公开(公告)号：US20120174376A1

公开(公告)日：2012-07-12

申请号：US13348461

申请日：2012-01-11

Applicant: Michael HORTIG ,  Peter KUNERT

Inventor： Michael HORTIG ,  Peter KUNERT

IPC: B23P17/04

CPC classification number: G01P1/023 ,  G01C25/00 ,  H05K3/301 ,  H05K2201/10151 ,  H05K2201/10325 ,  H05K2201/10484 ,  Y10T29/49117 ,  Y10T29/49826 ,  Y10T29/4998

Abstract: A base element having a first and a second surface, the first surface being designed to receive a module housing and the second surface being designed to be mounted on a carrier element, and in addition an angle between 0 and 90 degrees being provided between a first face normal of the first surface and a second face normal of the second surface.

Abstract translation: 具有第一表面和第二表面的基体元件，所述第一表面被设计成容纳模块壳体，并且所述第二表面设计成安装在载体元件上，此外，在第一和第二表面之间设置有0度到90度之间的角度， 第一表面的法线和第二表面的第二面法线。

公开(公告)号：US08159827B2

公开(公告)日：2012-04-17

申请号：US12744295

申请日：2008-12-22

Applicant: Hitoshi Kidokoro

Inventor： Hitoshi Kidokoro

IPC: H05K9/00

CPC classification number: H05K1/18 ,  H05K2201/10454 ,  H05K2201/10484 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10651 ,  Y10T29/4913

Abstract: When U-shape formed electronic components having an axial lead shape are mounted upright on a printed board, two U-shape formed electronic components having an axial lead shape are arranged so as not to be in the same straight line, and a wiring pattern is formed in a state where bent-side lead wires have the same electric potential, and the electronic components are inclined so as to place the bent-side lead wires close to each other, whereby the electronic components that tend to fall in the inclined direction can be mutually supported by the bent-side lead wires. Thus, the electronic components can be prevented from falling without spoiling a heat dissipation performance of the electronic component and the board, and without greatly deteriorating an assembly performance of the board.

Abstract translation: 当具有轴向引线形状的U形形成的电子部件竖直地安装在印刷电路板上时，具有轴向引线形状的两个U形成形的电子部件被布置成不成为相同的直线，并且布线图案 形成在弯曲侧引线具有相同电位的状态下，并且电子部件倾斜以使弯曲侧引线彼此靠近，从而倾斜倾斜方向的电子部件可以 由弯曲侧引线相互支撑。 因此，可以防止电子部件落下而不会破坏电子部件和电路板的散热性能，并且不会极大地降低电路板的组装性能。

公开(公告)号：US08080874B1

公开(公告)日：2011-12-20

申请号：US11855826

申请日：2007-09-14

Applicant: Jeremy Werner ,  Daniel L. Rosenband ,  Jeremy Matthew Plunkett ,  William L. Schmidt ,  David T. Wang ,  Wael O. Zohni ,  Philip Arnold Ferolito ,  Michael John Sebastian Smith ,  Suresh Natarajan Rajan ,  Joseph C. Fjelstad

Inventor： Jeremy Werner ,  Daniel L. Rosenband ,  Jeremy Matthew Plunkett ,  William L. Schmidt ,  David T. Wang ,  Wael O. Zohni ,  Philip Arnold Ferolito ,  Michael John Sebastian Smith ,  Suresh Natarajan Rajan ,  Joseph C. Fjelstad

IPC: H01L23/34 ,  H01L23/48

CPC classification number: H05K1/181 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/5387 ,  H01L24/16 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/1203 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1304 ,  H01L2924/14 ,  H01L2924/1424 ,  H01L2924/1436 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K1/0281 ,  H05K1/141 ,  H05K1/147 ,  H05K2201/10454 ,  H05K2201/10484 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/2018 ,  Y02P70/611 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A system, method, and apparatus are included for providing additional space between an integrated circuit package and a circuit board. An integrated circuit package is provided including a plurality of integrated circuit package contacts. Also provided is a circuit board in electrical communication with the integrated circuit package. Further, the integrated circuit package, the integrated circuit contacts, and/or the circuit board is configured for providing additional space between the integrated circuit package and the circuit board to position at least a portion of at least one component between the integrated circuit package and the circuit board.

