公开(公告)号：US12283647B2

公开(公告)日：2025-04-22

申请号：US18444277

申请日：2024-02-16

Applicant: Applied Materials, Inc.

Inventor： Yingdong Luo ,  Daihua Zhang ,  Hou T. Ng ,  Sivapackia Ganapathiappan ,  Nag B. Patibandla

IPC: H01L33/50 ,  H01L27/15 ,  H01L33/30

Abstract: A photocurable composition includes quantum dots, quantum dot precursor materials, a chelating agent, one or more monomers, and a photoinitiator. The quantum dots are selected to emit radiation in a first wavelength band in the visible light range in response to absorption of radiation in a second wavelength band in the UV or visible light range. The second wavelength band is different than the first wavelength band. The quantum dot precursor materials include metal atoms or metal ions corresponding to metal components present in the quantum dots. The chelating agent is configured to chelate the quantum dot precursor materials. The photoinitiator initiates polymerization of the one or more monomers in response to absorption of radiation in the second wavelength band.

公开(公告)号：US12243864B2

公开(公告)日：2025-03-04

申请号：US18511865

申请日：2023-11-16

Applicant: Applied Materials, Inc.

Inventor： Lisong Xu ,  Byung Sung Kwak ,  Mingwei Zhu ,  Hou T. Ng ,  Nag B. Patibandla ,  Christopher Dennis Bencher

IPC: H01L25/16 ,  H01L25/075 ,  H01L33/00 ,  H01L33/44 ,  H01L33/48 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L33/32

Abstract: A display screen includes a backplane, an array of light-emitting diodes electrically integrated with the backplane, the array of light-emitting diodes configured to emit UV light in a first wavelength range, and a plurality of isolation walls formed on the backplane between adjacent light-emitting diodes of the array of light-emitting diodes with the isolation walls spaced apart from the light-emitting diodes and extending above the light-emitting diodes. The plurality of isolation walls include a core of a first material and a coating covering at least a portion of the core extending above the light-emitting diodes. The coating is an opaque second material having transmittance less than 1% of light in the first wavelength range.

公开(公告)号：US12237445B2

公开(公告)日：2025-02-25

申请号：US17692012

申请日：2022-03-10

Applicant: Applied Materials, Inc.

Inventor： Hou T. Ng ,  Nag B. Patibandla ,  Giorgio Cellere ,  Daihua Zhang

IPC: H01L21/00 ,  B29D11/00 ,  G02B5/28 ,  H01L25/075 ,  H01L33/50 ,  G03F7/00 ,  G03F7/039

Abstract: A method of fabricating a multi-color display includes forming a host matrix over a display having an array of light emitting diodes. The host matrix is sensitive to ultraviolet light. A first plurality of light emitting diodes in a first plurality of wells are activated to illuminate a portion of the host matrix to cause the portion of the host matrix to develop internal porous structures. A first photo-curable fluid including a first color conversion agent is dispensed. The first plurality of light emitting diodes in the first plurality of wells are activated to illuminate and cure the first photo-curable fluid to form a first color conversion layer over each of the first plurality of light emitting diodes, and an uncured remainder of the first photo-curable fluid is removed.

公开(公告)号：US20240194837A1

公开(公告)日：2024-06-13

申请号：US18586175

申请日：2024-02-23

Applicant: Applied Materials, Inc.

Inventor： Yingdong Luo ,  Lisong Xu ,  Sivapackia Ganapathiappan ,  Hou T. Ng ,  Byung Sung Kwak ,  Mingwei Zhu ,  Nag B. Patibandla

IPC: H01L33/50 ,  C09K11/02 ,  C09K11/06 ,  H01L33/00

CPC classification number: H01L33/504 ,  C09K11/025 ,  C09K11/06 ,  H01L33/005 ,  C09K2211/1007 ,  C09K2211/1011 ,  C09K2211/1014 ,  C09K2211/1029 ,  C09K2211/1033 ,  C09K2211/1037 ,  C09K2211/1044 ,  C09K2211/1059 ,  C09K2211/1092 ,  C09K2211/185 ,  H01L2933/0041

Abstract: A display includes a light emitting diode and a color conversion layer that includes a polymer matrix, a blue photoluminescent material, and a components of a photoinitiator that initiated polymerization to form the polymer matrix. The blue photoluminescent material is selected to absorb ultraviolet light with a maximum wavelength in a range of about 300 nm to about 430 nm and to emit blue light. The blue photoluminescent material also has an emission peak in a range of about 420 nm to about 480 nm. The full width at half maximum of the emission peak is less than 100 nm, and the photoluminescence quantum yield is in a range of 5% to 100%.

