公开(公告)号：US20120036712A1

公开(公告)日：2012-02-16

申请号：US13276645

申请日：2011-10-19

Applicant: Tao ZHANG ,  Zhihui WANG

Inventor： Tao ZHANG ,  Zhihui WANG

IPC: H05K3/10

CPC classification number: H05K3/4092 ,  H05K1/117 ,  H05K2201/0949 ,  H05K2201/09754 ,  H05K2201/09781 ,  H05K2201/1034 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49162 ,  Y10T29/49169

Abstract: A method and apparatus for providing an alternative power source for a graphics card are disclosed. Specifically, one embodiment of the present invention sets forth a method, which includes the steps of laying a set of gold fingers on a printed circuit board according to an industrial standard bus interface, positioning a wire in a middle layer of the printed circuit board, attaching a first end of the wire to a specific gold finger, and attaching the alternative power source to a second end of the wire, wherein the second end of the wire is an electroplated contact protruded external to the printed circuit board.

Abstract translation: 公开了一种为图形卡提供替代电源的方法和装置。 具体地说，本发明的一个实施例提出了一种方法，其包括以下步骤：根据工业标准总线接口将一组金手指放置在印刷电路板上，将导线定位在印刷电路板的中间层中， 将导线的第一端附接到特定的金指，以及将替代电源附接到电线的第二端，其中电线的第二端是在印刷电路板外部突出的电镀触点。

公开(公告)号：US20110290535A1

公开(公告)日：2011-12-01

申请号：US13147961

申请日：2010-04-27

Applicant: Mamoru Sawai

Inventor： Mamoru Sawai

IPC: H05K1/00 ,  H05K3/42 ,  H05K3/44

CPC classification number: H05K1/0213 ,  H05K1/056 ,  H05K3/40 ,  H05K3/4092 ,  H05K3/44 ,  H05K2201/09754 ,  H05K2201/10924 ,  Y10T29/49158 ,  Y10T29/49165

Abstract: A wiring substrate includes a wiring board having a main face and a side face substantially perpendicular to the main face; a circuit pattern which is formed on the main face of the wiring board; a soaking plate which is disposed in an intermediate layer of the wiring board; and a plurality of protruding terminals are disposed in the intermediate layer and are projected outwardly from the side face. The protruding terminals are electrically connected in the intermediate layer to each other.

Abstract translation: 布线基板包括具有主面和大致垂直于主面的侧面的布线板; 形成在布线基板的主面上的电路图案; 浸渍板，其布置在所述布线板的中间层中; 并且多个突出端子设置在中间层中并且从侧面向外突出。 突出端子在中间层中彼此电连接。

公开(公告)号：US07604765B2

公开(公告)日：2009-10-20

申请号：US11715392

申请日：2007-03-08

Applicant: Keiichi Sugimoto ,  Mitsuru Nakagawa

Inventor： Keiichi Sugimoto ,  Mitsuru Nakagawa

IPC: B29C39/10 ,  B29C70/72

CPC classification number: B29C45/14065 ,  B29C45/14639 ,  H05K3/284 ,  H05K3/3405 ,  H05K5/0034 ,  H05K5/065 ,  H05K2201/09754 ,  H05K2201/1034 ,  H05K2203/1316

Abstract: A casing of an electronic key transmitting and receiving apparatus is formed to seal entire bodies of circuit parts, a mounting face of a printed board, on which the circuit parts are mounted, and parts of terminals while the other parts of the terminals are exposed. A rear face of the printed board opposite from the mounting face provides a part of an outer surface of the casing. When the printed board is provided in the casing through an insert molding process, the printed board is held in a cavity of a molding die such that the rear face of the printed board closely contacts an inner face of the cavity. Accordingly, deformation of the printed board due to pressure caused when the resin is poured or when the resin hardens is inhibited.

Abstract translation: 电子钥匙收发装置的壳体形成为密封电路部件的整体，安装有电路部件的印刷电路板的安装面以及端子的其他部分露出的部分端子。 印刷电路板的与安装面相对的后表面提供了外壳的外表面的一部分。 当通过插入成型工艺将印刷板设置在壳体中时，印刷板被保持在成型模具的空腔中，使得印刷板的后表面紧密接触空腔的内表面。 因此，由于在树脂浇注时或当树脂硬化时引起的压力导致印刷基板的变形被抑制。

公开(公告)号：US20090059541A1

公开(公告)日：2009-03-05

申请号：US11897316

申请日：2007-08-30

Applicant: Lee R. Hinze

Inventor： Lee R. Hinze

IPC: H05K1/18

CPC classification number: H05K5/064 ,  H05K1/18 ,  H05K3/284 ,  H05K3/308 ,  H05K5/0247 ,  H05K2201/09754 ,  H05K2201/0999 ,  H05K2201/10015 ,  H05K2201/10295 ,  H05K2201/105 ,  H05K2201/1059 ,  H05K2201/10962

Abstract: An electronic assembly includes a printed circuit board and an electrical component arranged within a housing. The component is mounted in a lower region of the housing, and the printed circuit board is supported over the component. The housing is formed of a electrically insulating material and includes embedded conductors connecting the component to the printed circuit board. Potting material is disposed on the printed circuit board within the housing. A fill hole may be provided in the board over the component to allow the potting material to flow onto the electrical component for mechanical stabilization.

