公开(公告)号：US20150159052A1

公开(公告)日：2015-06-11

申请号：US14400966

申请日：2013-05-07

Applicant: TESA SE

Inventor： Roger Teng

IPC: C09J7/02 ,  C09J11/04

CPC classification number: C09J11/04 ,  C08K3/013 ,  C08K3/04 ,  C08K5/0041 ,  C09J7/255 ,  C09J7/35 ,  C09J115/00 ,  C09J2201/128 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2409/00 ,  C09J2415/00 ,  C09J2461/00 ,  C09J2467/006 ,  Y10T428/2826

Abstract: Adhesive film comprising at least one carrier film and two external adhesive compound layers, at least one of the adhesive compounds being a heat-activable bondable adhesive compound, with black pigments added to the heat-activable adhesive compound.

Abstract translation: 粘合剂膜包括至少一种载体膜和两个外部粘合剂化合物层，至少一种粘合剂化合物是可热激活的可粘合粘合剂化合物，并将黑色颜料加入到可热活化的粘合剂化合物中。

公开(公告)号：US20150153776A1

公开(公告)日：2015-06-04

申请号：US14539759

申请日：2014-11-12

Applicant: Uniproo Inc.

Inventor： Kuo-Liang CHENG ,  Chun-Hung SU

IPC: G06F1/16 ,  G06F3/041

CPC classification number: G06F1/1637 ,  C09J7/22 ,  C09J7/38 ,  C09J2201/28 ,  C09J2201/36 ,  C09J2203/318 ,  C09J2400/143 ,  G06F1/1643 ,  Y10T428/24322 ,  Y10T428/2462 ,  Y10T428/24868

Abstract: A screen protection device for protecting a display screen of an electronic apparatus includes: a tempered glass sheet, a mask layer, an optical clear adhesive layer, and an adhesive layer. The mask layer is positioned on the tempered glass sheet and defines a transparent region for the screen protection device. The optical clear adhesive layer is positioned on the tempered glass sheet and covers the transparent region, but does not cover the mask layer. The adhesive layer is positioned on the mask layer and the optical clear adhesive layer, and is utilized for detachably attaching to the display screen of the electronic apparatus. A thickness of the optical clear adhesive layer is at least 80% of a thickness of the mask layer.

Abstract translation: 用于保护电子设备的显示屏的屏幕保护装置包括：钢化玻璃板，掩模层，光学透明粘合剂层和粘合剂层。 掩模层位于钢化玻璃板上，并且限定了屏幕保护装置的透明区域。 光学透明粘合剂层位于钢化玻璃板上并覆盖透明区域，但不覆盖掩模层。 粘合剂层位于掩模层和光学透明粘合剂层上，并用于可拆卸地附接到电子设备的显示屏上。 光学透明粘合剂层的厚度为掩模层厚度的至少80％。

公开(公告)号：US20150150401A1

公开(公告)日：2015-06-04

申请号：US14616194

申请日：2015-02-06

Applicant: DANIEL PAUL BENNETT

Inventor： DANIEL PAUL BENNETT

IPC: A47G27/04

CPC classification number: A47G27/045 ,  A47G27/0443 ,  B29C65/4815 ,  B29C65/5007 ,  B29C65/5021 ,  B29C65/5028 ,  B29C65/5035 ,  B29C65/5042 ,  B29C66/1142 ,  B29C66/21 ,  B29C66/232 ,  B29C66/43 ,  B29L2031/7652 ,  B32B5/024 ,  B32B5/026 ,  B32B5/04 ,  B32B5/08 ,  B32B5/26 ,  B32B7/14 ,  B32B2262/062 ,  B32B2307/51 ,  B32B2471/02 ,  C09J7/21 ,  C09J7/29 ,  C09J7/35 ,  C09J2201/28 ,  C09J2201/36 ,  C09J2201/61 ,  C09J2203/314 ,  C09J2400/263 ,  Y10T428/24843 ,  Y10T428/24851 ,  Y10T428/2817 ,  Y10T428/2826 ,  Y10T428/2848 ,  Y10T442/2098 ,  Y10T442/2746 ,  Y10T442/277

Abstract: Carpet seam tape for joining two carpet segments comprises an elongated base layer being resilient in a transverse direction, an intervening layer applied to the base layer, and an adhesive applied to the intervening layer.