公开(公告)号：US20240186458A1

公开(公告)日：2024-06-06

申请号：US18413013

申请日：2024-01-15

Applicant: Applied Materials, Inc.

Inventor： Kai Ding ,  Lisong Xu ,  Mingwei Zhu ,  Zhiyong Li ,  Hou T. Ng ,  Sivapackia Ganapathiappan ,  Nag Patibandla

IPC: H01L33/46 ,  H01L25/16

CPC classification number: H01L33/46 ,  H01L25/167 ,  H01L2933/0025

Abstract: Micro-LED structures include an LED epilayer that may be formed before the micro-LED structure is coupled to a backplane substrate. In order to prevent light leakage and maximize light output, the sidewalls and other surfaces of the LED epilayer may be coated with a reflective coating. For example, the reflective coating may include a metal layer that is electrically insulated between dielectric layers from the micro-LED electrodes. The reflective coating may also be formed using multiple layers in a distributed Bragg reflector configuration. This reflective coating may be formed during the LED fabrication process before the micro-LED structure is coupled to the backplane. The pixel isolation structures on the backplane may also include a reflective coating that is applied above the LED epilayers.

公开(公告)号：US20240154070A1

公开(公告)日：2024-05-09

申请号：US18413011

申请日：2024-01-15

Applicant: Applied Materials, Inc.

Inventor： Lisong Xu ,  Mingwei Zhu ,  Byung Sung Kwak ,  Hyunsung Bang ,  Liang Zhao ,  Hou T. Ng ,  Sivapackia Ganapathiappan ,  Nag Patibandla

IPC: H01L33/44 ,  G02B27/01 ,  H01L21/66 ,  H01L25/075 ,  H01L33/00 ,  H01L33/50 ,  H01L33/62

CPC classification number: H01L33/44 ,  G02B27/0172 ,  H01L22/22 ,  H01L25/0753 ,  H01L33/0075 ,  H01L33/502 ,  H01L33/62 ,  G02B2027/0178 ,  H01L2933/0025

Abstract: Methods of making high-pixel-density LED structures are described. The methods may include forming a backplane substrate and a LED substrate. The backplane substrate and the LED substrate may be bonded together, and the bonded substrates may include an array of LED pixels. Each of the LED pixels may include a group of isolated subpixels. A quantum dot layer may be formed on at least one of the isolated subpixels in each of the LED pixels. The methods may further include repairing at least one defective LED pixel by forming a replacement quantum dot layer on a quantum-dot-layer-free subpixel in the defective LED pixel. The methods may also include forming a UV barrier layer on the array of LED pixels after the repairing of the at least one defective LED pixel.

公开(公告)号：US11888093B2

公开(公告)日：2024-01-30

申请号：US17389029

申请日：2021-07-29

Applicant: Applied Materials, Inc.

Inventor： Daihua Zhang ,  Yingdong Luo ,  Mingwei Zhu ,  Hou T. Ng ,  Sivapackia Ganapathiappan ,  Nag B. Patibandla

IPC: H01L33/44 ,  H01L33/50 ,  H01L25/075 ,  H01L33/58 ,  H01L33/62 ,  H01L33/00 ,  H01L21/70 ,  H01L21/02 ,  H01L21/027 ,  H01L27/15

CPC classification number: H01L33/44 ,  H01L21/027 ,  H01L21/02104 ,  H01L21/70 ,  H01L21/707 ,  H01L25/0753 ,  H01L27/153 ,  H01L33/00 ,  H01L33/0093 ,  H01L33/505 ,  H01L33/58 ,  H01L33/62 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A multi-color display includes a backplane having backplane circuitry, an array of micro-LEDs electrically integrated with backplane circuitry of the backplane, a first color conversion layer over each of a first plurality of light emitting diodes, a second color conversion layer over each of a second plurality of light emitting diodes, and a plurality of isolation walls separating adjacent micro-LEDs of the array. The micro-LEDs of the array are configured to generate illumination of the same wavelength range, the first color conversion layer converts the illumination to light of a first color, and the second color conversion layer converts the illumination to light of a different second color.

