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    Encapsulated dies with enhanced thermal performance
    161.
    发明授权
    Encapsulated dies with enhanced thermal performance 有权

    公开(公告)号：US09929024B2

    公开(公告)日：2018-03-27

    申请号：US15173037

    申请日：2016-06-03

    Applicant: RF Micro Devices, Inc.

    Inventor： Thomas Scott Morris ,  David Jandzinski ,  Stephen Parker ,  Jon Chadwick ,  Julio C. Costa

    IPC: H01L23/29 ,  H01L21/56 ,  H01L25/065 ,  H01L23/31 ,  H01L23/373 ,  H01L23/433 ,  H01L23/00

    Abstract: The present disclosure relates to enhancing the thermal performance of encapsulated flip chip dies. According to an exemplary process, a plurality of flip chip dies are attached on a top surface of a carrier, and a first mold compound is applied over the top surface of the carrier to encapsulate the plurality of flip chip dies. The first mold compound is thinned down to expose a substrate of each flip chip die and the substrate of each flip chip die is then substantially etched away to provide an etched flip chip die that has an exposed surface at the bottom of a cavity. Next, a second mold compound with high thermal conductivity is applied to substantially fill each cavity and the top surface of the second mold compound is planarized. Finally, the encapsulated etched flip chip dies can be marked, singulated, and tested as a module.

    RF diplexer
    163.
    发明授权
    RF diplexer 有权

    公开(公告)号：US09899986B2

    公开(公告)日：2018-02-20

    申请号：US14547502

    申请日：2014-11-19

    Applicant: RF Micro Devices, Inc.

    Inventor： Nadim Khlat ,  Marcus Granger-Jones

    IPC: H03H7/46 ,  H03H7/48 ,  H04B1/00 ,  H04B1/40 ,  H04B1/50 ,  H04B10/556 ,  H04L5/08 ,  H04L27/20

    CPC classification number: H03H7/463 ,  H03H7/48 ,  H04B1/0057 ,  H04B1/40 ,  H04B1/50 ,  H04B10/556 ,  H04L5/08 ,  H04L27/2085

    Abstract: Embodiments of a tunable radio frequency (RF) diplexer and methods of operating the same are disclosed. In one embodiment, the RF diplexer includes a first hybrid coupler, a second hybrid coupler, an RF filter circuit, and a phase inversion component. Both the RF filter circuit and the phase inversion component are connected between the first hybrid coupler and the second hybrid coupler. The phase inversion component is configured to provide approximately a differential phase. The RF filter circuit is configured to provide a passband and a notch. The RF filter circuit is tunable to provide the notch on both a high-frequency side of the passband and a low frequency side of the passband. Accordingly, the tunable RF diplexer provides lower insertion losses and higher isolation regardless of whether the one of the diplexed frequency bands is set at higher frequencies or lower frequencies than the other diplexed frequency band.

    Encapsulated dies with enhanced thermal performance
    165.
    发明授权
    Encapsulated dies with enhanced thermal performance 有权

    公开(公告)号：US09892937B2

    公开(公告)日：2018-02-13

    申请号：US15173037

    申请日：2016-06-03

    Applicant: RF Micro Devices, Inc.

    Inventor： Thomas Scott Morris ,  David Jandzinski ,  Stephen Parker ,  Jon Chadwick ,  Julio C. Costa

    IPC: H01L23/29 ,  H01L21/56 ,  H01L25/065 ,  H01L23/31 ,  H01L23/373 ,  H01L23/433 ,  H01L23/00

    Abstract: The present disclosure relates to enhancing the thermal performance of encapsulated flip chip dies. According to an exemplary process, a plurality of flip chip dies are attached on a top surface of a carrier, and a first mold compound is applied over the top surface of the carrier to encapsulate the plurality of flip chip dies. The first mold compound is thinned down to expose a substrate of each flip chip die and the substrate of each flip chip die is then substantially etched away to provide an etched flip chip die that has an exposed surface at the bottom of a cavity. Next, a second mold compound with high thermal conductivity is applied to substantially fill each cavity and the top surface of the second mold compound is planarized. Finally, the encapsulated etched flip chip dies can be marked, singulated, and tested as a module.

    RF ladder filter with simplified acoustic RF resonator parallel capacitance compensation
    166.
    发明授权
    RF ladder filter with simplified acoustic RF resonator parallel capacitance compensation 有权

    公开(公告)号：US09837984B2

    公开(公告)日：2017-12-05

    申请号：US15004084

    申请日：2016-01-22

    Applicant: RF Micro Devices, Inc.

    Inventor： Nadim Khlat ,  Andrew F. Folkmann ,  Robert Aigner ,  Marcus Granger-Jones

    IPC: H03H9/54 ,  H03H9/64 ,  H03H9/60

    CPC classification number: H03H9/542 ,  H03H9/605 ,  H03H9/6483 ,  H03H9/6489

    Abstract: An RF ladder filter having a parallel capacitance compensation circuit is disclosed. The parallel capacitance compensation circuit is made up of a first inductive element with a first T-terminal and a first end coupled to a first ladder terminal and a second inductive element with a second T-terminal that is coupled to the first T-terminal of the first inductive element and a second end coupled to a second ladder terminal. Further included is a compensating acoustic RF resonator (ARFR) having a fixed node terminal and a third T-terminal that is coupled to the first T-terminal of the first inductive element and the second T-terminal of the second inductive element, and a finite number of series-coupled ladder ARFRs, wherein the parallel capacitance compensation circuit is coupled across one of the finite number of series-coupled ARFRs by way of the first ladder terminal and the second ladder terminal.

    Reconfigurable directional coupler
    168.
    发明授权
    Reconfigurable directional coupler 有权

    公开(公告)号：US09799444B2

    公开(公告)日：2017-10-24

    申请号：US14840216

    申请日：2015-08-31

    Applicant: RF Micro Devices, Inc.

    Inventor： Marcus Granger-Jones ,  John Robert Siomkos ,  Jeppe Korshøj Bendixen ,  John Avery Capwell ,  Jayanti Jaganatha Rao

    IPC: H01P5/18 ,  H01F38/14 ,  H03H7/46 ,  H01P1/10 ,  H03H7/48 ,  H01F21/12

    CPC classification number: H01F38/14 ,  H01F21/12 ,  H01F2038/146 ,  H03H7/465 ,  H03H7/48

    Abstract: This disclosure relates generally to directional couplers. In one embodiment, a directional coupler includes a first port, a second port, a third port, a first inductive element, a second inductive element, a first switchable path, and a second switchable path. The first inductive element is coupled between the first port and the second port, while the second inductive element is mutually coupled to the first inductive element. The first switchable path is configured to be opened and closed, wherein the first switchable path is coupled between a first location of the second inductive element and the third port. The second switchable path is configured to be opened and closed, wherein the second switchable path is coupled between a second location of the second inductive element and the third port. In this manner, a directivity of the directional coupler can be switched between a forward direction and a reverse direction.

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