Semiconductor package board having dummy area with copper pattern
    121.
    发明申请
    Semiconductor package board having dummy area with copper pattern 审中-公开
    半导体封装板具有带铜图案的虚拟区域

    公开(公告)号:US20070002545A1

    公开(公告)日:2007-01-04

    申请号:US11477627

    申请日:2006-06-30

    IPC分类号: H05K7/00

    摘要: Disclosed herein is a semiconductor package board, in which a copper pattern having a predetermined shape is formed on a dummy area, thus preventing the entire semiconductor package board from bending. The present invention is technically characterized in that the copper pattern includes a beam part, which is provided in the longitudinal direction of the semiconductor package board, and a rib part, which is provided in the lateral direction of the semiconductor package board.

    摘要翻译: 这里公开了一种半导体封装板,其中在虚拟区域上形成具有预定形状的铜图案,从而防止整个半导体封装板弯曲。 本发明的技术特征在于,铜图案包括沿半导体封装板的纵向方向设置的梁部分和设置在半导体封装板的横向方向上的肋部分。

    Catalyst enhanced chemical vapor deposition apparatus
    122.
    发明申请
    Catalyst enhanced chemical vapor deposition apparatus 有权
    催化剂增强化学气相沉积装置

    公开(公告)号:US20060254514A1

    公开(公告)日:2006-11-16

    申请号:US11413927

    申请日:2006-04-28

    IPC分类号: C23C16/00

    摘要: A catalyst enhanced chemical vapor deposition (CECVD) apparatus is provided in which the showerhead and catalyst support are separated from each other. The CECVD apparatus has excellent spacing between the showerhead, catalyst wire and substrate and can be purged to prevent contaminants from forming on parts functioning at low temperatures. The CECVD apparatus comprises a reaction chamber, a showerhead for introducing reaction gas into the reaction chamber, a catalyst wire for decomposing the reaction gas, a catalyst support for supporting the catalyst wire, a substrate on which the decomposed gas is deposited, and a substrate support for supporting the substrate.

    摘要翻译: 提供催化剂增强化学气相沉积(CECVD)装置,其中喷头和催化剂载体彼此分离。 CECVD装置在喷头,催化剂丝和基材之间具有优异的间距,并且可以被清除以防止在低温下起作用的部件上形成污染物。 CECVD装置包括反应室,用于将反应气体引入反应室的喷头,用于分解反应气体的催化剂丝,用于负载催化剂丝的催化剂载体,沉积有分解气体的基板和基板 支持底物支撑。

    Stable water-in-oil-in-water multiple emulsion system produced by hydrodynamic dual stabilization and a method for preparation thereof
    123.
    发明申请
    Stable water-in-oil-in-water multiple emulsion system produced by hydrodynamic dual stabilization and a method for preparation thereof 审中-公开
    通过流体力学双重稳定化制备的稳定的水包油包水型乳液体系及其制备方法

    公开(公告)号:US20060188463A1

    公开(公告)日:2006-08-24

    申请号:US09878714

    申请日:2001-06-11

    IPC分类号: A61K8/73

    摘要: The present invention relates to a water-in-oil-in-water multiple emulsion system and a method for preparation thereof, characterized by hydrodynamically stabilizing the multiple emulsion system by using hydrodynamic dual stabilization (HDS) technology. The HDS technology hydrophobizes water molecules in the internal aqueous phase by using a hydrogen bonding inhibitor and by improving the aggregating force between water molecules in the internal aqueous phase by using a water molecule aggregating agent.

    摘要翻译: 水包油包水复合乳液体系及其制备方法技术领域本发明涉及一种水包油包水型多重乳液体系及其制备方法,其特征在于通过使用流体力学双稳定化(HDS)技术对多重乳液体系进行流体动力学稳定化。 HDS技术通过使用氢键抑制剂和通过使用水分子聚集剂改善内部水相中的水分子之间的聚集力来疏水内部水相中的水分子。

    Apparatus and method for assembling crankshaft-sprocket
    125.
    发明申请
    Apparatus and method for assembling crankshaft-sprocket 失效
    用于组装曲轴 - 链轮的装置和方法

    公开(公告)号:US20060112551A1

    公开(公告)日:2006-06-01

    申请号:US11292397

    申请日:2005-11-30

    申请人: Han Kim

    发明人: Han Kim

    IPC分类号: B23Q3/00 B23P19/00

    摘要: An apparatus for assembling a crankshaft-sprocket aligns a timing mark of a sprocket to a predetermined line of a crankshaft, and includes a slider for slidably moving an interior circumference surface of the sprocket to an exterior circumference surface of the crankshaft. A guider is disposed on an end portion of the crankshaft so as to guide the slider to the crankshaft. A first aligner is disposed on the slider so as to align the timing mark of the sprocket to a predetermined portion of the slider. A second aligner aligns the slider such that the timing mark aligned by the first aligner is positioned to the predetermined line of the crankshaft.