公开(公告)号：US11851570B2

公开(公告)日：2023-12-26

申请号：US16668961

申请日：2019-10-30

Applicant: Applied Materials, Inc.

Inventor： Uma Sridhar ,  Sivapackia Ganapathiappan ,  Ashwin Chockalingam ,  Yingdong Luo ,  Daniel Redfield ,  Rajeev Bajaj ,  Nag B. Patibandla ,  Hou T. Ng ,  Sudhakar Madhusoodhanan

IPC: B29C64/112 ,  C09D11/38 ,  B24B37/24 ,  C09D11/107 ,  C09D11/101 ,  B33Y80/00 ,  B33Y70/00 ,  B29L31/00 ,  B29K33/00 ,  B33Y10/00

CPC classification number: C09D11/38 ,  B24B37/245 ,  B33Y70/00 ,  B33Y80/00 ,  C09D11/101 ,  C09D11/107 ,  B29C64/112 ,  B29K2033/08 ,  B29L2031/736 ,  B33Y10/00

Abstract: Polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes are provided. More particularly, implementations disclosed herein relate to composite polishing articles having tunable properties such as hydrophilicity and zeta potential. 3D printed chemical-mechanical planarization (CMP) pads composed of UV curable acrylic chemistry are generally hydrophobic in nature. Such hydrophobic behavior affects the wetting properties with abrasive-based polishing slurries such as ceria-base slurries. However, in order to increase the planarization and removal rate while decreasing defects, hydrophilic pads are preferred. In addition, it is desirable that the zeta potential (Zp) of the pads be tunable over a wide range of conditions at different pH values. Implementations of the present disclosure include methods for increasing the hydrophilicity and tuning the Zp of the pads with anionic additives and pads produced using these methods.

公开(公告)号：US11843025B2

公开(公告)日：2023-12-12

申请号：US17670374

申请日：2022-02-11

Applicant: Applied Materials, Inc.

Inventor： Mingwei Zhu ,  Sivapackia Ganapathiappan ,  Boyi Fu ,  Hou T. Ng ,  Nag B. Patibandla

IPC: H01L21/683 ,  H01L21/66 ,  H01L27/15 ,  H01L33/00 ,  H01L23/00 ,  H01L33/48 ,  H01L25/075

CPC classification number: H01L27/156 ,  H01L21/6835 ,  H01L22/22 ,  H01L24/741 ,  H01L24/83 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/48 ,  H01L22/20 ,  H01L24/75 ,  H01L25/0753 ,  H01L2221/68368 ,  H01L2224/7598 ,  H01L2224/95136

Abstract: An apparatus for positioning micro-devices on a substrate includes one or more supports to hold a donor substrate and a destination substrate, an adhesive dispenser to deliver adhesive on micro-devices on the donor substrate, a transfer device including a transfer surface to transfer the micro-devices from the donor substrate to the destination substrate, and a controller. The controller is configured to operate the adhesive dispenser to selectively dispense the adhesive onto selected micro-devices on the donor substrate based on a desired spacing of the selected micro-devices on the destination substrate. The controller is configured to operate the transfer device such that the transfer surface engages the adhesive on the donor substrate to cause the selected micro-devices to adhere to the transfer surface and the transfer surface then transfers the selected micro-devices from the donor substrate to the destination substrate.

公开(公告)号：US20230290909A1

公开(公告)日：2023-09-14

申请号：US18182856

申请日：2023-03-13

Applicant: Applied Materials, Inc.

Inventor： Zhiyong Li ,  Mingwei Zhu ,  Hou T. Ng ,  Nag Patibandla ,  Lisong Xu ,  Kai Ding ,  Sivapackia Ganapathiappan

IPC: H01L33/50 ,  H01L33/00 ,  H01L25/075

CPC classification number: H01L33/502 ,  H01L33/005 ,  H01L25/0753 ,  H01L2933/0041

Abstract: Exemplary pixel structures are described that include a first light emitting diode structure, operable to generate blue light characterized by a peak emission wavelength of greater than or about 450 nm, and a second light emitting diode structure positioned on the first light emitting diode structure. The second light emitting diode structure is operable to generate ultraviolet light characterized by a peak emission wavelength of less than or about 380 nm. The pixel structures may also include a photoluminescent region, containing a photoluminescent material, that is positioned on the second light emitting diode structure.