公开(公告)号：US20120216948A1

公开(公告)日：2012-08-30

申请号：US13503940

申请日：2010-10-22

Applicant: Isao Hirose ,  Shuzo Fujiwara ,  Yuuta Shimazaki ,  Tetsuya Hirose

Inventor： Isao Hirose ,  Shuzo Fujiwara ,  Yuuta Shimazaki ,  Tetsuya Hirose

IPC: B32B37/06

CPC classification number: C09J7/38 ,  B32B37/15 ,  B32B2310/0831 ,  C09J7/10 ,  C09J2201/36 ,  C09J2205/31

Abstract: Provided is a process for producing a pressure-sensitive adhesive sheet by laminating layers of active-energy-ray-curable compositions and irradiating the laminate with an active energy ray. The processes gives a pressure-sensitive adhesive sheet with less defects at low production cost and is applicable to the production of pressure-sensitive adhesive sheets of various kinds. The process includes: Steps A1 and A2 of applying an active-energy-ray-curable composition to one surface of a first carrier and to one surface of a second carrier using a die coater to form coated layers thereon; Step B of placing the resulting first and second carriers so that the coating-layer-side surfaces of the carriers face each other, and introducing an active-energy-ray-curable composition into between the first and second carriers; and Step C of irradiating a multilayer assemblage with an active energy ray, the multilayer assemblage obtained in Step B and including the active-energy-ray-curable compositions between the first and second carriers.

Abstract translation: 提供了一种通过层叠活性能量射线固化性组合物并用活性能量射线照射层压体来制造压敏粘合片的方法。 这些方法在低生产成本下给出了具有较少缺陷的压敏粘合片，并且可用于生产各种压敏粘合片。 该方法包括：使用模涂机将活性能量射线固化组合物施加到第一载体的一个表面和第二载体的一个表面上以在其上形成涂层的步骤A1和A2; 步骤B将所得到的第一和第二载体放置成使得载体的涂层侧表面彼此面对，并将活性能量射线固化组合物引入第一和第二载体之间; 以及步骤C，用活性能量射线照射多层组合物，即在步骤B中得到的多层组合物，并且在第一和第二载体之间包含活性能量射线可固化组合物。

公开(公告)号：US08178420B2

公开(公告)日：2012-05-15

申请号：US12636869

申请日：2009-12-14

Applicant: Takeshi Matsumura ,  Masaki Mizutani

Inventor： Takeshi Matsumura ,  Masaki Mizutani

IPC: H01L21/00

CPC classification number: H01L24/29 ,  C09J7/20 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/00 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/3025 ,  Y10T428/218 ,  Y10T428/28 ,  Y10T428/2848 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A dicing/die-bonding film including a pressure-sensitive adhesive layer (2) on a supporting base material (1) and a die-bonding adhesive layer (3) on the pressure-sensitive adhesive layer (2), wherein a releasability in an interface between the pressure-sensitive adhesive layer (2) and the die-bonding adhesive layer (3) is different between an interface (A) corresponding to a work-attaching region (3a) in the die-bonding adhesive layer (3) and an interface (B) corresponding to a part or a whole of the other region (3b), and the releasability of the interface (A) is higher than the releasability of the interface (B). The dicing/die-bonding film is excellent in balance between retention in dicing a work and releasability in releasing its diced chipped work together with the die-bonding adhesive layer.

Abstract translation: 一种在支撑基材（1）上具有压敏粘合剂层（2）和压敏粘合剂层（2）上的芯片粘合层（3）的切割/芯片接合膜，其中， 粘合剂层（2）与芯片粘合层（3）之间的界面在与芯片粘合层（3）中的工件附着区域（3a）相对应的界面（A）之间是不同的， 以及对应于另一区域（3b）的一部分或全部的界面（B），并且界面（A）的释放性高于界面（B）的剥离性。 切割/芯片接合膜在切割工件的保持性和脱模性之间的平衡优异，并且与芯片粘合层一起释放切割的切片工作。