Abstract translation: 电子组件包括布置在壳体内的印刷电路板和电气部件。 该部件安装在壳体的下部区域中，印刷电路板被支撑在部件上。 壳体由电绝缘材料形成，并且包括将部件连接到印刷电路板的嵌入导体。 灌封材料设置在外壳内的印刷电路板上。 填充孔可以设置在板上的部件上，以允许灌封材料流到电气部件上用于机械稳定。

公开(公告)号：US20060252384A1

公开(公告)日：2006-11-09

申请号：US11408076

申请日：2006-04-21

Applicant: Keiichi Sugimoto ,  Mitsuru Nakagawa

Inventor： Keiichi Sugimoto ,  Mitsuru Nakagawa

IPC: H04B1/38

CPC classification number: B29C45/14065 ,  B29C45/14639 ,  H05K3/284 ,  H05K3/3405 ,  H05K5/0034 ,  H05K5/065 ,  H05K2201/09754 ,  H05K2201/1034 ,  H05K2203/1316

Abstract: A casing of an electronic key transmitting and receiving apparatus is formed to seal entire bodies of circuit parts, a mounting face of a printed board, on which the circuit parts are mounted, and parts of terminals while the other parts of the terminals are exposed. A rear face of the printed board opposite from the mounting face provides a part of an outer surface of the casing. When the printed board is provided in the casing through an insert molding process, the printed board is held in a cavity of a molding die such that the rear face of the printed board closely contacts an inner face of the cavity. Accordingly, deformation of the printed board due to pressure caused when the resin is poured or when the resin hardens is inhibited.

公开(公告)号：US07122928B2

公开(公告)日：2006-10-17

申请号：US10757986

申请日：2004-01-16

Applicant: Yusuke Shindo

Inventor： Yusuke Shindo

IPC: H02K5/00 ,  H02K11/00 ,  H02K5/24 ,  H02K9/00 ,  H02B1/26 ,  H02B1/56 ,  H05K7/20 ,  H05K9/00

CPC classification number: B60R16/0239 ,  H02K11/01 ,  H02K11/33 ,  H05K1/0218 ,  H05K1/0263 ,  H05K2201/09118 ,  H05K2201/09754 ,  H05K2201/0999 ,  H05K2201/10272 ,  H05K2201/2018

Abstract: A box unit is a housing having a space for containing a circuit board therein. Bus bars are insert-molded in a resin body of the box. A metal shield plate is insert-molded around the entire periphery of the box and outside the bus bars. As a result, the box has a shield and is reduced in size compared with a metal box.

Abstract translation: 盒单元是具有用于在其中容纳电路板的空间的壳体。 母线被嵌入成型在盒子的树脂体中。 金属屏蔽板围绕箱体的整个周边和母线外部嵌入成型。 结果，与金属盒相比，该盒具有屏蔽并且尺寸减小。

公开(公告)号：US20050018410A1

公开(公告)日：2005-01-27

申请号：US10624063

申请日：2003-07-21

Applicant: Scott Brandenburg ,  Thomas Degenkolb

Inventor： Scott Brandenburg ,  Thomas Degenkolb

IPC: H01R13/66 ,  H01R31/06 ,  H05K1/02 ,  H05K1/18 ,  H05K3/28 ,  H05K3/40 ,  H05K7/06

CPC classification number: H05K3/4092 ,  H01R13/6658 ,  H01R31/065 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/184 ,  H05K3/284 ,  H05K2201/086 ,  H05K2201/09163 ,  H05K2201/09754 ,  H05K2201/10924

Abstract: A printed circuit board (PCB) assembly includes a PCB and a first integrated conductive bus structure extending from a first edge of the PCB. The PCB connects a plurality of electronic components and includes a plurality of conductive layers, each separated by a non-conductive layer. The first integrated conductive bus structure includes a first portion that extends from the first edge of the PCB and which forms a plurality of electrically separate contacts of a connector. A second portion of the bus structure is integrated within the PCB and couples each of the contacts to at least one conductive trace of the PCB through plated holes.

Abstract translation: 印刷电路板（PCB）组件包括PCB和从PCB的第一边缘延伸的第一集成导电总线结构。 PCB连接多个电子部件，并且包括多个导电层，每个导电层由非导电层隔开。 第一集成导电总线结构包括从PCB的第一边缘延伸并且形成连接器的多个电分离触点的第一部分。 总线结构的第二部分集成在PCB内，并且通过电镀孔将每个触点耦合到PCB的至少一个导电迹线。

公开(公告)号：US06557925B2

公开(公告)日：2003-05-06

申请号：US09900194

申请日：2001-07-09

Applicant: Yoshiharu Odashima ,  Masashi Sugiyama

Inventor： Yoshiharu Odashima ,  Masashi Sugiyama

IPC: B60J500

CPC classification number: B60J5/0416 ,  H05K1/119 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/09118 ,  H05K2201/09754 ,  H05K2201/10325 ,  H05K2203/0113

Abstract: A vehicle circuit panel is provided that includes a base member formed of an electrically insulating plastic material and a conducting plastic circuit path formed of an electrically conducting plastic material. The conducting plastic circuit path is formed unitarily with the base member, and is at least partially embedded in the base member, thereby forming a one-piece molded plastic member. Thus, the conducting plastic circuit path is formed into a desired circuit configuration within the base member. With the above construction, the conducting plastic circuit path can be formed into any circuit configuration, thereby increasing the degree of freedom of design of the arrangement of the circuit path.