Abstract translation: 包括系统，方法和装置，用于在集成电路封装和电路板之间提供额外的空间。 提供了包括多个集成电路封装触点的集成电路封装。 还提供了与集成电路封装电通信的电路板。 此外，集成电路封装，集成电路触点和/或电路板被配置为在集成电路封装和电路板之间提供额外的空间，以将至少一部分的至少一部分置于集成电路封装和 电路板。

公开(公告)号：US08045334B2

公开(公告)日：2011-10-25

申请号：US12090884

申请日：2006-10-13

Applicant: Maurice Alexander Hugo Donners

Inventor： Maurice Alexander Hugo Donners

IPC: H05K7/00 ,  H05K7/10 ,  H05K1/03

CPC classification number: H05K3/301 ,  H05K3/3442 ,  H05K2201/10106 ,  H05K2201/10325 ,  H05K2201/10484 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A supporting component (1) adapted for being mounted on a substrate (11) and for serving as a support for a surface mounted device (15) comprises a body (2) having a first surface (3) adapted for being mounted on the substrate (11), and a second surface (4) being adapted for supporting the surface mounted device (15). The second surface (4) is inclined in relation to the first surface (3). The supporting component (1) further comprises a first supporting component conductor (6) adapted for forming an electrical contact between a first substrate conductor (12) of the substrate (11) and a first electrode (16) of the surface mounted device (15). In a method of mounting a surface mounted device (15) in an inclined manner on a substrate (11) the supporting component (1) is mounted on the substrate (11) with the surface mounted device (15) on top of it.

Abstract translation: 适于安装在基板（11）上并用作表面安装装置（15）的支撑件的支撑部件（1）包括具有适于安装在基板上的第一表面（3）的主体（2） （11），以及适于支撑所述表面安装装置（15）的第二表面（4）。 第二表面（4）相对于第一表面（3）倾斜。 支撑部件（1）还包括适于在基板（11）的第一基板导体（12）和表面安装装置（15）的第一电极（16）之间形成电接触的第一支撑部件导体（6） ）。 在将表面安装的装置（15）以倾斜的方式安装在基板（11）上的方法中，支撑部件（1）安装在基板（11）上，表面安装装置（15）位于其上。

公开(公告)号：US07897883B2

公开(公告)日：2011-03-01

申请号：US12138592

申请日：2008-06-13

Applicant: Yueh-Hsun Yang

Inventor： Yueh-Hsun Yang

IPC: H05K7/14

CPC classification number: H05K3/301 ,  F21V19/0025 ,  F21Y2115/10 ,  H05K2201/10106 ,  H05K2201/10295 ,  H05K2201/10484 ,  H05K2201/10962

Abstract: A lead-mounting seat includes a conductive seat body including a lead-mounting plate and spaced apart first and second insert legs that extend from the lead-mounting plate and that have different geometric shapes. The lead-mounting plate is formed with a plurality of lead-mounting holes. Each of the first and second insert legs has a connecting end connected to the lead-mounting plate, and a free end opposite to the connecting end. Each of the first and second insert legs is reduced in width from the connecting end to the free end.

Abstract translation: 引线安装座包括导电座体，其包括引线安装板和从引线安装板延伸并具有不同几何形状的间隔开的第一和第二插入腿。 引线安装板形成有多个引线安装孔。 第一和第二插入腿中的每一个具有连接到引线安装板的连接端和与连接端相对的自由端。 第一和第二插入腿中的每一个从连接端到自由端的宽度减小。

公开(公告)号：US07717587B2

公开(公告)日：2010-05-18

申请号：US11964627

申请日：2007-12-26

Applicant: Jian-Shian Lin ,  Chieh-Lung Lai

Inventor： Jian-Shian Lin ,  Chieh-Lung Lai

IPC: F21V21/00

CPC classification number: H05K3/301 ,  F21K9/00 ,  F21Y2107/50 ,  F21Y2115/10 ,  H05K2201/10106 ,  H05K2201/10484 ,  H05K2201/10606

Abstract: A light source device is disclosed, which involves forming a plurality of carrier planes on a substrate with at least one of the carrier planes forming an angle relative to the substrate, and respectively mounting LEDs on the carrier planes and electrically connecting the LEDs with the carrier planes so as to obtain a preferred light distribution effect, thereby eliminating the need of additional light control element in the prior art and enhancing light emitting efficiency of the light source device.

Abstract translation: 公开了一种光源装置，其涉及在基板上形成多个载体平面，其中至少一个载体平面相对于基板形成一角度，并且分别将LED安装在载体平面上并将LED与载体电连接 平面，从而获得优选的配光效果，从而消除了现有技术中额外的光控制元件的需要，并提高了光源装置的发光效率。

公开(公告)号：US07546766B2

公开(公告)日：2009-06-16

申请号：US11898203

申请日：2007-09-10

Applicant: Wolfgang Jeitner ,  Thomas Ofenhitzer

Inventor： Wolfgang Jeitner ,  Thomas Ofenhitzer

IPC: G01W1/00

CPC classification number: G01J1/04 ,  G01J1/02 ,  G01J1/0204 ,  G01J1/4228 ,  G01J2001/4266 ,  H05K1/0284 ,  H05K2201/09118 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10484

Abstract: A sensor arrangement is provided in a motor vehicle for determining solar radiation incident on the motor vehicle, having at least one electro-optic component that is fastened to a one-piece or multi-piece support using MID technology.