Abstract translation: 用于连接两个地毯段的地毯缝带包括在横向方向上弹性的细长基底层，施加到基底层的中间层和施加到中间层的粘合剂。

公开(公告)号：US08968853B2

公开(公告)日：2015-03-03

申请号：US13830882

申请日：2013-03-14

Applicant: Firestone Building Products Co., LLC

Inventor： Wensheng Zhou ,  Michael J. Hubbard ,  Joseph Carr

IPC: B32B9/00 ,  B32B33/00 ,  E04D5/10 ,  B32B15/06 ,  B32B15/08 ,  B32B25/08 ,  B32B25/10 ,  B32B25/18 ,  B32B27/08 ,  B32B27/12 ,  B32B27/18 ,  B32B27/30 ,  C09J7/04 ,  C09J7/02 ,  E04D5/14 ,  C08K3/04

CPC classification number: C09J7/0207 ,  B32B9/007 ,  B32B9/045 ,  B32B15/06 ,  B32B15/08 ,  B32B25/08 ,  B32B25/10 ,  B32B25/18 ,  B32B27/08 ,  B32B27/12 ,  B32B27/18 ,  B32B27/302 ,  B32B2264/108 ,  B32B2307/3065 ,  B32B2307/7242 ,  B32B2307/7246 ,  B32B2405/00 ,  B32B2419/06 ,  C08K3/04 ,  C08K7/24 ,  C09J1/00 ,  C09J7/20 ,  C09J7/21 ,  C09J7/22 ,  C09J7/38 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2205/102 ,  C09J2400/10 ,  C09J2400/226 ,  C09J2400/263 ,  C09J2409/00 ,  C09J2453/00 ,  E04D5/10 ,  E04D5/148 ,  Y10T156/10 ,  Y10T428/14 ,  Y10T428/1405 ,  Y10T428/1476 ,  Y10T428/24802 ,  Y10T428/26 ,  Y10T428/28 ,  Y10T428/2804 ,  Y10T428/2835 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/2878 ,  Y10T428/2883 ,  Y10T428/30 ,  Y10T442/2648

Abstract: A building material comprising a substrate layer and a pressure-sensitive adhesive layer, where the pressure-sensitive adhesive layer includes expandable graphite.

Abstract translation: 一种建筑材料，包括基材层和压敏粘合剂层，其中压敏粘合剂层包括可膨胀石墨。

公开(公告)号：US20140291869A1

公开(公告)日：2014-10-02

申请号：US14229003

申请日：2014-03-28

Applicant: Kyoung Soo PARK ,  Soon Young KWON ,  Ji Yeon KIM ,  Young Woo PARK ,  Jae Sun HAN ,  Ja Young HWANG

Inventor： Kyoung Soo PARK ,  Soon Young KWON ,  Ji Yeon KIM ,  Young Woo PARK ,  Jae Sun HAN ,  Ja Young HWANG

IPC: H01L23/00 ,  C09J9/02

CPC classification number: H01L24/29 ,  C08K7/16 ,  C08K9/02 ,  C09J7/00 ,  C09J7/10 ,  C09J9/02 ,  C09J11/00 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13013 ,  H01L2224/16225 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29371 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29411 ,  H01L2224/29416 ,  H01L2224/29424 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29464 ,  H01L2224/29466 ,  H01L2224/29471 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/81191 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2924/07802 ,  H01L2924/15788 ,  H05K3/323 ,  Y10T428/24959 ,  Y10T428/25 ,  Y10T428/28 ,  Y10T428/2848 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An anisotropic conductive film includes a conductive adhesive layer including conductive particles and insulating particles, and an insulating adhesive layer not including conductive particles. In the anisotropic conductive film, the conductive particles and the insulating particles of the conductive adhesive layer have a total particle density of 7.0×105/d2 to 10.0×105/d2 (particles) per square millimeter (mm2) (where d is a diameter of the conductive particles in μm).