公开(公告)号：US20120107576A1

公开(公告)日：2012-05-03

申请号：US13347432

申请日：2012-01-10

Applicant: Shuhei MURATA ,  Takeshi MATSUMURA ,  Koji MIZUNO ,  Fumiteru ASAI

Inventor： Shuhei MURATA ,  Takeshi MATSUMURA ,  Koji MIZUNO ,  Fumiteru ASAI

IPC: B32B7/12 ,  B05D3/06 ,  B05D3/02 ,  B05D5/08

CPC classification number: H01L21/67132 ,  B32B7/12 ,  C09J7/22 ,  C09J7/38 ,  C09J2201/36 ,  C09J2203/326 ,  H01L24/45 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T428/24331 ,  Y10T428/24777 ,  Y10T428/24802 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The present invention aims to provide a tape for holding a chip that makes pasting and peeling of a chip-shaped workpiece easy. It is a tape for holding a chip having a configuration in which a pressure-sensitive adhesive layer is formed on a base material, wherein the pressure-sensitive adhesive layer has a chip-shaped workpiece pasting region onto which a chip-shaped workpiece is pasted and a frame pasting region onto which a mount frame is pasted, and that is used by pasting the mount frame to the frame pasting region, wherein the 180-degree peeling adhesive power of the pressure-sensitive adhesive layer to a silicon mirror wafer at the frame pasting region is 5 times or more the 180-degree peeling adhesive power of the pressure-sensitive adhesive layer to a silicon mirror wafer at the chip-shaped workpiece pasting region.

Abstract translation: 本发明的目的在于提供一种用于保持芯片的带状物，其使得片状工件的粘贴和剥离变得容易。 用于保持具有在基材上形成压敏粘合剂层的构造的芯片的胶带，其中粘合剂层具有将片状工件粘贴到其上的切屑状工件粘贴区域 以及粘贴安装框架的框架粘贴区域，并且通过将安装框架粘贴到框架粘贴区域来使用，其中压敏粘合剂层的180度剥离粘合力到硅镜晶片 框状粘贴区域是片状工件粘贴区域的粘合剂层向硅镜面晶片的180度剥离粘合力的5倍以上。

公开(公告)号：US20120104134A1

公开(公告)日：2012-05-03

申请号：US13131699

申请日：2009-11-24

Applicant: Sadahilio Misumi

Inventor： Sadahilio Misumi

IPC: B65H18/28 ,  H01L23/00

CPC classification number: H01L21/561 ,  C09J7/20 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/67132 ,  H01L21/6835 ,  H01L23/3121 ,  H01L24/27 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68336 ,  H01L2224/27436 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29318 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29371 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/0635 ,  H01L2924/066 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2924/0532 ,  H01L2924/04642 ,  H01L2924/05042 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention relates to a semiconductor device manufacturing film roll, comprising a winding core in a cylindrical form, and a semiconductor device manufacturing film which is wound around the winding core into a roll form, wherein the diameter of the winding core is from 7.5 to 15.5 cm.

Abstract translation: 本发明涉及一种半导体器件制造薄膜卷，其包括圆柱形的卷绕芯和卷绕在卷芯上的半导体器件制造膜，其中绕组芯的直径为7.5至 15.5厘米

公开(公告)号：US08043698B2

公开(公告)日：2011-10-25

申请号：US11700142

申请日：2007-01-31

Applicant: Yasumasa Morishima ,  Kenji Kita ,  Shinichi Ishiwata ,  Takanori Yamakawa

Inventor： Yasumasa Morishima ,  Kenji Kita ,  Shinichi Ishiwata ,  Takanori Yamakawa

IPC: B32B7/12 ,  B32B15/04

CPC classification number: H01L24/29 ,  C09J7/20 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  C09J2479/08 ,  H01L21/561 ,  H01L21/563 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/83 ,  H01L24/90 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2224/1134 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2224/83851 ,  H01L2224/90 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  Y10T156/1052 ,  Y10T156/1062 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2852 ,  H01L2224/13099 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0665

Abstract: A wafer-processing tape, having a removable adhesive layer (2), and an adhesive layer (3), formed on a substrate film (1), wherein the tape is used in a process involving the steps of: grinding a back face of a wafer circuit substrate (5) having convex-type metal electrodes (4), and dicing the wafer circuit substrate into chips, in a state that the tape is adhered to the wafer circuit substrate; and picking up the chips, in which the chips are picked up in a state that the adhesive layer (3) is peeled from the substrate film (1) but is bonded to the individual chip.

Abstract translation: 一种形成在基片（1）上的具有可去除的粘合剂层（2）和粘合剂层（3）的晶片加工带，其特征在于，该方法包括以下步骤：研磨 具有凸型金属电极（4）的晶片电路基板（5），并且将所述晶片电路基板切割成芯片，所述芯片粘贴在所述晶片电路基板上。 并且拾取芯片，其中粘合剂层（3）从基材膜（1）剥离但结合到单个芯片的状态下拾取芯片。

公开(公告)号：US20110256360A1

公开(公告)日：2011-10-20

申请号：US12763719

申请日：2010-04-20

Applicant: DAN JEFFERY

Inventor： DAN JEFFERY

IPC: B32B3/00

CPC classification number: B32B7/12 ,  B32B27/16 ,  B32B27/30 ,  B32B27/308 ,  B32B2307/412 ,  B44C1/1733 ,  C08K5/053 ,  C08L31/04 ,  C08L39/06 ,  C09J7/38 ,  C09J133/02 ,  C09J2201/36 ,  C09J2205/102 ,  C09J2433/00 ,  Y10T428/24802

Abstract: A reusable body decoration includes a decorative member, a multilayer adhesive adhered to one side of the decorative member, the multilayer adhesive having a first layer having a relatively low peel strength for removably contacting a user's skin and a second layer having a relatively high peel strength for contacting one side of the decorative member, the first and second layer being laminated.

