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    NARROW SOURCE FOR PHYSICAL VAPOR DEPOSITION PROCESSING
    11.
    发明申请
    NARROW SOURCE FOR PHYSICAL VAPOR DEPOSITION PROCESSING 有权
    物理蒸气沉积加工的理论来源

    公开(公告)号：US20130284594A1

    公开(公告)日：2013-10-31

    申请号：US13871936

    申请日：2013-04-26

    Applicant: INTEVAC, INC.

    Inventor： Terry Bluck ,  Alex Riposan

    IPC: C23C14/34

    CPC classification number: H01J37/3423 ,  C23C14/3407 ,  C23C14/352 ,  C23C14/56 ,  C23C14/566 ,  H01J37/32779 ,  H01J37/3408 ,  H01J37/3411 ,  H01J37/3417 ,  H01J37/3435 ,  H01J37/3497

    Abstract: A narrow sputtering source and target which are designed to be installed in a series on a sputtering chamber. Each of the narrow sputtering source has length sufficient to traverse one direction of the sputtering zone, but is much narrower than the orthogonal direction of the sputtering zone. When the sputtering chamber performs a pass-by sputtering process, each of the narrow sputtering sources is sufficiently long to traverse the sputtering zone in the direction orthogonal to the substrate travel direction, but is much narrower than the sputtering zone in the direction of substrate travel. Several narrow sputtering sources are installed so as to traverse the entire sputtering zone in all directions.

    Abstract translation: 设计成在溅射室上串联安装的窄溅射源和靶。 每个窄的溅射源具有足以穿过溅射区的一个方向的长度，但是比溅射区的正交方向窄得多。 当溅射室进行通过溅射工艺时，每个窄溅射源足够长以在垂直于衬底行进方向的方向上穿过溅射区，但是比衬底行进方向上的溅射区窄得多 。 安装几个窄的溅射源，以便遍及整个溅射区域的所有方向。

    SYSTEM AND METHOD FOR COMMERCIAL FABRICATION OF PATTERNED MEDIA
    12.
    发明申请
    SYSTEM AND METHOD FOR COMMERCIAL FABRICATION OF PATTERNED MEDIA 审中-公开

    公开(公告)号：US20130098761A1

    公开(公告)日：2013-04-25

    申请号：US13712916

    申请日：2012-12-12

    Applicant: Intevac, Inc.

    Inventor： Kevin P. Fairbairn ,  Michael S. Barnes ,  Terry Bluck ,  Ren Xu ,  Charles Liu ,  Ralph Kerns

    IPC: G11B5/84

    CPC classification number: G11B5/84 ,  G11B5/855 ,  H01J37/3438

    Abstract: A system is provided for etching patterned media disks for hard drive. The modular system may be tailored to perform specific processes sequences so that a patterned media disk is fabricated without removing the disk from vacuum environment. In some sequence the magnetic stack is etched while in other the etch is performed prior to forming the magnetic stack. In a further sequence ion implantation is used without etching steps. For etching a movable non-contact electrode is utilized to perform sputter etch. The cathode moves to near contact distance to, but not contacting, the substrate so as to couple RF energy to the disk. The substrate is held vertically in a carrier and both sides are etched serially. That is, one side is etched in one chamber and then in the next chamber the second side is etched.

    SYSTEM AND METHOD FOR MAKING THICK-MULTILAYER DIELECTRIC FILMS
    15.
    发明公开
    SYSTEM AND METHOD FOR MAKING THICK-MULTILAYER DIELECTRIC FILMS 审中-公开

    公开(公告)号：US20230274920A1

    公开(公告)日：2023-08-31

    申请号：US18110269

    申请日：2023-02-15

    Applicant: INTEVAC, INC.

    Inventor： Terry Bluck ,  Samuel D. Harkness, IV ,  Tom Nolan

    IPC: H01J37/34 ,  H01J37/32

    CPC classification number: H01J37/3405 ,  H01J37/3452 ,  H01J37/32761 ,  H01J37/3244 ,  H01J37/32623

    Abstract: A linear processing system having an entry loadlock, a first multi-pass processing chamber coupled to the entry loadlock, the first multi-pass processing chamber having a sputtering magnetron arrangement and configured to house a single substrate carrier for performing a multi-pass processing; a single-pass chamber coupled to the first multi-pass processing chamber and having a plurality of magnetron arrangements arranged along a carrier travel direction, the single-pass chamber configured to house multiple carriers arranged serially in a row and configured for a single-pass processing; a second multi-pass processing chamber coupled to the single-pass processing chamber, the second multi-pass processing chamber having a sputtering magnetron arrangement and configured to house a single substrate carrier for performing a multi-pass processing; and an exit loadlock chamber coupled to the second multi-pass processing chamber.

