公开(公告)号：US09246060B2

公开(公告)日：2016-01-26

申请号：US13762912

申请日：2013-02-08

Applicant: Cree, Inc.

Inventor： Sung Chul Joo ,  Christopher P. Hussell

IPC: H01L33/38 ,  G01B11/24 ,  H01L33/62 ,  H01L33/48

CPC classification number: H01L33/38 ,  G01B11/24 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48

Abstract: Light emitting devices, packages and related methods are disclosed with electrical leads with one or more indicators. A package can include a leadframe that can include at least a first lead and a second lead. The first lead can include a first end for electrical connection to at least one light emitting device and a second end extending toward a first side of the package. The second lead can include a first end for electrical connection to at least one light emitting device and a second end extending toward a second side of the package. One or both of the second end of the first lead or the second end of the second lead can comprise an indicator serving as an identifier.

Abstract translation: 公开了具有一个或多个指示器的电引线的发光器件，封装和相关方法。 封装可以包括可以包括至少第一引线和第二引线的引线框架。 第一引线可以包括用于电连接到至少一个发光器件的第一端和朝向封装的第一侧延伸的第二端。 第二引线可以包括用于电连接到至少一个发光器件的第一端和朝向封装的第二侧延伸的第二端。 第一引线的第二端或第二引线的第二端中的一个或两个可以包括用作标识符的指示器。

公开(公告)号：US20150345714A1

公开(公告)日：2015-12-03

申请号：US14292244

申请日：2014-05-30

Applicant: Cree, Inc.

Inventor： Jesse Colin Reiherzer ,  Erin R. F. Welch ,  Sung Chul Joo

IPC: F21K99/00 ,  H01L33/50 ,  F21V13/02

Abstract: Submount based light emitter components and related methods are disclosed. In some aspects, light emitter components include a reflective ceramic submount, at least one light emitter chip disposed over a first surface of the submount, a layer of optical conversion material disposed over portions of each of the at least one light emitter chip and the first surface of the submount, and a lens disposed over the layer of optical conversion material. The layer of optical conversion material and the lens define separate and discrete layers over the at least one light emitter chip and submount.

Abstract translation: 公开了基于底座的光发射器部件和相关方法。 在一些方面，光发射器部件包括反射陶瓷基座，设置在基座的第一表面上的至少一个光发射器芯片，设置在所述至少一个发光芯片中的每一个的部分上的光学转换材料层和第一 底座的表面和设置在光学转换材料层上的透镜。 光学转换材料层和透镜在至少一个光发射器芯片和底座上限定分离的和离散的层。

公开(公告)号：US20130256711A1

公开(公告)日：2013-10-03

申请号：US13834195

申请日：2013-03-15

Applicant: CREE, INC.

Inventor： Sung Chul Joo ,  Peter Scott Andrews ,  Erin Welch

IPC: H01L27/15 ,  H01L33/60

CPC classification number: H01L27/15 ,  H01L24/97 ,  H01L33/486 ,  H01L33/505 ,  H01L33/507 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/85

Abstract: Substrate based light emitter devices, components, and related methods are disclosed. In some aspects, light emitter components can include a substrate and a plurality of light emitter devices provided over the substrate. Each device can include a surface mount device (SMD) adapted to mount over an external substrate or heat sink. In some aspects, each device of the plurality of devices can include at least one LED chip electrically connected to one or more traces and at least one pair of bottom contacts adapted to mount over a surface of external substrate. The component can further include a continuous layer of encapsulant disposed over each device of the plurality of devices. Multiple devices can be singulated from the component.

Abstract translation: 公开了基于基板的发光器件，部件和相关方法。 在一些方面，光发射器部件可以包括衬底和设置在衬底上的多个发光器件。 每个器件可以包括适于安装在外部衬底或散热器上的表面贴装器件（SMD）。 在一些方面，多个装置中的每个装置可以包括电连接到一个或多个迹线的至少一个LED芯片和适于安装在外部基板的表面上的至少一对底部触点。 组件还可以包括设置在多个设备的每个设备上的连续的密封剂层。 可以从组件中分离多个设备。

公开(公告)号：US20130215434A1

公开(公告)日：2013-08-22

申请号：US13762912

申请日：2013-02-08

Applicant: CREE, INC.

