公开(公告)号：US11282633B2

公开(公告)日：2022-03-22

申请号：US16616387

申请日：2017-06-28

Applicant: Intel Corporation

Inventor： Fay Hua ,  Sidharth Dalmia ,  Zhichao Zhang

IPC: H01F27/28 ,  H01F41/04 ,  H01L21/48 ,  H01L23/498 ,  H01L23/522 ,  H01L23/58 ,  H01L23/00

Abstract: An apparatus is provided which comprises: a planar dielectric surface, two or more conductive leads on the surface, the conductive leads extending away from the substrate surface, two or more conductive traces on the surface between the conductive leads, the traces substantially parallel to each other, and a wire coupling a first end of a first conductive trace to an opposite end of an adjacent second conductive trace, the wire extending away from the surface. Other embodiments are also disclosed and claimed.

公开(公告)号：US11233018B2

公开(公告)日：2022-01-25

申请号：US16788515

申请日：2020-02-12

Applicant: INTEL CORPORATION

Inventor： Sidharth Dalmia ,  Ana M. Yepes ,  Pouya Talebbeydokhti ,  Miroslav Baryakh ,  Omer Asaf

IPC: H01L23/34 ,  H01L23/66 ,  H01Q1/22 ,  H01L23/552 ,  H01L21/56 ,  H01L21/768 ,  H01L23/31 ,  H01L23/522 ,  H01L23/00 ,  H01Q21/06 ,  H01L25/065

Abstract: Wireless modules having a semiconductor package attached to an antenna package is disclosed. The semiconductor package may house one or more electronic components as a single die package and/or a system in a package (SiP) implementation. The antenna package may be communicatively coupled to the semiconductor package using by one or more coupling pads. The antenna package may further have one or more radiating elements for transmitting and or receiving wireless signals. The antenna package and the semiconductor package may have dissimilar number of interconnect layers and/or dissimilar materials of construct.

公开(公告)号：US20190260110A1

公开(公告)日：2019-08-22

申请号：US15939139

申请日：2018-03-28

Applicant: Intel Corporation

Inventor： Trang Thai ,  Raanan Sover ,  Noam Kogan ,  Jonathan Jensen ,  Richard Perry ,  William James Lambert ,  Omer Asaf ,  Ralph Winzenburg ,  Daniel R. Cox ,  Josef Hagn ,  Sidharth Dalmia

IPC: H01Q1/22 ,  H01Q9/04 ,  H01Q21/06

Abstract: Disclosed herein are antenna boards, antenna modules, antenna board fixtures, and communication devices. For example, in some embodiments, a communication device may include an integrated circuit (IC) package, an antenna patch support, and one or more antenna patches coupled to the antenna patch support by solder or an adhesive.

公开(公告)号：US20250158269A1

公开(公告)日：2025-05-15

申请号：US19027041

申请日：2025-01-17

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Jonathan Jensen ,  Ozgur Inac ,  Trang Thai ,  William J. Lambert ,  Benjamin Jann

IPC: H01Q1/24 ,  H01L23/66 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q9/04

Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

公开(公告)号：US20250071885A1

公开(公告)日：2025-02-27

申请号：US18944243

申请日：2024-11-12

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Zhenguo Jiang ,  William J. Lambert ,  Kirthika Nahalingam ,  Swathi Vijayakumar

IPC: H05K1/02 ,  G06F1/16 ,  H01F5/04 ,  H01L25/16 ,  H04B1/40 ,  H05K1/18

Abstract: Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.

公开(公告)号：US12200855B2

公开(公告)日：2025-01-14

申请号：US18418513

申请日：2024-01-22

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Zhenguo Jiang ,  William J. Lambert ,  Kirthika Nahalingam ,  Swathi Vijayakumar

IPC: H05K1/02 ,  G06F1/16 ,  H01F5/04 ,  H01L25/16 ,  H04B1/40 ,  H05K1/18

Abstract: Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.

公开(公告)号：US20240164010A1

公开(公告)日：2024-05-16

申请号：US18418513

申请日：2024-01-22

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Zhenguo Jiang ,  William J. Lambert ,  Kirthika Nahalingam ,  Swathi Vijayakumar

IPC: H05K1/02 ,  G06F1/16 ,  H01F5/04 ,  H05K1/18

CPC classification number: H05K1/0243 ,  G06F1/1613 ,  H01F5/04 ,  H05K1/028 ,  H05K1/181 ,  H05K1/189 ,  H04B1/40

Abstract: Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.

