公开(公告)号：US20070119616A1

公开(公告)日：2007-05-31

申请号：US11605316

申请日：2006-11-29

申请人： Yasuyoshi Horikawa ,  Tomoo Yamasaki

发明人： Yasuyoshi Horikawa ,  Tomoo Yamasaki

IPC分类号： H05K1/00

CPC分类号： H05K1/16 ,  H01L21/485 ,  H01L23/50 ,  H01L23/5382 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K1/029 ,  H05K1/0292 ,  H05K1/112 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/4644

摘要： A mounting substrate for mounting a semiconductor chip, having a plurality of passive elements which are connected to the semiconductor chip and are formed to be mutually electrically-independent, and a wiring part including a plurality of via plugs respectively independently connected to the plurality of passive elements and pattern wiring connected to the via plugs, wherein the wiring part is constructed so that a state of connection between the semiconductor chip and the plurality of passive elements can be changed by changing the pattern wiring.

摘要翻译： 一种用于安装半导体芯片的安装基板，具有连接到半导体芯片并被形成为彼此电独立的多个无源元件，以及包括分别独立地连接到多个被动的多个通孔插头的布线部分 元件和图案布线连接到通孔插头，其中布线部分被构造成使得可以通过改变图案布线来改变半导体芯片与多个无源元件之间的连接状态。

公开(公告)号：US07072168B2

公开(公告)日：2006-07-04

申请号：US10889312

申请日：2004-07-13

申请人： Yasuyoshi Horikawa ,  Tomoo Yamasaki ,  Kiyoshi Ooi

发明人： Yasuyoshi Horikawa ,  Tomoo Yamasaki ,  Kiyoshi Ooi

IPC分类号： H01G4/005

CPC分类号： H01G9/012 ,  H01G9/042 ,  H01G9/0425 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/50 ,  H01L2221/68345 ,  H01L2224/05001 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05644 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K1/112 ,  H05K1/162 ,  H05K3/205 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09763 ,  H05K2201/10674 ,  H05K2203/0315 ,  Y10T29/417 ,  Y10T29/43 ,  H01L2924/00014

摘要： A capacitor device of the present invention includes a substrate, a float electrode formed on the substrate, a valve metal film formed on the float electrode, a dielectric film formed on the valve metal film by applying an anodic oxidation to a part of the valve metal film, and a pair of electrodes provided in areas overlapping with two different parts of the float electrode on the dielectric film respectively.

摘要翻译： 本发明的电容器装置包括基板，形成在基板上的浮动电极，形成在浮动电极上的阀金属膜，通过对阀金属的一部分施加阳极氧化而形成在阀金属膜上的电介质膜 膜和一对电极，其分别设置在与电极上的浮动电极的两个不同部分重叠的区域中。

公开(公告)号：US20060040424A1

公开(公告)日：2006-02-23

申请号：US11257263

申请日：2005-10-24

申请人： Kiyoshi Ooi ,  Yasuyoshi Horikawa ,  Akio Rokugawa

发明人： Kiyoshi Ooi ,  Yasuyoshi Horikawa ,  Akio Rokugawa

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： H01L23/49816 ,  H01L21/4857 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/50 ,  H01L23/562 ,  H01L24/81 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2221/68377 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06582 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00

摘要： A method of manufacturing a semiconductor device substrate includes the steps of: arranging on a base a temporary fixing member for temporarily fixing an electronic component; temporarily fixing the electronic component on the base by the temporary fixing member; forming a substrate body on the base and the electronic component; removing a portion of the base which portion corresponds to the electronic component, thereby exposing the temporary fixing member; and removing the temporary fixing member, thereby enabling the electronic component to make an external connection.

摘要翻译： 一种制造半导体器件基板的方法包括以下步骤：在基座上布置用于临时固定电子部件的临时固定部件; 通过临时固定构件将电子部件临时固定在基座上; 在基座和电子部件上形成基板主体; 移除所述基座的对应于所述电子部件的部分，从而露出所述临时固定部件; 并且移除临时固定构件，从而使得电子部件能够进行外部连接。

