Abstract:
An improvement of a touch pad structure for a notebook computer comprises a housing, a printed circuit board, a plurality of keys and a touch pad. The housing downwardly concaves to form a contained groove, and the printed circuit board is installed in the contained groove and has a plurality of metal switch springs thereon. The keys are disposed on the printed circuit board and are separately correspond to the metal switch springs of the printed circuit board, and the touch pad is installed in the contained groove and the touch pad and the keys have a veneer board thereon. Whereby it is to provide a convenient assembly, artistic effect, better touch of keys, partially waterproof effect and to maintain a structure strength of the housing.
Abstract:
A stator structure includes a first cover, a stator assembly and a filler. The first cover has an accommodation space for accommodating the stator assembly therein. The filler is applied between the first cover and the stator assembly to surround the stator assembly. A manufacturing method of the stator structure is also disclosed.
Abstract:
A light-emitting device comprises a light-emitting unit including a plurality of first connecting pads, a base substrate including a plurality of second connecting pads, and a plurality of conductive bumps that connect the first connecting pads of the light-emitting unit to the second connecting pads of the base substrate. In the manufacturing process, a reflow process is performed to bond the conductive bumps to the first and second connecting pads. The light-emitting unit is configured to emit a first light radiation upon the application of an electric current flow, and the base substrate is configured to emit a second light radiation when stimulated by the first light radiation.
Abstract:
A method of electrochemical deposition (ECD) provides a barrier and a seed layer on a substrate. The surfaces of the substrate are pre-treated before a metal layer is electrochemically deposited thereon in an electrochemical plating cell with a physical or a chemical surface treatment process. The electrochemical plating cell is covered by a cap to prevent evaporation of the electrolyte solution. The electrochemical plating cell includes a substrate holder assembly with a lift seal, e.g., with a contact angle θ less than 90° between the lift seal and the substrate. The substrate holder assembly includes a substrate chuck at the rear side of the substrate.
Abstract:
A liquid crystal display. The liquid crystal display includes a color filter substrate and an array substrate, wherein at least one of the color filter substrate and the array substrate comprises polyimide having formula (I): wherein A and A′ are the same or different and comprise cycloaliphatic compounds or aromatic compounds, B and B′ are the same or different and comprise cycloaliphatic compounds or aromatic compounds, and x and y are 10˜10000, wherein at least one of A and A′ is a cycloaliphatic compound.
Abstract:
A single-poly non-volatile memory device invented to integrate into logic process is disclosed. This non-volatile memory device includes a memory cell unit comprising a PMOS access transistor that is serially connected to a PMOS storage transistor formed in a cell array area, and, in a peripheral circuit area, a high-voltage MOS transistor having a high-voltage gate insulation layer is provided. The PMOS access transistor has an access gate oxide layer that has a thickness equal to the thickness of the high-voltage gate insulation layer in a peripheral circuit area.
Abstract:
The invention discloses a pan with temperature displaying including a pan body and a handle, a temperature-sensing bimetal element being provided in the bottom of the pan body, a display means being provided in the handle, and the temperature-sensing bimetal element being connected with the display means. The invention can rapidly and precisely indicate the temperature of the pan bottom of the pan so that the user can control the cooking level during cooking. The pan according to the invention is of a simple structure, is convenient to use and is easy to popularize.
Abstract:
A process for fabricating a chip package structure is disclosed. To fabricate the chip package structure, a carrier and a plurality of chips are provided. Each chip has an active surface and at least one of the active surfaces has a plurality of bumps thereon. The chips and the carrier are electrically connected together. Thereafter, a heat sink is attached to the back of the chips and then at least one heat-resistant buffering film is formed over part of the heat sink surface. An encapsulating material layer is formed over the carrier and filling bonding gaps between the chips and the carrier. The encapsulating material within the bonding gaps has a thickness. The maximum diameter of particles constituting the encapsulating material layer is less than half of the said thickness.
Abstract:
A voltage-controlled amplifier for a signal processing system includes an input voltage reception end, a first voltage-to-current converter, a reference current generator, a gain adjustment circuit, a first current mirror, and an output circuit. The voltage-controlled amplifier adjusts a gain according to a variable control voltage, so as to transfer an input voltage to an output voltage according to the adjusted gain. When adjusting the gain, the present invention changes only an alternating current part of the input voltage, and can decrease noise, the production cost, and increase integration degree.
Abstract:
A flat panel display device including a casing, a display panel and an extruded metallic bracket is provided. The casing has a front surface and a back surface opposite to the front surface. The display panel is disposed on the front surface. The extruded metallic bracket is connected to the back surface for supporting the casing above a work surface.