公开(公告)号：US11955732B2

公开(公告)日：2024-04-09

申请号：US18089220

申请日：2022-12-27

Applicant: Intel Corporation

Inventor： Erkan Alpman ,  Arnaud Lucres Amadjikpe ,  Omer Asaf ,  Kameran Azadet ,  Rotem Banin ,  Miroslav Baryakh ,  Anat Bazov ,  Stefano Brenna ,  Bryan K. Casper ,  Anandaroop Chakrabarti ,  Gregory Chance ,  Debabani Choudhury ,  Emanuel Cohen ,  Claudio Da Silva ,  Sidharth Dalmia ,  Saeid Daneshgar Asl ,  Kaushik Dasgupta ,  Kunal Datta ,  Brandon Davis ,  Ofir Degani ,  Amr M. Fahim ,  Amit Freiman ,  Michael Genossar ,  Eran Gerson ,  Eyal Goldberger ,  Eshel Gordon ,  Meir Gordon ,  Josef Hagn ,  Shinwon Kang ,  Te Yu Kao ,  Noam Kogan ,  Mikko S. Komulainen ,  Igal Yehuda Kushnir ,  Saku Lahti ,  Mikko M. Lampinen ,  Naftali Landsberg ,  Wook Bong Lee ,  Run Levinger ,  Albert Molina ,  Resti Montoya Moreno ,  Tawfiq Musah ,  Nathan G. Narevsky ,  Hosein Nikopour ,  Oner Orhan ,  Georgios Palaskas ,  Stefano Pellerano ,  Ron Pongratz ,  Ashoke Ravi ,  Shmuel Ravid ,  Peter Andrew Sagazio ,  Eren Sasoglu ,  Lior Shakedd ,  Gadi Shor ,  Baljit Singh ,  Menashe Soffer ,  Ra'anan Sover ,  Shilpa Talwar ,  Nebil Tanzi ,  Moshe Teplitsky ,  Chintan S. Thakkar ,  Jayprakash Thakur ,  Avi Tsarfati ,  Yossi Tsfati ,  Marian Verhelst ,  Nir Weisman ,  Shuhei Yamada ,  Ana M. Yepes ,  Duncan Kitchin

IPC: H01Q9/04 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q3/24 ,  H01Q5/47 ,  H01Q21/24 ,  H03L7/14 ,  H04B1/3827 ,  H04B7/0456 ,  H04B7/06 ,  H04B15/04

CPC classification number: H01Q9/0414 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q3/24 ,  H01Q5/47 ,  H01Q21/24 ,  H03L7/145 ,  H04B1/3827 ,  H04B7/0482 ,  H04B7/0639 ,  H04B15/04

Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.

公开(公告)号：US20230276568A1

公开(公告)日：2023-08-31

申请号：US18157835

申请日：2023-01-22

Applicant: INTEL CORPORATION

Inventor： Ofer Markish ,  Sidharth Dalmia ,  Arnaud Amadjikpe

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  G01S13/931 ,  G01S7/03

CPC classification number: H05K1/0242 ,  H05K1/181 ,  H05K1/116 ,  G01S13/931 ,  G01S7/032 ,  H05K2201/09609 ,  H05K2201/096 ,  H05K2201/10734

Abstract: For example, an apparatus may include a Printed Circuit Board (PCB) including a Ball Grid Array (BGA) on a first side of the PCB, the BGA configured to connect a Surface Mounted Device (SMD) to the PCB; an antenna disposed on a second side of the PCB opposite to the first side, the antenna to communicate a Radio Frequency (RF) signal of the SMD; and an RF transition to transit the RF signal between the BGA and the antenna, the RF transition including a plurality of signal buried-vias; a first plurality of microvias configured to transit the RF signal between the plurality of signal buried-vias and a ball of the BGA, the first plurality of microvias are rotationally misaligned with respect to the plurality of signal buried-vias; and a second plurality of microvias configured to transit the RF signal between the plurality of signal buried-vias and the antenna.

公开(公告)号：US20230035608A1

公开(公告)日：2023-02-02

申请号：US17938768

申请日：2022-10-07

Applicant: Intel Corporation

Inventor： Sidharth Dalmia ,  Trang Thai

IPC: H01Q1/22 ,  H01Q9/04 ,  H01Q21/06 ,  H01L23/66

Abstract: Disclosed herein are antenna boards, integrated circuit (IC) packages, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an IC package having a die and a package substrate, and the package substrate has a recess therein; and an antenna patch, coupled to the package substrate, such that the antenna patch is over or at least partially in the recess.