公开(公告)号：US5434314A

公开(公告)日：1995-07-18

申请号：US181736

申请日：1994-01-18

Applicant: James C. Matayabas, Jr. ,  Stephen N. Falling

Inventor： James C. Matayabas, Jr. ,  Stephen N. Falling

IPC: C07C43/178 ,  C08G65/02 ,  C08G65/14 ,  C08G65/26 ,  C08G65/28 ,  C07C43/11 ,  C07C43/18

CPC classification number: C07C43/178 ,  C08G65/14 ,  C08G65/26

Abstract: Disclosed are novel polyether compounds obtained by the reaction or polymerization of 3,4-epoxy-1-butene in the presence of an acidic catalyst and a nucleophilic initiator compound. The polyether compounds comprise n units of residue (1) and m units of residue (2), wherein the total value of n+m is 2 to 70, n/(n+m) is a value in the range of 0.70 to 0.95, and residues (1) and (2) have the structures: ##STR1##

Abstract translation: 公开了在酸性催化剂和亲核引发剂化合物的存在下通过3,4-环氧-1-丁烯的反应或聚合获得的新型聚醚化合物。 聚醚化合物包含n个残基（1）单元和m个残基（2），其中n + m的总值为2〜70，n /（n + m）为0.70〜0.95的范围内的值 ，残基（1）和（2）具有以下结构：（1）OCH2CHCHCH2（2）

公开(公告)号：US09950393B2

公开(公告)日：2018-04-24

申请号：US13976001

申请日：2011-12-23

Applicant: Rajen S. Sidhu ,  Martha A. Dudek ,  James C. Matayabas, Jr. ,  Michelle S. Phen ,  Wei Tan

Inventor： Rajen S. Sidhu ,  Martha A. Dudek ,  James C. Matayabas, Jr. ,  Michelle S. Phen ,  Wei Tan

IPC: B23K35/02 ,  B23K35/362 ,  H01L23/00 ,  H05K3/34 ,  H01L23/488 ,  H01L23/498 ,  H01L21/48

CPC classification number: B23K35/025 ,  B23K35/362 ,  H01L21/4853 ,  H01L23/488 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0381 ,  H01L2224/03828 ,  H01L2224/03829 ,  H01L2224/03849 ,  H01L2224/0401 ,  H01L2224/05794 ,  H01L2224/058 ,  H01L2224/05809 ,  H01L2224/05811 ,  H01L2224/05813 ,  H01L2224/05817 ,  H01L2224/05839 ,  H01L2224/05844 ,  H01L2224/11334 ,  H01L2224/11848 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/3511 ,  H01L2924/3841 ,  H05K3/3489 ,  H05K2203/041 ,  H05K2203/046 ,  H01L2924/014 ,  H01L2924/01032 ,  H01L2924/01105 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/0103 ,  H01L2924/01083

Abstract: Flux formulations and solder attachment during the fabrication of electronic device assemblies are described. One flux formation includes a flux component and a metal particle component, the metal particle component being present in an amount of from 5 to 35 volume percent of the flux formulation. In one feature of certain embodiments, the metal particle component includes solder particles. Other embodiments are described and claimed.

公开(公告)号：US09646903B2

公开(公告)日：2017-05-09

申请号：US14171707

申请日：2014-02-03

Applicant: James C. Matayabas, Jr. ,  Saikumar Jayaraman

Inventor： Stephen E. Lehman, Jr. ,  James C. Matayabas, Jr. ,  Saikumar Jayaraman

IPC: C08G73/10 ,  C08L79/08 ,  H01L23/24 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/24 ,  C08G73/10 ,  C08L79/08 ,  C08L2203/20 ,  C08L2205/02 ,  H01L21/563 ,  H01L21/566 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00

Abstract: Dendrimer/hyperbranched materials are combined with polyimide to form a low CTE material for use as a dielectric substrate layer or an underfill. In the alternative, ruthenium carbene complexes are used to catalyze ROMP cross-linking reactions in polyimides to produce a class of cross-linkable, thermal and mechanical stable material for use as a dielectric substrate or underfill. In another alternative, dendrimers/hyperbranched materials are synthesized by different methods to produce low viscosity, high Tg, fast curing, mechanically and chemically stable materials for imprinting applications.