Abstract translation: 提供一种车辆电路板，其包括由电绝缘塑料材料形成的基座构件和由导电塑料材料形成的导电塑料电路路径。 导电塑料电路路径与基座构件一体地形成，并且至少部分地嵌入在基座构件中，从而形成一体的模制塑料构件。 因此，导电塑料电路路径形成为基底构件内所需的电路结构。 通过上述结构，可以将导电塑料电路路径形成为任何电路结构，从而增加电路路径布置的设计自由度。

公开(公告)号：US20020041110A1

公开(公告)日：2002-04-11

申请号：US09900194

申请日：2001-07-09

Applicant: SUMITOMO WIRING SYSTEMS, Ltd.

Inventor： Yoshiharu Odashima ,  Masashi Sugiyama

IPC: B60J005/04

CPC classification number: B60J5/0416 ,  H05K1/119 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/09118 ,  H05K2201/09754 ,  H05K2201/10325 ,  H05K2203/0113

Abstract: A vehicle circuit panel is provided that includes a base member formed of an electrically insulating plastic material and a conducting plastic circuit path formed of an electrically conducting plastic material. The conducting plastic circuit path is formed unitarily with the base member, and is at least partially embedded in the base member, thereby forming a one-piece molded plastic member. Thus, the conducting plastic circuit path is formed into a desired circuit configuration within the base member. With the above construction, the conducting plastic circuit path can be formed into any circuit configuration, thereby increasing the degree of freedom of design of the arrangement of the circuit path.

Abstract translation: 提供一种车辆电路板，其包括由电绝缘塑料材料形成的基座构件和由导电塑料材料形成的导电塑料电路路径。 导电塑料电路路径与基座构件一体地形成，并且至少部分地嵌入在基座构件中，从而形成一体的模制塑料构件。 因此，导电塑料电路路径形成为基底构件内所需的电路结构。 通过上述结构，可以将导电塑料电路路径形成为任何电路结构，从而增加电路路径布置的设计自由度。

公开(公告)号：US06313998B1

公开(公告)日：2001-11-06

申请号：US09285354

申请日：1999-04-02

Applicant: Kenneth J. Kledzik ,  Jason C. Engle

Inventor： Kenneth J. Kledzik ,  Jason C. Engle

IPC: H05K706

CPC classification number: H01L23/49861 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/141 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4092 ,  H05K7/1092 ,  H05K2201/049 ,  H05K2201/09754 ,  H05K2201/10515 ,  H05K2201/10689 ,  H01L2924/00

Abstract: A circuit board assembly having integrated circuit packages vertically arranged three dimensionally is used to increase electronic component density without increasing the size of the circuit board. For a preferred embodiment of the circuit board assembly, the printed circuit board has at least one primary mounting pad array affixed thereto, each pad of the array having first and second portions. Each lead of a first integrated circuit package is conductively bonded to the first portion of a different mounting pad of said primary array. A package carrier having a plurality of carrier leads attached thereto and a secondary mounting pad array on an upper surface thereof, covers the first package. Each lead of the carrier is coupled to a different pad of the secondary array and is also conductively bonded to the second portion of a different mounting pad of the primary array. Each lead of a second integrated circuit package is conductively bonded to a different mounting pad of the secondary mounting pad array. For a preferred embodiment of the invention, the carrier is provided with embedded lead frame elements which form both the leads and the mounting pads of the carrier. The result is a circuit board assembly having lower component costs, lower assembly costs, and a lower profile than that of the first embodiment assembly.

Abstract translation: 使用具有三维垂直布置的集成电路封装的电路板组件来增加电子元件密度而不增加电路板的尺寸。 对于电路板组件的优选实施例，印刷电路板具有固定到其上的至少一个主安装焊盘阵列，阵列的每个焊盘具有第一和第二部分。 第一集成电路封装的每个引线导电地结合到所述主阵列的不同安装焊盘的第一部分。 具有附接到其上的多个载体引线和在其上表面上的辅助安装焊盘阵列的封装载体覆盖第一封装。 载体的每个引线耦合到次级阵列的不同焊盘，并且还导电地结合到主阵列的不同安装焊盘的第二部分。 第二集成电路封装的每个引线导电地接合到辅助安装焊盘阵列的不同安装焊盘。 对于本发明的优选实施例，载体设置有形成载体的引线和安装焊盘的嵌入式引线框架元件。 结果是具有比第一实施例组件更低的部件成本，更低的组装成本和更低的轮廓的电路板组件。