公开(公告)号：US20190099776A1

公开(公告)日：2019-04-04

申请号：US15720497

申请日：2017-09-29

Applicant: Ken P. Hackenberg ,  Nachiket R. Raravikar ,  James C. Matayabas, JR. ,  Elizabeth Nofen ,  Nisha Ananthakrishnan ,  Manabu Nakagawasai ,  Yoshihiro Tomita

Inventor： Ken P. Hackenberg ,  Nachiket R. Raravikar ,  James C. Matayabas, JR. ,  Elizabeth Nofen ,  Nisha Ananthakrishnan ,  Manabu Nakagawasai ,  Yoshihiro Tomita

IPC: B05C5/02 ,  F16K21/18 ,  B05B1/02 ,  B05B1/30

Abstract: A fluid applicator configured to apply a fluid to at least one substrate feature. The includes compressible reticulated media including an input interface configured for coupling with a fluid reservoir, and a substrate interface having an applicator profile corresponding to a feature profile of the at least one substrate feature. Reticulations extend from the input interface to the substrate interface, and the reticulations are distributed across the applicator profile. The compressible reticulated media includes filling and dispensing configurations. In the dispensing configuration the substrate interface is configured for engagement with the at least one substrate feature, the compressible reticulated media is compressed, and according to the compression the fluid is applied across the feature profile. In the filling configuration the compressible reticulated media is configured for expansion relative to the dispensing configuration, and the fluid infiltrates the reticulations according to the expansion.

公开(公告)号：US20170176518A1

公开(公告)日：2017-06-22

申请号：US14973543

申请日：2015-12-17

Applicant: Nachiket R. Raravikar ,  James C. Matayabas, JR. ,  Akshay Mathkar ,  Dingying Xu

Inventor： Nachiket R. Raravikar ,  James C. Matayabas, JR. ,  Akshay Mathkar ,  Dingying Xu

IPC: G01R31/28 ,  G01R3/00

CPC classification number: H01R43/20 ,  G01R1/07378

Abstract: Space transformer including a substrate and a perforated plate disposed on the substrate. The substrate includes conductive traces and an array of conductive probe pins extend outwardly from anchor points on the substrate. The pins are electrically coupled to at least one of the conductive traces on the substrate as an interface between an E-testing apparatus and a DUT. The perforated plate may be affixed to a surface of the substrate and includes an array of perforations through which the conductive pins may pass. The perforated plate may provide one or more of lateral pin support and protection to the underlying substrate and/or traces. The perforated plate may include a metal sheet. A polymeric material may be disposed on at least a sidewall of the perforations to electrically isolate the metal sheet from the conductive probe pins.

公开(公告)号：US20150255415A1

公开(公告)日：2015-09-10

申请号：US14198479

申请日：2014-03-05

Applicant: Thomas J. De Bonis ,  Lilia May ,  Rajen S. Sidhu ,  Mukul P. Renavikar ,  Ashay A. Dani ,  Edward R. Prack ,  Carl L. Deppisch ,  Anna M. Prakash ,  James C. Matayabas, JR. ,  Jason Jieping Zhang ,  Srinivasa R. Aravamudhan ,  Chang Lin

Inventor： Thomas J. De Bonis ,  Lilia May ,  Rajen S. Sidhu ,  Mukul P. Renavikar ,  Ashay A. Dani ,  Edward R. Prack ,  Carl L. Deppisch ,  Anna M. Prakash ,  James C. Matayabas, JR. ,  Jason Jieping Zhang ,  Srinivasa R. Aravamudhan ,  Chang Lin

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01L21/768

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L21/565 ,  H01L21/76802 ,  H01L23/3128 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/13023 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/37001 ,  H01L2924/00

Abstract: An apparatus is described that includes a substrate and a mold compound disposed on the substrate. The semiconductor die is embedded within the mold compound and is electrically coupled to lands on the substrate. Solder balls are disposed around the semiconductor die on the substrate. Each of the solder balls have a solid coating thereon. The solid coating contains a cleaning agent to promote its solder ball's coalescence with another solder ball. Respective vias are formed in the mold compound that expose the solder balls and their respective solid coatings. In combined or alternate embodiments outer edges of the mold compound have smaller thickness than regions of the mold compound between the vias and the semiconductor die. In combined or alternate embodiments micro-channels exist between the solder balls and the mold compound.