公开(公告)号：US20050258447A1

公开(公告)日：2005-11-24

申请号：US11122098

申请日：2005-05-05

申请人： Kiyoshi Oi ,  Noriyoshi Shimizu ,  Yasuyoshi Horikawa

发明人： Kiyoshi Oi ,  Noriyoshi Shimizu ,  Yasuyoshi Horikawa

IPC分类号： H01L23/12 ,  H01L21/60 ,  H01L23/538 ,  H01L29/24

CPC分类号： H01L24/82 ,  H01L23/5389 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/82375 ,  H01L2224/92224 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  Y10T29/49155 ,  Y10T29/4916 ,  Y10T29/49204 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method of manufacturing an electronic parts packaging structure of the present invention, includes a step of mounting an electronic parts, which has a connection terminal and a passivating film to cover the connection terminal, on a mounted body to direct the connection terminal upward, a step of forming an insulating layer to cover the electronic parts, a step of forming a via hole in a portion of the passivating film and the insulating layer on the connection terminal to expose the connection terminal, and a step of forming a wiring pattern, which is connected electrically to the connection terminal via the via hole, on the insulating layer.

摘要翻译： 一种制造本发明的电子零件包装结构的方法包括在安装体上安装具有连接端子和钝化膜以覆盖连接端子的电子部件以将连接端子向上引导的步骤， 形成绝缘层以覆盖电子部件的步骤，在钝化膜的一部分和连接端子上的绝缘层上形成通孔以露出连接端子的步骤，以及形成布线图案的步骤，其中 经由绝缘层上的通孔与电连接端子电连接。

公开(公告)号：US20070040238A1

公开(公告)日：2007-02-22

申请号：US11463172

申请日：2006-08-08

申请人： Tomoo Yamasaki ,  Yasuyoshi Horikawa

发明人： Tomoo Yamasaki ,  Yasuyoshi Horikawa

IPC分类号： H01L29/00

CPC分类号： H01F17/0033 ,  H01F17/02 ,  H01F27/40 ,  H01L23/5227 ,  H01L2924/0002 ,  H01L2924/00

摘要： A chip coil has a chip format including a rectangle substrate of an insulating resin material and a coil portion having a solenoid structure a part of which is embedded within the substrate and in which adjacent coils are insulated from each other by the substrate. The resin material contains a magnetic filler. The chip coil has a thickness of 50 μm or less.

摘要翻译： 芯片线圈具有包括绝缘树脂材料的矩形基板和线圈部分的线圈部分，该线圈部分具有螺线管结构，其一部分嵌入在基板内，并且相邻线圈彼此被基板绝缘。 树脂材料含有磁性填料。 芯片线圈的厚度为50μm以下。

公开(公告)号：US08770987B2

公开(公告)日：2014-07-08

申请号：US13285139

申请日：2011-10-31

申请人： Yasuyoshi Horikawa

发明人： Yasuyoshi Horikawa

IPC分类号： H01R12/00

CPC分类号： H01R12/716 ,  H01R13/2442

摘要： A connecting terminal structure includes a plurality of connecting terminals, each including a connecting part to be in contact with an object to be connected at an end of the connecting terminal and a plate-like fixing part at another end of the connecting terminal, a first face of the plate-like fixing part being configured to be electrically connectable; and electronic components, each including at least two electrode terminals, wherein the two electrode terminals of the electronic components are mounted on faces opposite to the first faces of the fixing parts of the connecting terminals.

摘要翻译： 连接端子结构包括多个连接端子，每个连接端子包括与连接端子端连接的物体接触的连接部分和连接端子的另一端的板状固定部件，第一连接端子 板状固定部分的表面被构造成可电连接; 和电子部件，每个电子部件包括至少两个电极端子，其中电子部件的两个电极端子安装在与连接端子的固定部分的第一面相反的表面上。

公开(公告)号：US08419442B2

公开(公告)日：2013-04-16

申请号：US13183975

申请日：2011-07-15

申请人： Yasuyoshi Horikawa ,  Yoshihiro Ihara ,  Kenji Mochizuki ,  Masato Tanaka

发明人： Yasuyoshi Horikawa ,  Yoshihiro Ihara ,  Kenji Mochizuki ,  Masato Tanaka

IPC分类号： H01R12/00

CPC分类号： H01R12/716 ,  H01R13/2442 ,  H05K3/301 ,  H05K3/3436 ,  H05K7/1069 ,  H05K2201/10325 ,  H05K2201/10393 ,  Y10T29/49147

摘要： A socket detachably connects a connecting item to a substrate via connecting terminals. The socket includes a support member with first and second surfaces to fix the connecting terminals, and penetrating holes formed in the support member. Each connecting terminal includes first and second connecting parts formed on opposite ends thereof. Each connecting terminal is inserted into a corresponding penetrating hole in a state in which the first connecting part is fixed to the first surface and the second connecting part projects from the second surface of the support member.