Abstract translation: 可再利用的身体装饰包括装饰构件，粘附到装饰构件的一侧的多层粘合剂，多层粘合剂具有用于可剥离地接触使用者皮肤的相对较低剥离强度的第一层和具有较高剥离强度的第二层 用于接触装饰构件的一侧，第一和第二层被层压。

公开(公告)号：US08029911B2

公开(公告)日：2011-10-04

申请号：US12847819

申请日：2010-07-30

Applicant: Satoyuki Nomura ,  Tohru Fujinawa ,  Hiroshi Ono ,  Hoko Kanazawa ,  Masami Yusa

Inventor： Satoyuki Nomura ,  Tohru Fujinawa ,  Hiroshi Ono ,  Hoko Kanazawa ,  Masami Yusa

IPC: H05K3/32 ,  H05K1/14 ,  H01L21/60 ,  H01L21/50 ,  C09J7/00

CPC classification number: C09J7/10 ,  C08L61/00 ,  C09J2201/36 ,  C09J2201/602 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29469 ,  H01L2224/83851 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H05K3/323 ,  H05K3/361 ,  Y10T428/12014 ,  Y10T428/2817 ,  Y10T428/31504 ,  Y10T428/31554 ,  Y10T428/31573 ,  Y10T428/31609 ,  Y10T428/31855 ,  Y10T428/31909 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00

Abstract: There are provided an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes thereon opposed to each other and to electrically connect the circuit electrodes on the substrates opposed to each other to the pressurizing direction under pressure, wherein the adhesive contains a compound having an acid equivalent of 5 to 500 KOH mg/g, and an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes opposed to each other and to electrically connect the electrodes on the substrate opposed to each other to the pressurizing direction under pressure, wherein the adhesive comprises a first adhesive layer and a second adhesive layer, and a glass transition temperature of the first adhesive layer after pressure connection is higher than the glass transition temperature of the second adhesive layer after pressure connection.

Abstract translation: 提供了一种用于连接电路的粘合剂，该电路将介于具有彼此相对的电路电极的基板之间，并且将彼此相对的基板上的电路电极与加压方向电压连接，其中粘合剂包含具有 酸当量为5至500KOHmg / g，以及用于连接待彼此相对的电路电极的基板之间的电路的粘合剂，并将彼此相对的基板上的电极与压力方向压力连接 其中所述粘合剂包括第一粘合剂层和第二粘合剂层，并且压力连接之后的第一粘合剂层的玻璃化转变温度高于压力连接之后的第二粘合剂层的玻璃化转变温度。

公开(公告)号：US20110091811A1

公开(公告)日：2011-04-21

申请号：US12757229

申请日：2010-04-09

Applicant: Sun Jin SONG ,  Chul Ho JEONG ,  Yong Seok HAN ,  Yi Yeol LYU

Inventor： Sun Jin SONG ,  Chul Ho JEONG ,  Yong Seok HAN ,  Yi Yeol LYU

IPC: G03F7/20 ,  B05D1/36 ,  H05K3/00 ,  H01L21/46 ,  G03C1/00

CPC classification number: H05K3/305 ,  C09J7/35 ,  C09J2201/28 ,  C09J2201/36 ,  C09J2433/00 ,  G03F7/027 ,  G03F7/033 ,  G03F7/035 ,  G03F7/09 ,  G03F7/40 ,  H01L24/28 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01072 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K2201/0195 ,  H05K2203/0525 ,  Y02P70/613 ,  H01L2924/01083 ,  H01L2924/00

Abstract: A patternable adhesive film is formed in a double-layered structure of an adhesive layer having patternability and an adhesive layer having both adhesion and developability. Thus, the double-layered patternable adhesive film can effectively have both patternability and adhesion.