Abstract translation: 传感器装置设置在机动车辆中，用于确定入射到机动车辆上的太阳辐射，其具有至少一个电光部件，该电光部件使用MID技术固定到单件或多件式支架上。

公开(公告)号：US20080250377A1

公开(公告)日：2008-10-09

申请号：US11696659

申请日：2007-04-04

Applicant: Steven C. Bird ,  Varoujan Malian ,  Mudasir Ahmad ,  Charles H. Casale ,  Danlu Tang

Inventor： Steven C. Bird ,  Varoujan Malian ,  Mudasir Ahmad ,  Charles H. Casale ,  Danlu Tang

IPC: G06F17/50 ,  G01R31/00

CPC classification number: G01R31/2818 ,  H05K1/0231 ,  H05K1/0237 ,  H05K1/0262 ,  H05K1/0268 ,  H05K1/113 ,  H05K1/181 ,  H05K3/3421 ,  H05K3/3457 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4623 ,  H05K2201/0367 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09627 ,  H05K2201/09663 ,  H05K2201/10333 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2201/10545 ,  H05K2201/10734 ,  Y02P70/611

Abstract: Methods and apparatus for accessing a high speed signal routed on a conductive trace on an internal layer of a printed circuit board (PCB) using high density interconnect (HDI technology) are provided. The conductive trace may be coupled to a microvia (μVia) having a conductive dome disposed above the outer layer pad of the μVia. In-circuit test (ICT) fixtures or high speed test probes may interface with the conductive dome to test the high speed signal with decreased reflection loss and other parasitic effects when compared to conventional test points utilizing plated through-hole (PTH) technology.

Abstract translation: 提供了使用高密度互连（HDI技术）访问在印刷电路板（PCB）的内层上的导电迹线上路由的高速信号的方法和装置。 导电迹线可以耦合到具有设置在muVia的外层焊盘上方的导电圆顶的微孔（muVia）。 与使用电镀通孔（PTH）技术的常规测试点相比，在线测试（ICT）固定装置或高速测试探头可与导电圆顶接口以测试具有降低的反射损耗和其他寄生效应的高速信号。

公开(公告)号：US20080236880A1

公开(公告)日：2008-10-02

申请号：US12056854

申请日：2008-03-27

Applicant: Hirotoshi OZAKI ,  Akiko MORIMOTO ,  Tetsuya YAMASHITA

Inventor： Hirotoshi OZAKI ,  Akiko MORIMOTO ,  Tetsuya YAMASHITA

IPC: H01R12/06 ,  H05K1/00

CPC classification number: H01R12/7082 ,  H05K1/182 ,  H05K3/3421 ,  H05K2201/09836 ,  H05K2201/10037 ,  H05K2201/10484 ,  H05K2201/10651 ,  H05K2201/10856 ,  H05K2203/0195 ,  H05K2203/082

Abstract: A lead-attached electrical element and a mounting board to which the lead-attached electrical element is mounted both contribute to a reduction in the size of the mounting board as well as facilitate rework. The lead-attached electrical element is constituted from an electrical element and two leads. Each lead includes a main portion which is bonded to a respective electrode face of the electrical element, and a bent portion which is inclined with respect to the main portion. The mounting board is constituted from a PC (printed circuit) board and the lead-attached electrical element. Two conductive lands are provided on a surface of the PC board. The lead-attached electrical element has been inserted into an aperture in the PC board, and bent portions of the leads attached to the electrical element are bonded to the conductive lands so that the electrical element is suspended in the aperture by the leads.

Abstract translation: 安装有引线的电气元件的引线附接电气元件和安装板都有助于减小安装板的尺寸并且便于返工。 引线连接的电气元件由电气元件和两个引线构成。 每个引线包括结合到电气元件的相应电极面的主要部分和相对于主要部分倾斜的弯曲部分。 安装板由PC（印刷电路板）和带引线的电气元件构成。 在PC板的表面上设置两个导电焊盘。 引线连接的电气元件已经插入到PC板的孔中，并且附接到电气元件的引线的弯曲部分被接合到导电焊盘，使得电气元件通过引线悬挂在孔中。

公开(公告)号：US20080219023A1

公开(公告)日：2008-09-11

申请号：US12072542

申请日：2008-02-27

Applicant: Manfred J. Groben ,  Peter Leng

Inventor： Manfred J. Groben ,  Peter Leng

IPC: F21V8/00 ,  H05K1/18 ,  H05K7/20

CPC classification number: H05K3/143 ,  H05K1/0284 ,  H05K3/202 ,  H05K3/301 ,  H05K2201/049 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10484

Abstract: In a printed circuit board for fitting with a three-dimensionally shaped punched grid comprising a plurality of current paths partially encapsulated by plastic and at least one electric or electronic component the punched grid is of angular construction. In this case free end faces of the current paths of the punched grid extending over the legs make contact with the printed circuit board and between the current paths the component is arranged in a defined orientation.

Abstract translation: 在用于与三维形状的冲压格栅配合的印刷电路板中，其包括由塑料部分封装的多个电流路径和至少一个电子或电子部件，冲孔格栅是有角度的结构。 在这种情况下，在腿部延伸的冲压网格的电流路径的自由端面与印刷电路板接触，并且在电流路径之间，部件以限定的方向布置。