Light emitting device
    17.
    发明授权

    公开(公告)号:US12009466B2

    公开(公告)日:2024-06-11

    申请号:US17983239

    申请日:2022-11-08

    IPC分类号: H01L33/62 H01L33/52

    CPC分类号: H01L33/62 H01L33/52

    摘要: A light emitting device including first, second, and third light emitting parts one over another along a first direction, a first conductive pattern at least partially disposed between the second and third light emitting parts and including a first portion extending in a second direction perpendicular to the first direction and electrically coupled with the second light emitting part, and a second portion extending from one end of the first portion, a second conductive pattern disposed on and electrically coupled to the third light emitting part, and a first passivation covering the first light emitting part and including a first portion extending in the second direction and a second portion extending from one end of the first portion and forming an inclined angle with the second direction, in which the first conductive pattern at least partially overlaps with the second portion of the first passivation.

    LIGHT-EMITTING PACKAGE
    18.
    发明公开

    公开(公告)号:US20240186461A1

    公开(公告)日:2024-06-06

    申请号:US18413837

    申请日:2024-01-16

    摘要: The present invention relates to a light emitting package. A light emitting package according to an embodiment of the present invention may include a body, a light emitting diode chip, and a light transmission member. The body includes a cavity open at an tipper side thereof and may be formed of a ceramic material. The light emitting diode chip is mounted in the cavity of the body and may generate and emit UV light. The light transmission member may be disposed on top of the body to cover the cavity. In addition, the light transmission member may include a light transmission layer formed of sapphire and a light loss prevention layer formed on at least one surface of the light transmission layer. The light loss prevention layer may include a lower light loss prevention layer formed on a lower surface of the light transmission layer. The light emitting diode chip and the light transmission member may be spaced apart from each other to form a space therebetween. UV light emitted from the light emitting diode chip may sequentially pass through an air layer, the lower light loss prevention layer, and a sapphire layer so as to be emitted from the light emitting package.