摘要翻译： 插座通过连接端子可拆卸地连接到基板。 插座包括具有第一和第二表面以固定连接端子的支撑构件和形成在支撑构件中的穿透孔。 每个连接端子包括形成在其相对端上的第一和第二连接部分。 每个连接端子在第一连接部分固定到第一表面并且第二连接部件从支撑部件的第二表面突出的状态下插入到相应的通孔中。

公开(公告)号：US07414309B2

公开(公告)日：2008-08-19

申请号：US11593538

申请日：2006-11-07

申请人： Kiyoshi Oi ,  Noriyoshi Shimizu ,  Yasuyoshi Horikawa

发明人： Kiyoshi Oi ,  Noriyoshi Shimizu ,  Yasuyoshi Horikawa

IPC分类号： H01L23/12 ,  H01L21/00

CPC分类号： H01L24/82 ,  H01L23/5389 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/82375 ,  H01L2224/92224 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  Y10T29/49155 ,  Y10T29/4916 ,  Y10T29/49204 ,  H01L2924/00014 ,  H01L2924/00

摘要： An encapsulated electronic part packaging structure includes a step of mounting an electronic part having a connection terminal and a passivating film to cover the connection terminal, mounted on a body to direct the connection terminal upward. An insulating layer is formed to cover the electronic part, and a via hole is formed in a portion of the passivating film and the insulating layer on the connection terminal to expose the connection terminal. A wiring pattern, which is connected electrically to the connection terminal via the via hole, is formed on the insulating layer.

摘要翻译： 封装的电子部件封装结构包括安装具有连接端子和钝化膜的电子部件以覆盖安装在主体上以将连接端子向上引导的连接端子的步骤。 形成绝缘层以覆盖电子部件，并且在钝化膜的一部分和连接端子上的绝缘层上形成通孔以露出连接端子。 在绝缘层上形成有经由通路孔与连接端子电连接的布线图案。

公开(公告)号：US07402900B2

公开(公告)日：2008-07-22

申请号：US10811768

申请日：2004-03-29

申请人： Kiyoshi Ooi ,  Yasuyoshi Horikawa ,  Akio Rokugawa

发明人： Kiyoshi Ooi ,  Yasuyoshi Horikawa ,  Akio Rokugawa

IPC分类号： H01L23/06

CPC分类号： H01L23/49816 ,  H01L21/4857 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/50 ,  H01L23/562 ,  H01L24/81 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2221/68377 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06582 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00

摘要： A method of manufacturing a semiconductor device substrate includes the steps of: arranging on a base a temporary fixing member for temporarily fixing an electronic component; temporarily fixing the electronic component on the base by the temporary fixing member; forming a substrate body on the base and the electronic component; removing a portion of the base which portion corresponds to the electronic component, thereby exposing the temporary fixing member; and removing the temporary fixing member, thereby enabling the electronic component to make an external connection.

公开(公告)号：US07223652B2

公开(公告)日：2007-05-29

申请号：US11048556

申请日：2005-02-01

申请人： Kiyoshi Ooi ,  Yasuyoshi Horikawa ,  Tomoo Yamasaki

发明人： Kiyoshi Ooi ,  Yasuyoshi Horikawa ,  Tomoo Yamasaki

IPC分类号： H01L21/338 ,  H01L51/40 ,  H01L21/8244 ,  H01L21/8242

CPC分类号： H01G4/224 ,  H01L21/6835 ,  H01L23/50 ,  H01L23/642 ,  H01L2221/68345 ,  H01L2221/68363 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05172 ,  H01L2224/05184 ,  H01L2224/05571 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H05K1/162 ,  H05K2201/0162 ,  H05K2201/09763 ,  H01L2924/00014 ,  H01L2224/05147 ,  H01L2224/05166

摘要： A capacitor includes a capacitor part formed of a dielectric film sandwiched by a pair of electrodes and a support body formed of a film of an organic polysilane. The support body is provided so as to support the capacitor part thereon.

摘要翻译： 电容器包括由夹在一对电极之间的电介质膜和由有机聚硅烷膜形成的支撑体形成的电容器部分。 支撑体设置成在其上支撑电容器部分。