    摘要翻译: 用于组装曲轴 - 链轮的装置将链轮的定时标记对准曲轴的预定线,并且包括用于将链轮的内周表面可滑动地移动到曲轴的外周表面的滑块。 引导件设置在曲轴的端部上,以将滑块引导到曲轴。 第一对准器设置在滑块上,以将链轮的定时标记对准滑块的预定部分。 第二对准器使滑块对齐,使得由第一对准器对准的定时标记定位到曲轴的预定线。

    Printed circuit board with embedded cavity capacitor
    128.
    发明申请
    Printed circuit board with embedded cavity capacitor 有权
    带嵌入式腔体电容器的印刷电路板

    公开(公告)号:US20090086451A1

    公开(公告)日:2009-04-02

    申请号:US12010436

    申请日:2008-01-24

    IPC分类号: H05K1/16

    摘要: A printed circuit board having an embedded cavity capacitor is disclosed. According to an embodiment of the present invention, the printed circuit board having the embedded cavity capacitor, the printed circuit board can include two conductive layers to be used as a power layer and a ground layer, respectively; and a first dielectric layer, placed between the two conductive layers, wherein at least one cavity capacitor is arranged in a noise-transferable path between a noise source and a noise prevented destination which are placed on the printed circuit board, the cavity capacitor being formed to allow a second dielectric layer to have a lower stepped region than the first dielectric layer, the second dielectric layer using the two conductive layers as a first electrode and a second electrode, respectively, and placed between the first electrode and the second electrode.

    摘要翻译: 公开了一种具有嵌入式腔体电容器的印刷电路板。 根据本发明的实施例,具有嵌入式空腔电容器的印刷电路板,印刷电路板可以分别包括用作功率层和接地层的两个导电层; 以及放置在所述两个导电层之间的第一电介质层,其中至少一个空腔电容器被布置在放置在所述印刷电路板上的噪声源和被噪声阻止的目的地之间的可噪声转移路径中,形成所述空腔电容器 以允许第二电介质层具有比第一电介质层更低的台阶区域,第二电介质层分别使用两个导电层作为第一电极和第二电极,并且放置在第一电极和第二电极之间。

    Electromagnetic bandgap structure and printed circuit board
    129.
    发明申请
    Electromagnetic bandgap structure and printed circuit board 有权
    电磁带隙结构和印刷电路板

    公开(公告)号:US20090039984A1

    公开(公告)日:2009-02-12

    申请号:US12010561

    申请日:2008-01-25

    IPC分类号: H01P1/20

    摘要: An electromagnetic bandgap structure and a printed circuit board having the electromagnetic bandgap that intercepts the transfer of a signal ranging a frequency band are disclosed. The electromagnetic bandgap structure includes a metal layer; a dielectric layer, stacked on the metal layer; at least two metal plates, stacked on the same planar surface of the dielectric layer; and a stitching via, connecting the adjacent metal plates. The stitching via passes through the dielectric layer, and a part of the stitching via is placed on the same planar surface of the metal layer. With the present invention, the electromagnetic bandgap can decrease the noise of a particular frequency by having a compact size and a low bandgap frequency.

    摘要翻译: 公开了一种具有电磁带隙的电磁带隙结构和印刷电路板,该电磁带隙拦截了频带范围内的信号的传送。 电磁带隙结构包括金属层; 介电层,堆叠在金属层上; 至少两个金属板,堆叠在介电层的相同平面上; 和缝合通孔,连接相邻的金属板。 缝合通孔穿过电介质层,并且缝合通孔的一部分被放置在金属层的同一平面上。 利用本发明,电磁带隙可以通过具有紧凑的尺寸和低的带隙频率来降低​​特定频率的噪声。

    Printed circuit board having electromagnetic bandgap structure
    130.
    发明申请
    Printed circuit board having electromagnetic bandgap structure 有权
    具有电磁带隙结构的印刷电路板

    公开(公告)号:US20080314635A1

    公开(公告)日:2008-12-25

    申请号:US12213291

    申请日:2008-06-17

    IPC分类号: H01R12/04

    摘要: A printed circuit board solving a mixed signal problem between an analog circuit and a digital circuit is disclosed. In accordance with an embodiment of the present invention, the printed circuit board, having an analog circuit and a digital circuit, includes: a first metal layer and a second metal layer, one of the first metal layer and the second metal layer being a power layer and the other being a ground layer; a third metal layer, layer-built between the first metal layer and the second metal layer; and a mushroom type structure including a via connected to a metal plate, the metal plate being arranged-in a space between circuit patterns of the third metal layer. With the present invention, the printed circuit board can lower the noise level within the same frequency band as compared with other structures having the same size.

    摘要翻译: 公开了一种解决模拟电路和数字电路之间的混合信号问题的印刷电路板。 根据本发明的实施例,具有模拟电路和数字电路的印刷电路板包括:第一金属层和第二金属层,第一金属层和第二金属层中的一个是功率 层,另一层为地层; 在第一金属层和第二金属层之间层叠的第三金属层; 以及包括连接到金属板的通孔的蘑菇型结构,所述金属板布置在所述第三金属层的电路图案之间的空间中。 利用本发明,与具有相同尺寸的其他结构相比,印刷电路板可以降低相同频带内的噪声水平。