Abstract translation: 描述了一种包括设置在基板上的基板和模具化合物的装置。 半导体管芯被嵌入在模具化合物内并且电耦合到衬底上的焊盘。 焊球围绕半导体管芯设置在基板上。 每个焊球上都有一个固体涂层。 固体涂层含有一种清洁剂，以促进其焊球与另一种焊球的聚结。 在模具化合物中形成了暴露焊球及其各自固体涂层的通孔。 在组合或替代实施例中，模具化合物的外边缘具有比通孔和半导体管芯之间的模具化合物区域更小的厚度。 在组合或替代实施例中，焊料球与模具化合物之间存在微通道。

公开(公告)号：US20120282462A1

公开(公告)日：2012-11-08

申请号：US13550526

申请日：2012-07-16

Applicant: James C. Matayabas, JR. ,  Tian-An Chen

Inventor： James C. Matayabas, JR. ,  Tian-An Chen

IPC: B32B27/38 ,  B32B27/42

CPC classification number: C08G59/18 ,  C08G59/20 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/40245 ,  H01L2924/181 ,  Y10T428/2848 ,  Y10T428/31511 ,  Y10T428/31515 ,  H01L2924/00012

Abstract: An embodiment of the present invention is a technique to form a resin. A mixture is formed by a curing agent dissolved in the epoxy resin. The epoxy resin contains a first rigid rod mesogen. The curing agent contains a second rigid rod mesogen and one of a hydroxyl, amine, and anhydride.

Abstract translation: 本发明的一个实施方案是形成树脂的技术。 混合物由溶解在环氧树脂中的固化剂形成。 环氧树脂含有第一刚性棒介晶。 固化剂含有第二刚性棒介晶，羟基，胺和酸酐之一。

公开(公告)号：US08242216B2

公开(公告)日：2012-08-14

申请号：US13169784

申请日：2011-06-27

Applicant: James C. Matayabas, Jr. ,  Tian-An Chen

Inventor： James C. Matayabas, Jr. ,  Tian-An Chen

IPC: C08L63/00

CPC classification number: C08G59/18 ,  C08G59/20 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/40245 ,  H01L2924/181 ,  Y10T428/2848 ,  Y10T428/31511 ,  Y10T428/31515 ,  H01L2924/00012

Abstract: An embodiment of the present invention is a technique to form a resin. A mixture is formed by a curing agent dissolved in the epoxy resin. The epoxy resin contains a first rigid rod mesogen. The curing agent contains a second rigid rod mesogen and one of a hydroxyl, amine, and anhydride.

Abstract translation: 本发明的一个实施方案是形成树脂的技术。 混合物由溶解在环氧树脂中的固化剂形成。 环氧树脂含有第一刚性棒介晶。 固化剂含有第二刚性棒介晶，羟基，胺和酸酐之一。

公开(公告)号：US07999042B2

公开(公告)日：2011-08-16

申请号：US10876444

申请日：2004-06-25

Applicant: James C. Matayabas, Jr. ,  Tian-An Chen

Inventor： James C. Matayabas, Jr. ,  Tian-An Chen

IPC: C08L63/00

CPC classification number: C08G59/18 ,  C08G59/20 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/40245 ,  H01L2924/181 ,  Y10T428/2848 ,  Y10T428/31511 ,  Y10T428/31515 ,  H01L2924/00012

Abstract: An embodiment of the present invention is a technique to form a resin. A mixture is formed by a curing agent dissolved in the epoxy resin. The epoxy resin contains a first rigid rod mesogen. The curing agent contains a second rigid rod mesogen and one of a hydroxyl, amine, and anhydride.