Abstract translation: 各向异性导电膜包括导电性粘合剂层，其包含导电性粒子和绝缘性粒子，以及不含导电性粒子的绝缘性粘合剂层。 在各向异性导电膜中，导电性粘接剂层的导电性粒子和绝缘性粒子的总粒子密度为7.0×10 5 / d 2〜10 10×10 6（粒子）/平方毫米（mm 2）（d为直径 的导电粒子）。

公开(公告)号：US20140079926A1

公开(公告)日：2014-03-20

申请号：US14088237

申请日：2013-11-22

Applicant: LG CHEM, LTD.

Inventor： Jong Rok JEON ,  Se Woo YANG ,  Joon Hyung KIM ,  Yong Sung GOO ,  Suk Ky CHANG

IPC: C09J7/02

CPC classification number: C09J7/0207 ,  C09J4/00 ,  C09J7/00 ,  C09J7/10 ,  C09J7/24 ,  C09J7/38 ,  C09J133/08 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2433/00 ,  C09J2475/006 ,  Y10T428/24942

Abstract: The present application relates to a method of preparing a pressure-sensitive adhesive product and the pressure-sensitive adhesive product. According to the present application, the pressure-sensitive adhesive product having different physical properties on both surfaces, for example, having different peeling strengths on both surfaces, or having a structure in which a pressure-sensitive adhesive and a support are sequentially formed may be efficiently provided.

Abstract translation: 本申请涉及制备压敏粘合剂产品和压敏粘合剂产品的方法。 根据本申请，在两面上具有不同物理性质的粘合剂产品，例如在两个表面上具有不同的剥离强度，或具有其中压敏粘合剂和载体依次形成的结构可以是 有效提供。

公开(公告)号：US20140072794A1

公开(公告)日：2014-03-13

申请号：US13610727

申请日：2012-09-11

Applicant: Nicholas Alan Rundle ,  David Phillip Tarkington ,  Michelle Goldberg ,  Matthew P. Casebolt ,  Robert Sean Murphy

Inventor： Nicholas Alan Rundle ,  David Phillip Tarkington ,  Michelle Goldberg ,  Matthew P. Casebolt ,  Robert Sean Murphy

IPC: C09J7/02 ,  B32B38/10 ,  B32B7/12 ,  G06F1/16 ,  B26D3/00 ,  B23P11/00 ,  B26B25/00 ,  B32B37/12 ,  B32B3/26

CPC classification number: G06F1/1601 ,  C09J7/29 ,  C09J2201/36 ,  G06F1/1637 ,  G06F2200/1631 ,  Y10T29/49817 ,  Y10T83/04 ,  Y10T156/10 ,  Y10T428/249983

Abstract: Examples of computing devices including a processor, memory, and a display device housed within the same enclosure are described. In examples, the display device, which may include a cover glass, may be attached to the enclosure using a multilayer adhesive member, the multilayer adhesive including a first adhesive layer and a second adhesive layer disposed on opposite sides of a foam layer. The first and/or second adhesive layers may include two or more layers of a pressure sensitive adhesive (PSA), which may be separated using one or more adhesive carrier films. In examples, the first and/or second adhesive layers may include a low tack (e.g. removable) PSA for adhering to surfaces of the display and enclosure and for facilitation removal and re-workability of the adhesive joint.

