/0393 ,  H05K3/0038 ,  H05K2201/0394 ,  H05K2203/0156 ,  H05K2203/1545 ,  Y10T156/1158 ,  Y10T156/19

摘要： There is provided a laser drilling method that prevents hanging, expansion, or crinkles of copper foil caused when an ultraviolet laser beam that requires no surface roughening is used for a thin double-sided copper-clad film. The drilling method of the copper-clad film comprises the steps of: using an ultraviolet laser as a laser beam; drilling after bonding a resin film to the backside of the film which is the opposite side to the laser-beam-incidence; and delaminating the resin film on the backside after drilling. The resin film bonded to the backside prevents the copper foil from hanging, thus allowing the laser beam to be efficiently applied to the copper foil, and allowing the copper foil to be completely removed by ablation. In the case of a blind hole, the resin film bonded to the backside prevents expansion of the copper foil. Crinkles can be also prevented.

摘要翻译： 提供了一种激光打孔方法，当不需要表面粗糙化的紫外线激光束用于薄的双面覆铜膜时，防止铜箔的悬挂，膨胀或皱缩。 铜包膜的钻孔方法包括以下步骤：使用紫外线激光器作为激光束; 在将树脂膜粘合到与激光束入射的相反侧的膜的背面之后进行钻孔; 并在钻孔后在背面剥离树脂膜。 结合到背面的树脂膜防止铜箔悬垂，从而允许激光束有效地施加到铜箔上，并且通过烧蚀使铜箔完全去除。 在盲孔的情况下，结合到背面的树脂膜防止铜箔膨胀。 也可以防止皱纹。

公开(公告)号：US20040129685A1

公开(公告)日：2004-07-08

申请号：US10740817

申请日：2003-12-22

申请人： HITACHI VIA MECHANICS, LTD.

发明人： Kunio Arai ,  Kenji Suzuki

IPC分类号： B23K026/38 ,  B23K026/067

CPC分类号： B23K26/0673 ,  B23K26/064 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/067 ,  B23K26/082 ,  B23K26/382 ,  B23K2103/50 ,  H05K3/0026

摘要： Provided is a multi-beam laser drilling apparatus for drilling a workpiece, simultaneously at two positions while telecentric errors are suppressed, in which a conventional optical system in which galvanometer mirrors are used for a first laser beam, and a galvanometer-mirror system is located close to an fnull lens in order to prevent occurrence of telecentric error. A second laser beam which has been deflected by a second galvanometer-mirror system, transmits through a polarized beam mixers and is incident upon the first galvanometer-mirror system and the fnull lens, and accordingly, the workpiece is drilled simultaneously at two positions with the use of both first and second laser beams.

摘要翻译： 本发明提供一种多光束激光钻孔装置，用于在远心误差被抑制的同时位于两个位置的同时进行钻孔，其中将检流计镜用于第一激光束的常规光学系统和电流计镜系统位于 靠近ftheta镜头，以防止发生远心错误。 已经被第二电流计反射镜系统偏转的第二激光束透射通过偏振光束混合器并且入射到第一电流计反射镜系统和透镜上，因此在两个位置上同时钻出工件 使用第一和第二激光束。

公开(公告)号：US20020152619A1

公开(公告)日：2002-10-24

申请号：US09840062

申请日：2001-04-24

申请人： Hitachi Via Mechanics, Ltd.

发明人： Yasushi Ito ,  Akira Irie

IPC分类号： G01B005/004

CPC分类号： H05K13/0452 ,  H05K3/0047 ,  H05K3/0097 ,  H05K13/0406 ,  H05K13/0409

摘要： A printed circuit board processing machine has: a table that can travel in a X-direction carrying a printed circuit board thereon; a cross rail arranged so as to straddle the table; a plurality of sliders supported for independently movement in a Y-direction by the cross rail; a plurality of spindles supported for movement in a Z-direction by the sliders; a magnetic rail of a linear-motor fixed to the cross rail; and a plurality of coils of the linear-motor fixed to the sliders so as to oppose the magnetic rail.

摘要翻译： 印刷电路板加工机具有：能够在其上携带印刷电路板的X方向上行进的工作台; 一个跨轨道，以便跨越桌子; 多个滑块，用于通过横梁独立地在Y方向上移动; 多个主轴通过滑块支撑在Z方向上移动; 固定在横梁上的线性马达的磁轨; 以及固定到所述滑动件上以与所述磁轨相对的所述线性电动机的多个线圈。

公开(公告)号：US3881148A

公开(公告)日：1975-04-29

申请号：US31014372

申请日：1972-11-28

申请人： HITACHI SEIKO KK

发明人： MIZUHARA YASUSHI ,  KIKUMOTO TAKASHI ,  ABE TSUWAO ,  HITOMI HIROYUKI ,  OCHIAI MASAYASU ,  ITOH TUGUAKI

IPC分类号： B23H3/02 ,  B23H5/00 ,  H02M7/40

CPC分类号： B23H3/02

摘要： A power supply for an electrical processing apparatus of the kind having means for applying electrical power across the work gap between an electrode and a workpiece disposed opposite to each other, means for supplying an electrolyte to the work gap, and means for moving the electrode and workpiece toward each other in their relative positions thereby processing the workpiece into a desired shape. The power supply comprises transformer means and rectifying means for obtaining the electrical power, means for holding the peak value of the output voltage of the rectifying means in the form of a d.c. voltage, and means for renewing the d.c. voltage in such a manner that a d.c. voltage level is established in the voltage holding means corresponding to the peak values of successive waveform portions whereby the peak value of the required working voltage can be reduced, undesirable spark discharge between the electrode and the workpiece can be prevented, and the precision of electrical processing can be remarkably improved.