Abstract translation: 本发明的一个实施方案是形成树脂的技术。 混合物由溶解在环氧树脂中的固化剂形成。 环氧树脂含有第一刚性棒介晶。 固化剂含有第二刚性棒介晶和羟基，胺和酸酐之一。

公开(公告)号：US20110028641A1

公开(公告)日：2011-02-03

申请号：US12743657

申请日：2008-11-07

Applicant: Zhikai Jeffrey Wang ,  Christopher Wayne Miller ,  Marcus Lee Hutchins ,  James C. Matayabas, JR.

Inventor： Zhikai Jeffrey Wang ,  Christopher Wayne Miller ,  Marcus Lee Hutchins ,  James C. Matayabas, JR.

IPC: C08G18/28 ,  C08G18/67 ,  C09D175/00

CPC classification number: C08L33/08 ,  C08G18/672 ,  C08G18/7671 ,  C08L2205/02 ,  C08L2312/06 ,  C09D133/08 ,  C09D175/16 ,  G02F2201/50 ,  C08L2666/04

Abstract: The present invention relates to composition comprising at least one compound obtained from the reaction of at least one compound (i) having a refractive index nD20 of at least 1.50 comprising at least one isocyanate-reactable functional group-XH, wherein each of X is, independently, O or NR, at least one polyisocyanate (ii), and, optionally, at least one compound (iii) comprising at least one isocyanate-reactable functional group —YH and at least one curable functional group Q, wherein each of Y is, independently, O, NR or S, and its use for making high refractive index coatings and films.

Abstract translation: 本发明涉及包含至少一种由至少一种折射率为nD20至少为1.50的化合物（i）与至少一种异氰酸酯可反应的官能团-XH的反应得到的化合物的组合物，其中X为， 独立地是O或NR，至少一种多异氰酸酯（ii）和任选的至少一种包含至少一种异氰酸酯可反应官能团-YH和至少一个可固化官能团Q的化合物（iii），其中Y为 ，独立地是O，NR或S，以及其用于制备高折射率涂层和膜的用途。

公开(公告)号：US20090169427A1

公开(公告)日：2009-07-02

申请号：US11966560

申请日：2007-12-28

Applicant: Lakshmi Supriya ,  James C. Matayabas, JR. ,  Nirupama Chakrapani

Inventor： Lakshmi Supriya ,  James C. Matayabas, JR. ,  Nirupama Chakrapani

IPC: B01J19/00 ,  B29C65/00

CPC classification number: B01L3/502707 ,  B01J2219/00527 ,  B01J2219/00605 ,  B01J2219/00619 ,  B01L3/502715 ,  B01L2200/025 ,  B01L2200/027 ,  B01L2200/0605 ,  B01L2200/10 ,  B01L2300/046 ,  B01L2300/0627 ,  B01L2300/0816 ,  B01L2300/0819 ,  B01L2300/0822 ,  B01L2300/0867 ,  B01L2300/089 ,  B01L2300/16 ,  B01L2300/161 ,  B01L2300/165 ,  B01L2400/0406 ,  B01L2400/0688 ,  B05D3/12 ,  B05D5/00

Abstract: A microelectronic package includes a die which may include MEMS and CMOS circuitry for analyzing a fluid. A defined path is provided for channeling fluid to the die. Rather than patterning depressions or physical channels in the package substrate, the defined paths comprise coatings that may channel the flow of liquids to the die for biological sensor type applications. The defined paths may comprise a wetting coating that has an affinity to fluids. Similarly, the defined paths may comprise a dewetting coating the tend to repel fluid surrounding the paths.