公开(公告)号：US07744802B2

公开(公告)日：2010-06-29

申请号：US10876508

申请日：2004-06-25

Applicant: James C. Matayabas, Jr.

Inventor： James C. Matayabas, Jr.

IPC: H05B6/00 ,  B29C47/00 ,  B29C45/14 ,  B29D7/00

CPC classification number: H01L23/53295 ,  H01L21/563 ,  H01L21/76828 ,  H01L23/5329 ,  H01L2924/0002 ,  H05K3/4626 ,  H05K2201/0141 ,  H05K2201/068 ,  H05K2203/104 ,  Y10T428/25 ,  H01L2924/00

Abstract: An embodiment of the present invention is a technique to provide a dielectric film material with a controllable coefficient of thermal expansion (CTE). A first compound containing a first liquid crystalline component is formed. The first compound is cast into a first film. The first film is oriented in an magnetic or electromagnetic field in a first direction. The first film is cured at a first temperature.

Abstract translation: 本发明的实施例是提供具有可控制的热膨胀系数（CTE）的电介质膜材料的技术。 形成含有第一液晶成分的第一化合物。 第一种化合物被铸成第一片。 第一膜在第一方向上的磁场或电磁场中取向。 第一个膜在第一个温度下固化。

公开(公告)号：US07700943B2

公开(公告)日：2010-04-20

申请号：US12195258

申请日：2008-08-20

Applicant: Nachiket R. Raravikar ,  James C. Matayabas, Jr.

Inventor： Nachiket R. Raravikar ,  James C. Matayabas, Jr.

IPC: H01L35/24

CPC classification number: B81C1/00206 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/16 ,  C01B32/174 ,  C01B2202/02 ,  C01B2202/06 ,  C01B2202/08 ,  H01L23/373 ,  H01L23/433 ,  H01L24/28 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/16152 ,  Y10S977/742 ,  Y10S977/745 ,  Y10S977/746 ,  Y10T428/25 ,  H01L2924/00

Abstract: An embodiment of the present invention is a technique to functionalize carbon nanotubes in situ. A carbon nanotube (NT) array is grown or deposited on a substrate. The NT array is functionalized in situ with a polymer by partial thermal degradation of the polymer to form a NT structure. The functionalization of the NT structure is characterized. The functionalized NT structure is processed according to the characterized functionalization.

Abstract translation: 本发明的一个实施方案是用于原位官能化碳纳米管的技术。 碳纳米管（NT）阵列生长或沉积在基底上。 NT阵列与聚合物原位官能化，聚合物通过部分热降解形成NT结构。 表征NT结构的功能化。 功能化的NT结构根据表征的功能化进行处理。

公开(公告)号：US07611985B2

公开(公告)日：2009-11-03

申请号：US11533653

申请日：2006-09-20

Applicant: James C. Matayabas, Jr. ,  Lakshmi Supriya

Inventor： James C. Matayabas, Jr. ,  Lakshmi Supriya

IPC: H01L21/4763

CPC classification number: H01L21/76897 ,  H01L21/486 ,  H01L21/76802 ,  H05K3/0017 ,  H05K2203/1173

Abstract: Methods and systems for forming holes in a substrate using dewetting coating are described herein.

Abstract translation: 本文描述了使用去湿涂层在基材中形成孔的方法和系统。

公开(公告)号：US07534649B2

公开(公告)日：2009-05-19

申请号：US11432986

申请日：2006-05-12

Applicant: Stephen E. Lehman, Jr. ,  James C. Matayabas, Jr. ,  Saikumar Jayaraman

Inventor： Stephen E. Lehman, Jr. ,  James C. Matayabas, Jr. ,  Saikumar Jayaraman

IPC: H01L21/00

CPC classification number: H01L23/24 ,  C08G73/10 ,  C08L79/08 ,  C08L2203/20 ,  C08L2205/02 ,  H01L21/563 ,  H01L21/566 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00

Abstract: Dendrimer/hyperbranched materials are combined with polyimide to form a low CTE material for use as a dielectric substrate layer or an underfill. In the alternative, ruthenium carbene complexes are used to catalyze ROMP cross-linking reactions in polyimides to produce a class of cross-linkable, thermal and mechanical stable material for use as a dielectric substrate or underfill. In another alternative, dendrimers/hyperbranched materials are synthesized by different methods to produce low viscosity, high Tg, fast curing, mechanically and chemically stable materials for imprinting applications.