Inventor： Sung Chul Joo ,  Christopher P. Hussell

IPC: H01L33/38 ,  G01B11/24

CPC classification number: H01L33/38 ,  G01B11/24 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48

Abstract: Light emitting devices, packages and related methods are disclosed with electrical leads with one or more indicators. A package can include a leadframe that can include at least a first lead and a second lead. The first lead can include a first end for electrical connection to at least one light emitting device and a second end extending toward a first side of the package. The second lead can include a first end for electrical connection to at least one light emitting device and a second end extending toward a second side of the package. One or both of the second end of the first lead or the second end of the second lead can comprise an indicator serving as an identifier.

Abstract translation: 公开了具有一个或多个指示器的电引线的发光器件，封装和相关方法。 封装可以包括可以包括至少第一引线和第二引线的引线框架。 第一引线可以包括用于电连接到至少一个发光器件的第一端和朝向封装的第一侧延伸的第二端。 第二引线可以包括用于电连接到至少一个发光器件的第一端和朝向封装的第二侧延伸的第二端。 第一引线的第二端或第二引线的第二端中的一个或两个可以包括用作标识符的指示器。

公开(公告)号：US20170345866A1

公开(公告)日：2017-11-30

申请号：US15676961

申请日：2017-08-14

Applicant: Cree, Inc.

Inventor： Sung Chul Joo ,  Peter Scott Andrews ,  Erin R. F. Welch

IPC: H01L27/15 ,  H01L33/60 ,  H01L23/00 ,  H01L33/48 ,  H01L33/50

Abstract: Substrate based light emitter devices, components, and related methods are disclosed. In some aspects, light emitter components can include a substrate and a plurality of light emitter devices provided over the substrate. Each device can include a surface mount device (SMD) adapted to mount over an external substrate or heat sink. In some aspects, each device of the plurality of devices can include at least one LED chip electrically connected to one or more traces and at least one pair of bottom contacts adapted to mount over a surface of external substrate. The component can further include a continuous layer of encapsulant disposed over each device of the plurality of devices. Multiple devices can be singulated from the component.

公开(公告)号：USD783547S1

公开(公告)日：2017-04-11

申请号：US29529243

申请日：2015-06-04

Applicant: Cree, Inc.

Designer： Michael John Bergmann ,  Jesse Reiherzer ,  Joseph Gates Clark ,  Benjamin Jacobson ,  Sung Chul Joo

公开(公告)号：US20160254423A1

公开(公告)日：2016-09-01

申请号：US14633734

申请日：2015-02-27

Applicant: CREE, INC.

Inventor： Michael John Bergmann ,  Jesse Reiherzer ,  Joseph Gates Clark ,  Benjamin Jacobson ,  Sung Chul Joo

IPC: H01L33/54 ,  H01L33/50 ,  H01L33/60 ,  H01L33/48

CPC classification number: H01L33/54 ,  H01L27/156 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Light emitting diode components are disclosed that utilize a thin, substantially flat or undomed encapsulant in order to achieve the desired emission profile to increase luminance and/or center beam candle power. Some embodiments of the devices include encapsulants, which result in an apparent source image, which does not exceed 2× the source size. Different embodiments of the present invention can comprise different configurations of emitters within the component, such as monolithic chips. The LEDs can be wire bonded to a surface. This surface can be black, reflective or include a reflective coating. In some embodiments, conversion materials can be applied conformal to the LED.