Abstract translation: 微电子封装包括可以包括用于分析流体的MEMS和CMOS电路的管芯。 提供了将流体引导到管芯的限定的路径。 定义的路径不是在封装衬底中图案化凹陷或物理通道，而是包括可以将液体流引导到用于生物传感器类型应用的管芯的涂层。 所定义的路径可以包括对流体具有亲和性的润湿涂层。 类似地，所定义的路径可以包括去潮涂层，其倾向于排斥路径周围的流体。

公开(公告)号：US5608117A

公开(公告)日：1997-03-04

申请号：US520356

申请日：1995-08-28

Applicant: James C. Matayabas, Jr. ,  Stephen N. Falling

Inventor： James C. Matayabas, Jr. ,  Stephen N. Falling

IPC: C08G65/32 ,  C08G65/14 ,  C08G65/322 ,  C08G65/20

CPC classification number: C08G65/14 ,  C08G65/322

Abstract: Disclosed are novel saturated polyether compounds comprised of n units of residue (1) and m units of residue (2), wherein (i) residues (1) and (2) have the structures: ##STR1## (ii) the total value of n+m is 2 to 70 and m/(n+m) is 0.05 to 0.98; (ii) at least 98 percent of the terminal hydroxyl groups of the polyether have the structure: ##STR2## The polyethers are obtained by first polymerizing 3,4-epoxy-l-butene to produce unsaturated polyether precursors comprising residues (1A) and (2A) having the structures: ##STR3## and then hydrogenating the unsaturated polyether precursors. The hydrogenation advantageously is performed in the presence of a nickel hydrogenation catalyst.

Abstract translation: 公开了由n个残基（1）和m个残基（2）组成的新型饱和聚醚化合物，其中（i）残基（1）和（2）具有以下结构：（1）和OCH 2 CH 2 CH 2 CH 2 ）（ii）n + m的总值为2〜70，m /（n + m）为0.05〜0.98; （ii）聚醚的末端羟基的至少98％具有以下结构：聚醚是通过首先聚合3,4-环氧-1-丁烯制备不饱和聚醚前体而得到的，其包含残基（1A）和（ 2A），其结构如下：（1A）OCH2CHCHCH2（2A），然后氢化不饱和聚醚前体。 氢化有利地在镍氢化催化剂存在下进行。

公开(公告)号：US09950393B2

公开(公告)日：2018-04-24

申请号：US13976001

申请日：2011-12-23

Applicant: Rajen S. Sidhu ,  Martha A. Dudek ,  James C. Matayabas, Jr. ,  Michelle S. Phen ,  Wei Tan

Inventor： Rajen S. Sidhu ,  Martha A. Dudek ,  James C. Matayabas, Jr. ,  Michelle S. Phen ,  Wei Tan

IPC: B23K35/02 ,  B23K35/362 ,  H01L23/00 ,  H05K3/34 ,  H01L23/488 ,  H01L23/498 ,  H01L21/48

CPC classification number: B23K35/025 ,  B23K35/362 ,  H01L21/4853 ,  H01L23/488 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0381 ,  H01L2224/03828 ,  H01L2224/03829 ,  H01L2224/03849 ,  H01L2224/0401 ,  H01L2224/05794 ,  H01L2224/058 ,  H01L2224/05809 ,  H01L2224/05811 ,  H01L2224/05813 ,  H01L2224/05817 ,  H01L2224/05839 ,  H01L2224/05844 ,  H01L2224/11334 ,  H01L2224/11848 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/3511 ,  H01L2924/3841 ,  H05K3/3489 ,  H05K2203/041 ,  H05K2203/046 ,  H01L2924/014 ,  H01L2924/01032 ,  H01L2924/01105 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/0103 ,  H01L2924/01083

Abstract: Flux formulations and solder attachment during the fabrication of electronic device assemblies are described. One flux formation includes a flux component and a metal particle component, the metal particle component being present in an amount of from 5 to 35 volume percent of the flux formulation. In one feature of certain embodiments, the metal particle component includes solder particles. Other embodiments are described and claimed.