公开(公告)号：US10535611B2

公开(公告)日：2020-01-14

申请号：US15042817

申请日：2016-02-12

Applicant: Apple Inc.

Inventor： Flynn P. Carson ,  Jun Chung Hsu ,  Meng Chi Lee ,  Shakti S. Chauhan

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00

Abstract: Packages including substrate-less integrated components and methods of fabrication are described are described. In an embodiment, a packaging method includes attaching a ground structure to a carrier and a plurality of components face down to the carrier and laterally adjacent to the ground structure. The plurality of components are encapsulated within a molding compound, and the carrier is removed exposing a plurality of component terminals and a plurality of ground structure terminals. A plurality of packages are singulated.

公开(公告)号：US20170179039A1

公开(公告)日：2017-06-22

申请号：US14976199

申请日：2015-12-21

Applicant: Apple Inc.

Inventor： Meng Chi Lee ,  Shakti S. Chauhan ,  Flynn P. Carson ,  Jun Chung Hsu ,  Tha-An Lin

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/522 ,  H01L21/48 ,  H01L23/528 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/5226 ,  H01L23/528 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/10253 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/81

Abstract: A system in package (SiP) is disclosed that uses an EMI shield to inhibit EMI or other electrical interference on the components within the SiP. A metal shield may be formed on an upper surface of an encapsulant encapsulating the SiP. The metal shield may be electrically coupled to a ground layer in a printed circuit board (PCB) to form the EMI shield around the SiP. The metal shield may be electrically coupled to the ground layer using one or more conductive structures located in the encapsulant. The conductive structures may be located on a perimeter of the components in the SiP. The conductive structures may provide a substantially vertical connection between the substrate and the shield on the upper surface of the encapsulant.

公开(公告)号：US20160358889A1

公开(公告)日：2016-12-08

申请号：US14730171

申请日：2015-06-03

Applicant: Apple Inc.

Inventor： Kwan-Yu Lai ,  Jun Zhai ,  Kunzhong Hu ,  Flynn P. Carson

IPC: H01L25/065 ,  H01L23/31 ,  H01L21/768 ,  H01L21/56 ,  H01L25/00 ,  H01L23/48 ,  H01L23/528

CPC classification number: H01L21/768 ,  H01L21/568 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106

Abstract: Packages including an embedded die with through silicon vias (TSVs) are described. In an embodiment, a first level die including TSVs is embedded between a first redistribution layer (RDL) and a second RDL, and a second level die is mounted on a top side of the first redistribution layer. In an embodiment, the first level die is an active die, less than 50 μm thick.

Abstract translation: 描述了包括通过硅通孔（TSV）的嵌入式裸片的封装。 在一个实施例中，包括TSV的第一级裸片被嵌入在第一重分配层（RDL）和第二RDL之间，并且第二级管芯安装在第一再分布层的顶侧。 在一个实施例中，第一级模具是小于50μm厚的有源管芯。

公开(公告)号：US20230066814A1

公开(公告)日：2023-03-02

申请号：US17465761

申请日：2021-09-02

Applicant: Apple Inc.

Inventor： Sidharth S. Dalmia ,  Wansuk Yun ,  Flynn P. Carson

IPC: H01Q1/22 ,  H01Q21/00 ,  H01Q1/38 ,  H01Q1/24 ,  H04W52/02 ,  H04B1/00

Abstract: A radio frequency package includes a first portion of an antenna array module, a second portion of the antenna array module, and a flexible cable. The first portion of the antenna array module provides a first wireless communication functionality and the second portion of the antenna array module provides a second wireless communication functionality. The flexible cable includes first surface directly coupled to the first portion of the antenna array module. The flexible cable also includes a second surface directly coupled to the second portion of the antenna array module. The flexible cable communicates signals between the first portion of the distributed antenna array module and the second portion of the antenna array module.

公开(公告)号：US10522475B2

公开(公告)日：2019-12-31

申请号：US16142137

申请日：2018-09-26

Applicant: Apple Inc.

Inventor： Meng Chi Lee ,  Shakti S. Chauhan ,  Flynn P. Carson ,  Jun Chung Hsu ,  Tha-An Lin

IPC: H01L23/552 ,  H01L23/528 ,  H01L23/31 ,  H01L23/522 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00

Abstract: A system in package (SiP) is disclosed that uses an EMI shield to inhibit EMI or other electrical interference on the components within the SiP. A metal shield may be formed on an upper surface of an encapsulant encapsulating the SiP. The metal shield may be electrically coupled to a ground layer in a printed circuit board (PCB) to form the EMI shield around the SiP. The metal shield may be electrically coupled to the ground layer using one or more conductive structures located in the encapsulant. The conductive structures may be located on a perimeter of the components in the SiP. The conductive structures may provide a substantially vertical connection between the substrate and the shield on the upper surface of the encapsulant.