Abstract translation: 树枝状聚合物/超支化材料与聚酰亚胺组合以形成用作电介质基底层或底部填充剂的低CTE材料。 另一方面，钌卡宾络合物用于催化聚酰亚胺中的ROMP交联反应，以产生用作电介质基底或底部填充剂的一类可交联，热和机械稳定的材料。 在另一种替代方案中，树枝状大分子/超支化材料通过不同的方法合成，以产生用于印记应用的低粘度，高Tg，快速固化，机械和化学稳定的材料。

公开(公告)号：US07019971B2

公开(公告)日：2006-03-28

申请号：US10676977

申请日：2003-09-30

Applicant: Sabina Houle ,  James C. Matayabas, Jr.

Inventor： Sabina Houle ,  James C. Matayabas, Jr.

IPC: H05K7/20

CPC classification number: H01L23/473 ,  H01L21/4878 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/16152 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/4935 ,  Y10T29/53109

Abstract: Apparatus and methods for providing self-contained, closed-loop microchannel cooling systems that can be integrated into a micro-component package, such as a microelectronic package, are described herein.

Abstract translation: 本文描述了用于提供可以集成到微组件封装（例如微电子封装）中的独立的闭环微通道冷却系统的装置和方法。

公开(公告)号：US06974723B2

公开(公告)日：2005-12-13

申请号：US10956162

申请日：2004-09-30

Applicant: James C. Matayabas, Jr. ,  Paul A. Koning ,  Ashay A. Dani ,  Christopher L. Rumer

Inventor： James C. Matayabas, Jr. ,  Paul A. Koning ,  Ashay A. Dani ,  Christopher L. Rumer

IPC: H01L23/31 ,  H01L23/373 ,  H01L23/42 ,  H01L29/866

CPC classification number: H01L23/3737 ,  H01L23/3128 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29499 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A composition including an amount of at least one vinyl terminated polymer; an amount of at least one cross-linker comprising a terminal Si—H unit; an amount of at least one thermally conductive first filler, and at least one thermally conductive second filler, wherein a melting point of the first filler is greater than the melting point of the second filler. An apparatus including a package configured to mate with a printed circuit board; a semiconductor device coupled to the package; a thermal element; and a curable thermal material disposed between the thermal element and the semiconductor device.

公开(公告)号：US06597575B1

公开(公告)日：2003-07-22

申请号：US10035209

申请日：2002-01-04

Applicant: James C. Matayabas, Jr. ,  Paul Koning ,  Jinlin Wang

Inventor： James C. Matayabas, Jr. ,  Paul Koning ,  Jinlin Wang

IPC: H05K720

CPC classification number: H01L23/3737 ,  H01L23/433 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/00

Abstract: An electronic package includes a heat-generating electronic component such as an integrated circuit chip, a thermally conductive member, which may be an integrated heat spreader, and a low modulus thermal interface material in heat conducting relation between the electronic component and the thermally conductive member. Increased thermal performance requirements at the electronic component level are met by the thermal interface material, which includes a polymer matrix and thermally conductive filler, which has a storage shear modulus (G′) at 125° C. of less than about 100 kPa, and which has a gel point, as indicated by a value of G′/G″ of ≧1, where G″ is the loss shear modulus of the thermal interface material. The values for G′ and G″ are measured by a strain-controlled rheometer.

Abstract translation: 电子封装包括诸如集成电路芯片的发热电子部件，可以是集成散热器的导热部件和在电子部件和导热部件之间的导热关系中的低模量热界面材料 。 通过热界面材料满足电子部件水平的增加的热性能要求，其包括聚合物基质和导热填料，其在125℃下的储能剪切模量（G'）小于约100kPa，以及 其具有如G'/ G“>> 1的值所示的凝胶点，其中G”是热界面材料的损耗剪切模量。 G'和G“的值由应变控制流变仪测量。