摘要翻译： 一种用于电加工设备的电源，具有用于在电极和彼此相对设置的工件之间的工作间隙上施加电力的装置，用于向工作间隙供应电解质的装置，以及用于使电极和 工件在其相对位置彼此相对移动，从而将工件加工成所需的形状。 电源包括用于获得电力的变压器装置和整流装置，用于以直流形式保持整流装置的输出电压的峰值的装置。 电压，以及更新直流电的方式。 电压以这样的方式 在电压保持装置中建立对应于连续波形部分的峰值的电压电平，由此可以减少所需工作电压的峰值，并且可以防止电极和工件之间的不期望的火花放电，并且电加工的精度 可以显着提高。

公开(公告)号：US2197513A

公开(公告)日：1940-04-16

申请号：US23558038

申请日：1938-10-18

申请人： BELL TELEPHONE LABOR INC

发明人： BARDSLEY JOSEPH R

IPC分类号： H02B5/02

CPC分类号： H02B5/02

公开(公告)号：US10350704B2

公开(公告)日：2019-07-16

申请号：US15418174

申请日：2017-01-27

申请人： Via Mechanics, Ltd.

发明人： Haruaki Otsuki ,  Kyosuke Suzuki ,  Satoshi Fukushima

IPC分类号： B23K26/035 ,  B23K26/08 ,  B23K26/402 ,  B23K26/082 ,  B23K26/0622 ,  B23K26/382 ,  B23K101/36 ,  B23K101/42

摘要： The object of the present invention is to achieve the combination processing that accelerates the processing speed while keeping the accuracy of finishing. In the combination processing consisting combination of stationary processing and synchronization processing, the processing of the section in the rows in an processing area is performed from a first end to a second end of a row, and then from the second end to the first end of the next row so that the processing is performed from side to side. The stationary processing is performed in sections having relatively low processing densities and the synchronization processing is performed in the other sections than the sections for the stationary processing.

公开(公告)号：US20180318965A1

公开(公告)日：2018-11-08

申请号：US15956094

申请日：2018-04-18

申请人： Via Mechanics, Ltd.

发明人： Kaori TATEISHI ,  Yasushi ITO

IPC分类号： B23K26/386 ,  B23K26/40 ,  C03C23/00 ,  C03C15/00

CPC分类号： B23K26/386 ,  B23K26/0622 ,  B23K26/18 ,  B23K26/384 ,  B23K26/40 ,  B23K26/402 ,  B23K2103/54 ,  C03B33/02 ,  C03C15/00 ,  C03C23/0025

摘要： Provided is a laser processing method for drilling a hole in a glass substrate with using a carbon dioxide laser, including the steps of: irradiating the laser onto a drilling position on the glass substrate from a side of the glass substrate on which a protective sheet is adhered so as to form a blind hole; removing the protective sheet from the glass substrate and performing an annealing treatment; and performing a wet-etching process on a side of the glass substrate not irradiated with the laser so as to convert the blind hole into a through hole.

公开(公告)号：US08319147B2

公开(公告)日：2012-11-27

申请号：US11525154

申请日：2006-09-22

申请人： Kunio Arai

发明人： Kunio Arai

IPC分类号： B23K26/38

CPC分类号： B23K26/067 ,  B23K26/389

摘要： There is provided a laser machining method and a laser machining apparatus whose machining accuracy and quality excel without lowering machining efficiency. One hole is machined by a split beam that is a first pulsed laser beam and another split beam that is a second pulsed laser beam whose irradiation position is determined based on irradiation position of the first laser beam. In this case, the machining quality may be improved by machining the circular hole by equalizing circling directions and angular velocity of the split beams. A beam splitter splits a laser beam outputted out of one laser oscillator into the split beams and AOMs can time-share them.

摘要翻译： 提供了一种激光加工方法和激光加工装置，其加工精度和质量优异，而不降低加工效率。 一个孔由作为第一脉冲激光束的分束和另一个分割光束加工，该分束是第二脉冲激光束，其照射位置是基于第一激光束的照射位置确定的。 在这种情况下，通过使分割光束的旋转方向和角速度相等来加工圆形孔，可以提高加工质量。 分束器将从一个激光振荡器输出的激光束分成分束，并且AOM可以分时分配。