Abstract translation: 描述了包括处于相同外壳内的处理器，存储器和显示装置的计算设备的示例。 在实例中，可以包括盖玻璃的显示装置可以使用多层粘合构件附接到外壳，多层粘合剂包括设置在泡沫层的相对侧上的第一粘合剂层和第二粘合剂层。 第一和/或第二粘合剂层可以包括两层或更多层压敏粘合剂（PSA），其可以使用一种或多种粘合剂载体膜分离。 在实例中，第一粘合剂层和/或第二粘合剂层可以包括用于粘附到显示器和外壳的表面的低粘性（例如可移除的）PSA，并且用于促进粘合剂接合的去除和再加工性。

公开(公告)号：US08652938B2

公开(公告)日：2014-02-18

申请号：US13190664

申请日：2011-07-26

Applicant: Naohide Takamoto ,  Goji Shiga ,  Fumiteru Asai

Inventor： Naohide Takamoto ,  Goji Shiga ,  Fumiteru Asai

IPC: H01L21/00

CPC classification number: C09J5/06 ,  C09J7/22 ,  C09J7/29 ,  C09J7/38 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/11 ,  C09J2205/302 ,  H01L21/563 ,  H01L21/6836 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81911 ,  H01L2224/83104 ,  H01L2924/10253 ,  Y10T428/25 ,  Y10T428/31504 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00

Abstract: The present invention relates to a thermally releasable sheet-integrated film for semiconductor back surface, which includes: a pressure-sensitive adhesive sheet including a base material layer and a pressure-sensitive adhesive layer, and a film for semiconductor back surface formed on the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet, in which the pressure-sensitive adhesive sheet is a thermally releasable pressure-sensitive adhesive sheet whose peel force from the film for semiconductor back surface decreases upon heating.

Abstract translation: 本发明涉及一种用于半导体背表面的可热分解的片状集成膜，其包括：包含基材层和压敏粘合剂层的压敏粘合片，以及在压力下形成的半导体背面的膜 粘合片的粘合片的粘合剂层，其中粘合片是其半导体背面的膜的剥离力在加热时降低的可热剥离的压敏粘合片。

公开(公告)号：US20140044957A1

公开(公告)日：2014-02-13

申请号：US14113254

申请日：2012-07-06

Applicant: Takamasa Hirayama ,  Daisuke Shimokawa

Inventor： Takamasa Hirayama ,  Daisuke Shimokawa

IPC: C09J7/02

CPC classification number: C09J7/38 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2205/11 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/68 ,  H01L23/293 ,  H01L23/3114 ,  H01L24/97 ,  H01L2924/0002 ,  Y10T428/254 ,  H01L2924/00012

Abstract: A simplified production method for a chip-shaped electronic component such as a semiconductor chip is provided.The production method of the present invention includes: attaching a pressure-sensitive adhesive sheet to a substrate, the pressure-sensitive adhesive sheet including a base, a thermally expandable pressure-sensitive adhesive layer containing thermally expandable microspheres provided on one surface of the base, and a dielectric layer including a weak pressure-sensitive adhesive layer and an adhesive layer provided on another surface of the base in this order from a side of the base, so that the thermally expandable pressure-sensitive adhesive layer is placed on a side of the substrate; attaching and fixing a plurality of chip-shaped electronic components to a surface of the pressure-sensitive adhesive sheet on a side of the adhesive layer so that electrode surfaces of the plurality of chip-shaped electronic components are placed on the side of the adhesive layer; covering an entire surface of the plurality of chip-shaped electronic components excluding fixed surfaces with a protective substance to obtain an encapsulated body including the plurality of chip-shaped electronic components; subjecting the pressure-sensitive adhesive sheet to heating treatment to cause the thermally expandable microspheres in the thermally expandable pressure-sensitive adhesive layer to expand to decrease an adhesion of the thermally expandable pressure-sensitive adhesive layer and peeling the thermally expandable pressure-sensitive adhesive layer from the substrate; peeling the weak pressure-sensitive adhesive layer from the adhesive layer to obtain a laminate of the adhesive layer and the encapsulated body; and cutting the laminate between the plurality of chip-shaped electronic components to separate individual chip-shaped electronic components.

