摘要:
Disclosed herein is a semiconductor package board, in which a copper pattern having a predetermined shape is formed on a dummy area, thus preventing the entire semiconductor package board from bending. The present invention is technically characterized in that the copper pattern includes a beam part, which is provided in the longitudinal direction of the semiconductor package board, and a rib part, which is provided in the lateral direction of the semiconductor package board.
摘要:
A catalyst enhanced chemical vapor deposition (CECVD) apparatus is provided in which the showerhead and catalyst support are separated from each other. The CECVD apparatus has excellent spacing between the showerhead, catalyst wire and substrate and can be purged to prevent contaminants from forming on parts functioning at low temperatures. The CECVD apparatus comprises a reaction chamber, a showerhead for introducing reaction gas into the reaction chamber, a catalyst wire for decomposing the reaction gas, a catalyst support for supporting the catalyst wire, a substrate on which the decomposed gas is deposited, and a substrate support for supporting the substrate.
摘要:
The present invention relates to a water-in-oil-in-water multiple emulsion system and a method for preparation thereof, characterized by hydrodynamically stabilizing the multiple emulsion system by using hydrodynamic dual stabilization (HDS) technology. The HDS technology hydrophobizes water molecules in the internal aqueous phase by using a hydrogen bonding inhibitor and by improving the aggregating force between water molecules in the internal aqueous phase by using a water molecule aggregating agent.
摘要:
Disclosed is a PCB including an embedded capacitor and a method of fabricating the same. The long embedded capacitor is formed through an insulating layer, making a high capacitance and various capacitance designs possible.
摘要:
An apparatus for assembling a crankshaft-sprocket aligns a timing mark of a sprocket to a predetermined line of a crankshaft, and includes a slider for slidably moving an interior circumference surface of the sprocket to an exterior circumference surface of the crankshaft. A guider is disposed on an end portion of the crankshaft so as to guide the slider to the crankshaft. A first aligner is disposed on the slider so as to align the timing mark of the sprocket to a predetermined portion of the slider. A second aligner aligns the slider such that the timing mark aligned by the first aligner is positioned to the predetermined line of the crankshaft.
摘要:
A crystalline clopidogrel naphthalenesulfonate or a hydrate thereof, a method for preparing same, and a pharmaceutical composition containing same are provided.
摘要:
Disclosed is a PCB having axially parallel via holes, in which an outer ground via hole, acting as a ground, is formed around a via hole for intercircuit connection in the PCB, thereby minimizing the effect of noise caused by the via hole.
摘要:
A printed circuit board having an embedded cavity capacitor is disclosed. According to an embodiment of the present invention, the printed circuit board having the embedded cavity capacitor, the printed circuit board can include two conductive layers to be used as a power layer and a ground layer, respectively; and a first dielectric layer, placed between the two conductive layers, wherein at least one cavity capacitor is arranged in a noise-transferable path between a noise source and a noise prevented destination which are placed on the printed circuit board, the cavity capacitor being formed to allow a second dielectric layer to have a lower stepped region than the first dielectric layer, the second dielectric layer using the two conductive layers as a first electrode and a second electrode, respectively, and placed between the first electrode and the second electrode.
摘要:
An electromagnetic bandgap structure and a printed circuit board having the electromagnetic bandgap that intercepts the transfer of a signal ranging a frequency band are disclosed. The electromagnetic bandgap structure includes a metal layer; a dielectric layer, stacked on the metal layer; at least two metal plates, stacked on the same planar surface of the dielectric layer; and a stitching via, connecting the adjacent metal plates. The stitching via passes through the dielectric layer, and a part of the stitching via is placed on the same planar surface of the metal layer. With the present invention, the electromagnetic bandgap can decrease the noise of a particular frequency by having a compact size and a low bandgap frequency.
摘要:
A printed circuit board solving a mixed signal problem between an analog circuit and a digital circuit is disclosed. In accordance with an embodiment of the present invention, the printed circuit board, having an analog circuit and a digital circuit, includes: a first metal layer and a second metal layer, one of the first metal layer and the second metal layer being a power layer and the other being a ground layer; a third metal layer, layer-built between the first metal layer and the second metal layer; and a mushroom type structure including a via connected to a metal plate, the metal plate being arranged-in a space between circuit patterns of the third metal layer. With the present invention, the printed circuit board can lower the noise level within the same frequency band as compared with other structures having the same size.