Abstract translation: 公开了使用薄的，基本上平坦的或未掺杂的密封剂的发光二极管组件，以便实现所需的发射分布，以增加亮度和/或中心光束烛光功率。 装置的一些实施例包括密封剂，其产生不超过2×源尺寸的明显源图像。 本发明的不同实施例可以包括组件内的发射器的不同配置，例如单片芯片。 LED可以引线键合到表面。 该表面可以是黑色的，反射的或包括反射涂层。 在一些实施例中，转换材料可以适用于LED。

公开(公告)号：US09000470B2

公开(公告)日：2015-04-07

申请号：US14168561

申请日：2014-01-30

Applicant: Cree, Inc.

Inventor： Florin A. Tudorica ,  Christopher P. Hussell ,  Amber C. Abare ,  Peter Scott Andrews ,  Sung Chul Joo

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/50 ,  H01L23/00 ,  H01L25/16 ,  H01L33/52

CPC classification number: H01L25/0753 ,  H01L24/48 ,  H01L24/83 ,  H01L25/167 ,  H01L33/505 ,  H01L33/507 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83447 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/10156 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2933/0041 ,  H01L2933/005

Abstract: Light emitter devices for light emitting diodes (LED chips) and related methods are disclosed. In one embodiment a light emitter device includes a substrate and a chip on board (COB) array of LED chips disposed over the substrate. A layer having wavelength conversion material provided therein is disposed over the array of LED chips for forming a light emitting surface from which light is emitted upon activation of the LED chips. In some aspects, the wavelength conversion material includes phosphoric or lumiphoric material that is settled and/or more densely concentrated within one or more predetermined portions of the layer. In some aspects, the devices and methods provided herein can comprise a lumen density of approximately 30 lm/mm2 or greater.

Abstract translation: 公开了用于发光二极管（LED芯片）的发光器件和相关方法。 在一个实施例中，发光器件包括衬底和布置在衬底上的LED芯片的板上（COB）阵列。 设置在其中的具有波长转换材料的层设置在LED芯片阵列上，用于形成在LED芯片激活时发光的发光表面。 在一些方面，波长转换材料包括在层的一个或多个预定部分内沉降和/或更密集地聚集的磷酸或荧光材料。 在一些方面，本文提供的装置和方法可以包括大约30lm / mm2或更大的管腔密度。

公开(公告)号：US11488923B2

公开(公告)日：2022-11-01

申请号：US16421824

申请日：2019-05-24

Applicant: Cree, Inc.

Inventor： Sung Chul Joo ,  Alexander Komposch ,  Brian William Condie ,  Benjamin Law ,  Jae Hyung Jeremiah Park

IPC: H01L23/00

Abstract: A semiconductor device package includes a substrate, a silicon (Si) or silicon carbide (SiC) semiconductor die, and a metal layer on a surface of the semiconductor die. The metal layer includes a bonding surface that is attached to a surface of the substrate by a die attach material. The bonding surface includes opposing edges that extend along a perimeter of the semiconductor die, and one or more non-orthogonal corners that are configured to reduce stress at an interface between the bonding surface and the die attach material. Related devices and fabrication methods are also discussed.

公开(公告)号：US11004890B2

公开(公告)日：2021-05-11

申请号：US15676961

申请日：2017-08-14

Applicant: Cree, Inc.

Inventor： Sung Chul Joo ,  Peter Scott Andrews ,  Erin R. F. Welch

IPC: H01L33/60 ,  H01L27/15 ,  H01L33/48 ,  H01L33/50 ,  H01L23/00

Abstract: Substrate based light emitter devices, components, and related methods are disclosed. In some aspects, light emitter components can include a substrate and a plurality of light emitter devices provided over the substrate. Each device can include a surface mount device (SMD) adapted to mount over an external substrate or heat sink. In some aspects, each device of the plurality of devices can include at least one LED chip electrically connected to one or more traces and at least one pair of bottom contacts adapted to mount over a surface of external substrate. The component can further include a continuous layer of encapsulant disposed over each device of the plurality of devices. Multiple devices can be singulated from the component.