Abstract translation: 提供了诸如半导体芯片的芯片形电子部件的简化制造方法。 本发明的制造方法包括：将压敏粘合片粘贴在基材上，所述粘合片包括基材，含有设置在基材的一个表面上的可热膨胀性微球的热膨胀性压敏粘合剂层， 以及包含弱压敏粘合剂层和介电层的介电层，该介电层从基体的一侧依次设置在基体的另一个表面上，使得可热膨胀的压敏粘合剂层位于基底的一侧 基质; 将多个芯片状电子部件附着并固定在粘合剂层一侧的粘合片的表面，使得多个芯片状电子部件的电极表面位于粘合层的一侧 ; 用保护物质覆盖除了固定表面的多个芯片形电子部件的整个表面，以获得包括多个芯片形电子部件的封装体; 对压敏粘合片进行加热处理，使热膨胀性压敏粘合剂层中的热膨胀性微球膨胀，降低热膨胀性粘合剂层的粘合性，剥离热膨胀性粘合剂层 从底物; 从粘合剂层剥离弱粘合剂层，得到粘合剂层和包封体的层压体; 并且切割多个芯片形电子部件之间的层压体以分离各个芯片形电子部件。

公开(公告)号：US20140017467A1

公开(公告)日：2014-01-16

申请号：US14008338

申请日：2012-01-24

Applicant: Youichi Inao ,  Seitaro Yamaguchi ,  Mikihiro Kashio ,  Satoshi Kawada

Inventor： Youichi Inao ,  Seitaro Yamaguchi ,  Mikihiro Kashio ,  Satoshi Kawada

IPC: C09J7/02

CPC classification number: C09J7/38 ,  B32B7/12 ,  B32B27/36 ,  B32B2405/00 ,  C08G18/4825 ,  C08G18/6216 ,  C08G18/6229 ,  C08G18/73 ,  C08G18/8029 ,  C08G2170/40 ,  C09J133/064 ,  C09J175/04 ,  C09J2201/36 ,  C09J2201/622 ,  C09J2423/00 ,  C09J2433/00 ,  C09J2475/00 ,  Y10T428/24959 ,  Y10T428/2848 ,  C08G18/10 ,  C08G18/3206

Abstract: The present invention relates to a pressure sensitive adhesive sheet including a pressure sensitive adhesive layer on at least one surface of a base material, wherein the pressure sensitive adhesive layer is made of a two-layer structure of a first pressure sensitive adhesive layer and a second pressure sensitive adhesive layer in this order from the side of the base material; a first pressure sensitive adhesive constituting the first pressure sensitive adhesive layer has a loss tangent (tan δ) value at 0° C. of 0.25 or more and a storage elastic modulus value at 0° C. of from 0.01 to 0.80 MPa; and a resin component contained in a second pressure sensitive adhesive constituting the second pressure sensitive adhesive layer contains from 10 to 100 t by mass of an acrylic copolymer having a crosslinkable functional group. The pressure sensitive adhesive sheet according to the present invention exhibits an excellent adhesive strength even when the pressure sensitive adhesive layer is reduced in thickness.

Abstract translation: 本发明涉及一种在基材的至少一个表面上包含压敏粘合剂层的压敏粘合片，其中该压敏粘合剂层由第一压敏粘合剂层和第二粘合剂层的两层结构制成 压敏粘合剂层从基材的侧面依次依次为： 构成第一压敏粘合剂层的第一压敏粘合剂在0℃下的损耗角正切（tanδ）值为0.25以上，在0℃下的储能弹性模量值为0.01〜0.80MPa; 包含在构成第二压敏粘合剂层的第二压敏粘合剂中的树脂组分含有10至100质量份具有可交联官能团的丙烯酸共聚物。 根据本发明的压敏粘合片即使当压敏粘合剂层的厚度减小时也显示出优异的粘合强度。