Abstract translation: 以具有图案性的粘合剂层和具有粘合性和显影性的粘合剂层的双层结构形成可图案化的粘合剂膜。 因此，双层可图案的粘合剂膜可以有效地具有图案化和粘附性。

公开(公告)号：US07901768B2

公开(公告)日：2011-03-08

申请号：US10571495

申请日：2004-09-09

Applicant: Hiroyuki Kumakura

Inventor： Hiroyuki Kumakura

IPC: B32B7/12 ,  B32B27/38 ,  B32B27/42

CPC classification number: H05K3/323 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/36 ,  C09J2203/326 ,  H01R4/04 ,  H05K2203/1189 ,  Y10T428/14 ,  Y10T428/1471 ,  Y10T428/1476 ,  Y10T428/28 ,  Y10T428/2826 ,  Y10T428/2848 ,  Y10T428/287

Abstract: A multilayer anisotropic conductive adhesive a plurality of adhesive layers that are laminated, each of which contains an insulating resin and a hardening agent. The conductive particles are contained either in a first plurality of adhesive layers or in a second plurality of adhesive layers, and at least the top or bottom adhesive layer has the DSC (differential scanning calorimetry) exothermic peak temperature of 130° C. or more and 180° C. or less. Also, a connection structure is constructed in which a first electronic component having an electrode and an insulating film on the surface thereof and a second electronic component that has an electrode on the surface thereof are electrically connected through the multilayer anisotropic conductive adhesive.

Abstract translation: 多层各向异性导电粘合剂，多层粘合剂层，每层粘合层含有绝缘树脂和硬化剂。 导电颗粒包含在第一多个粘合剂层或第二多个粘合剂层中，并且至少顶部或底部粘合剂层具有130℃或更高的DSC（差示扫描量热法）放热峰温度，以及 180℃以下。 此外，构造了其表面上具有电极和绝缘膜的第一电子部件和其表面上具有电极的第二电子部件通过多层各向异性导电粘合剂电连接的连接结构。

公开(公告)号：US20110033699A1

公开(公告)日：2011-02-10

申请号：US12836337

申请日：2010-07-14

Applicant: Naoto HAYASHI ,  Shinsuke Ikishima ,  Kooki Ooyama ,  Keiji Hayashi ,  Shou Uchida ,  Kouhei Takeda ,  Ikkou Hanaki

Inventor： Naoto HAYASHI ,  Shinsuke Ikishima ,  Kooki Ooyama ,  Keiji Hayashi ,  Shou Uchida ,  Kouhei Takeda ,  Ikkou Hanaki

IPC: C09J7/02

CPC classification number: B32B7/12 ,  B32B7/06 ,  B32B25/08 ,  B32B27/16 ,  B32B27/18 ,  B32B27/20 ,  B32B27/283 ,  B32B27/302 ,  B32B27/304 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/322 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B27/40 ,  B32B2250/24 ,  B32B2270/00 ,  B32B2307/50 ,  B32B2307/748 ,  B32B2405/00 ,  C09J7/38 ,  C09J2201/36 ,  C09J2201/622 ,  Y10T428/2839 ,  Y10T428/2848

Abstract: Provided is such a pressure-sensitive adhesive tape as described below, which is capable of protecting the uneven surface of a member having unevenness on its surface. The pressure-sensitive adhesive tape brings together sufficient pressure-sensitive adhesiveness for, and sufficient releasability from, the member. In addition, even upon deformation of the member protected with the pressure-sensitive adhesive tape by, for example, lamination or continuous winding, the uneven shape does not deform and a base material layer in the pressure-sensitive adhesive tape is not damaged. Also provided is a pressure-sensitive adhesive tape useful as such a surface protective film for a prism sheet as described below, which is capable of effectively protecting, for example, a lens surface of a prism sheet having multiple triangle pole-shaped prisms fixed on its surface. The surface protective film brings together sufficient pressure-sensitive adhesiveness for, and sufficient releasability from, the prism sheet. In addition, when the prism sheet protected with the surface protective film is brought into a state such as a laminated state or a continuously wound state, the emergence of irregularity (indentation) in the external appearance of the prism sheet to which the surface protective film is attached can be suppressed. A pressure-sensitive adhesive tape of the present invention is a pressure-sensitive adhesive tape including a base material layer, a first pressure-sensitive adhesive layer, and a second pressure-sensitive adhesive layer in the stated order, in which: the base material layer contains a thermoplastic resin; the storage modulus of the first pressure-sensitive adhesive layer is higher than the storage modulus of the second pressure-sensitive adhesive layer; and a difference between the storage modulus of the first pressure-sensitive adhesive layer at a frequency of 10 Hz and 23° C., and the storage modulus of the second pressure-sensitive adhesive layer at a frequency of 10 Hz and 23° C. is 3×105 Pa or more.