    System with dual-motion substrate carriers
    16.
    发明授权
    System with dual-motion substrate carriers 有权

    公开(公告)号：US11414748B2

    公开(公告)日：2022-08-16

    申请号：US16583165

    申请日：2019-09-25

    Applicant: Intevac, Inc.

    Inventor： Terry Bluck

    IPC: H01L21/677 ,  C23C14/56 ,  C23C14/34 ,  C23C14/50 ,  H01L21/67

    Abstract: A processing system is provided, including a vacuum enclosure having a plurality of process windows and a continuous track positioned therein; a plurality of processing chambers attached sidewalls of the vacuum enclosures, each processing chamber about one of the process windows; a loadlock attached at one end of the vacuum enclosure and having a loading track positioned therein; at least one gate valve separating the loadlock from the vacuum enclosure; a plurality of substrate carriers configured to travel on the continuous track and the loading track; at least one track exchanger positioned within the vacuum enclosure, the track exchangers movable between a first position, wherein substrate carriers are made to continuously move on the continuous track, and a second position wherein the substrate carriers are made to transfer between the continuous track and the loading track.

    MULTI-COLORED DIELECTRIC COATING
    17.
    发明申请
    MULTI-COLORED DIELECTRIC COATING 审中-公开

    公开(公告)号：US20190383976A1

    公开(公告)日：2019-12-19

    申请号：US16281013

    申请日：2019-02-20

    Applicant: Intevac, Inc.

    Inventor： Terry Bluck ,  Paul Ramon Markoff Johnson ,  Alexander Vassilievich Demchuk

    IPC: G02B5/08 ,  H04M1/02

    Abstract: A multi-color dielectric coating is formed using interleaved layers of dielectric material, having alternating refractive index, to create reflections at selected wavelengths, thus appearing as different colors. Etching of selected layers at selected locations changes the color appearance of the etched locations, thus generating a coating having multiple colors. The thicknesses of the layers are chosen such that the path-length differences for reflections from different high-index layers are integer multiples of the wavelength for which the coating is designed.

    System architecture for vacuum processing
    18.
    发明授权
    System architecture for vacuum processing 有权

    公开(公告)号：US10115617B2

    公开(公告)日：2018-10-30

    申请号：US15284450

    申请日：2016-10-03

    Applicant: Intevac, Inc.

    Inventor： Terry Bluck ,  Vinay Shah ,  Alexandru Riposan

    IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687

    Abstract: A system for processing substrates in plasma chambers, such that all substrates transport and loading/unloading operations are performed in atmospheric environment, but processing is performed in vacuum environment. The substrates are transported throughout the system on carriers. The system's chambers are arranged linearly, such that carriers move from one chamber directly to the next. A conveyor, placed above or below the system's chambers, returns the carriers to the system's entry area after processing is completed. Loading and unloading of substrates may be performed at one side of the system, or loading can be done at the entry side and unloading at the exit side.

    Implant masking and alignment system with rollers
    20.
    发明授权
    Implant masking and alignment system with rollers 有权
    植入物遮蔽和对齐系统与滚筒

    公开(公告)号：US09543114B2

    公开(公告)日：2017-01-10

    申请号：US14819402

    申请日：2015-08-05

    Applicant: Intevac, Inc.

    Inventor： Babak Adibi ,  Vinay Prabhakar ,  Terry Bluck

    IPC: G01N23/00 ,  H01J37/20 ,  H01J37/18 ,  H01J37/317

    CPC classification number: H01J37/20 ,  H01J37/185 ,  H01J37/3045 ,  H01J37/3171 ,  H01J2237/2007 ,  H01J2237/202 ,  H01J2237/204 ,  H01J2237/31701 ,  H01J2237/31711

    Abstract: System and method to align a substrate under a shadow mask. A substrate holder has alignment mechanism, such as rollers, that is made to abut against an alignment straight edge. The substrate is then aligned with respect to the straight edge and is chucked to the substrate holder. The substrate holder is then transported into a vacuum processing chamber, wherein it is made to abut against a mask straight edge to which the shadow mask is attached and aligned to. Since the substrate was aligned to an alignment straight edge, and since the mask is aligned to the mask straight edge that is precisely aligned to the alignment straight edge, the substrate is perfectly aligned to the mask.

    Abstract translation: 将底物对准荫罩的系统和方法。 衬底保持器具有对准机构，例如辊，其抵靠对准直边缘。 然后将衬底相对于直边对准，并被夹持到衬底保持器。 然后将衬底保持器输送到真空处理室中，其中它与邻接荫罩直线边缘抵接，荫罩直线边缘与阴罩对准。 由于衬底与对准直边对准，并且由于掩模与精确地对准直线对准的掩模直边对准，所以基板与掩模完全对准。

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