公开(公告)号：US20190027445A1

公开(公告)日：2019-01-24

申请号：US16142137

申请日：2018-09-26

Applicant: Apple Inc.

Inventor： Meng Chi Lee ,  Shakti S. Chauhan ,  Flynn P. Carson ,  Jun Chung Hsu ,  Tha-An Lin

IPC: H01L23/552 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/522 ,  H01L23/528

CPC classification number: H01L23/552 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/5226 ,  H01L23/528 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/10253 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/81

Abstract: A system in package (SiP) is disclosed that uses an EMI shield to inhibit EMI or other electrical interference on the components within the SiP. A metal shield may be formed on an upper surface of an encapsulant encapsulating the SiP. The metal shield may be electrically coupled to a ground layer in a printed circuit board (PCB) to form the EMI shield around the SiP. The metal shield may be electrically coupled to the ground layer using one or more conductive structures located in the encapsulant. The conductive structures may be located on a perimeter of the components in the SiP. The conductive structures may provide a substantially vertical connection between the substrate and the shield on the upper surface of the encapsulant.

公开(公告)号：US20180092213A1

公开(公告)日：2018-03-29

申请号：US15710579

申请日：2017-09-20

Applicant: Apple Inc.

Inventor： Corey S. Provencher ,  Meng Chi Lee ,  Derek J. Walters ,  Ian A. Spraggs ,  Flynn P. Carson ,  Shakti S. Chauhan ,  Daniel W. Jarvis ,  David A. Pakula ,  Jun Zhai ,  Michael V. Yeh ,  Alex J. Crumlin ,  Dennis R. Pyper ,  Amir Salehi ,  Vu T. Vo ,  Gregory N. Stephens

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/34

CPC classification number: H05K1/181 ,  H05K1/0298 ,  H05K1/113 ,  H05K1/115 ,  H05K1/144 ,  H05K3/0014 ,  H05K3/284 ,  H05K3/341 ,  H05K3/3436 ,  H05K2201/10159 ,  H05K2201/10674 ,  H05K2203/1316 ,  Y02P70/611

Abstract: The present disclosure is related to printed circuit board packages and methods of assembly that may be used in the fabrication of electrical devices. Printed circuit board packages may be manufactured by stacking printed circuit board assemblies. Each printed circuit board assembly may have multiple printed circuit boards supported by a resin mold. The printed circuit board assemblies may be shaped to improve space utilization efficiency and to accommodate large electrical components that are attached to the printed circuit board package.

公开(公告)号：US09679801B2

公开(公告)日：2017-06-13

申请号：US14730171

申请日：2015-06-03

Applicant: Apple Inc.

Inventor： Kwan-Yu Lai ,  Jun Zhai ,  Kunzhong Hu ,  Flynn P. Carson

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/768 ,  H01L25/00 ,  H01L23/31 ,  H01L23/538 ,  H01L25/10 ,  H01L21/56 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L21/768 ,  H01L21/568 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106

Abstract: Packages including an embedded die with through silicon vias (TSVs) are described. In an embodiment, a first level die including TSVs is embedded between a first redistribution layer (RDL) and a second RDL, and a second level die is mounted on a top side of the first redistribution layer. In an embodiment, the first level die is an active die, less than 50 μm thick.

公开(公告)号：US20170135219A1

公开(公告)日：2017-05-11

申请号：US14935292

申请日：2015-11-06

Applicant: Apple Inc.

Inventor： Jun Chung Hsu ,  Flynn P. Carson ,  Kwan-Yu Lai

IPC: H05K3/00 ,  H05K1/11

CPC classification number: H01L21/568 ,  H01L21/4857 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16235 ,  H01L2224/16245 ,  H01L2224/81005 ,  H01L2224/97 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K3/4682 ,  Y10T29/49156 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/81

Abstract: Method of forming ultra thin coreless substrates are described. In an embodiment, the method utilizes a debond layer including high and low adhesion surface areas to the carrier substrate, and cutting through the low adhesion surface areas to remove a build-up structure from the carrier substrate. An electrical short layer may be formed as a part of or on the debond layer to facilitate electrical testing of the build-up structure prior to debonding, and aid in the formation a “known good” substrate on a support substrate.

公开(公告)号：US12165956B2

公开(公告)日：2024-12-10

申请号：US17643247

申请日：2021-12-08

Applicant: Apple Inc.

Inventor： Kumar Nagarajan ,  Flynn P. Carson ,  Karthik Shanmugam ,  Menglu Li ,  Raymundo M. Camenforte ,  Scott D. Morrison

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/532 ,  H01L23/538 ,  H01L25/16 ,  H01L49/02

Abstract: Package structures, modules containing such packages and methods of manufacture. are described. In an embodiment, a package includes a plurality of terminal pads, a plurality of passive components bonded to top sides of the plurality of terminal pads, a die bonded to top sides of the plurality of passive components and a molding compound encapsulating at least the plurality of passive components and the die.