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56 条记录 (耗时 0.028 秒)

    Method and apparatus for contactless real-time in-situ monitoring of a chemical etching process
    12.
    发明授权
    Method and apparatus for contactless real-time in-situ monitoring of a chemical etching process 失效
    用于无接触实时原位监测化学蚀刻工艺的方法和装置

    公开(公告)号：US5456788A

    公开(公告)日：1995-10-10

    申请号：US414404

    申请日：1995-03-31

    申请人： Steven G. Barbee ,  Madhav Datta ,  Tony F. Heinz ,  Leping Li ,  Eugene H. Ratzlaff ,  Ravindra V. Shenoy

    发明人： Steven G. Barbee ,  Madhav Datta ,  Tony F. Heinz ,  Leping Li ,  Eugene H. Ratzlaff ,  Ravindra V. Shenoy

    IPC分类号： H01L21/66 ,  H01L21/306 ,  H01L21/3213 ,  C23F1/02

    CPC分类号： H01L21/32135

    摘要： A contactless method and apparatus for in-situ chemical etch monitoring of an etching process during etching of a workpiece with a wet chemical etchant are disclosed. The method comprises steps of providing a base member having a reference surface; releasably securing the workpiece to the base member; providing at least two sensors disposed on the base member to be proximate to but not in contact with the outer perimeter of the workpiece surface; and monitoring an electrical characteristic between said at least two sensors, wherein a prescribed change in the electrical characteristic is indicative of a prescribed condition of the etching process.

    摘要翻译： 公开了一种用于在用湿化学蚀刻剂蚀刻工件期间蚀刻工艺的原位化学蚀刻监测的非接触式方法和装置。 该方法包括提供具有参考表面的基底构件的步骤; 将工件可释放地固定到基座构件上; 提供设置在所述基座构件上的至少两个传感器以接近但不与所述工件表面的外周接触; 以及监测所述至少两个传感器之间的电特性，其中电特性的规定变化表示蚀刻处理的规定条件。

    Re-workable metallic TIM for efficient heat exchange
    17.
    发明申请
    Re-workable metallic TIM for efficient heat exchange 审中-公开
    可重复使用的金属TIM，用于高效的热交换

    公开(公告)号：US20070175621A1

    公开(公告)日：2007-08-02

    申请号：US11345556

    申请日：2006-01-31

    申请人： Madhav Datta ,  Peng Zhou ,  James Hom ,  Mark Munch ,  Mark McMaster

    发明人： Madhav Datta ,  Peng Zhou ,  James Hom ,  Mark Munch ,  Mark McMaster

    IPC分类号： H05K7/20

    CPC分类号： H01L23/3736 ,  H01L23/3735 ,  H01L23/473 ,  H01L2224/73253

    摘要： A heat exchanging system uses a metallic TIM for efficient heat transfer between a heat source and a heat exchanger. The heat source is preferably an integrated circuit coupled to a circuit board. The metallic TIM preferably comprises indium. The metallic TIM is comprised of either a separate metallic TIM foil or as a deposited layer of metal material. The metallic TIM foil is mechanically joined to a first surface of the heat exchanger and to a first surface of the integrated circuit by applying sufficient pressure during clamping. Disassembly is accomplished by un-clamping the heat exchanger, the metallic TIM foil, and the integrated circuit from each other. Once disassembled, the heat exchanger and the metallic TIM foil are available to be used again. If the metallic TIM is deposited onto the heat exchanger, disassembly yields a heat exchanging sub-assembly that is also reusable.

    摘要翻译： 热交换系统使用金属TIM来在热源和热交换器之间进行有效的热传递。 热源优选为耦合到电路板的集成电路。 金属TIM优选包含铟。 金属TIM由单独的金属TIM箔或金属材料的沉积层组成。 金属TIM箔通过在夹紧期间施加足够的压力机械地连接到热交换器的第一表面和集成电路的第一表面。 通过将热交换器，金属TIM箔和集成电路彼此不夹紧来实现拆卸。 一旦分解，热交换器和金属TIM箔可以再次使用。 如果金属TIM沉积在热交换器上，则拆卸产生也是可重复使用的热交换子组件。

    Method of electroless introduction of interconnect structures
    18.
    发明授权
    Method of electroless introduction of interconnect structures 有权
    化学引入互连结构的方法

    公开(公告)号：US06977224B2

    公开(公告)日：2005-12-20

    申请号：US09753256

    申请日：2000-12-28

    申请人： Valery M. Dubin ,  Christopher D. Thomas ,  Paul McGregor ,  Madhav Datta

    发明人： Valery M. Dubin ,  Christopher D. Thomas ,  Paul McGregor ,  Madhav Datta

    IPC分类号： H01L21/288 ,  H01L21/768 ,  H01L23/532 ,  H01L21/44

    CPC分类号： H01L21/76843 ,  H01L21/288 ,  H01L21/76846 ,  H01L21/76849 ,  H01L21/76864 ,  H01L21/76873 ,  H01L23/53228 ,  H01L23/53233 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method comprising introducing an interconnect structure in an opening through a dielectric over a contact point, and introducing a conductive shunt material through a chemically-induced oxidation-reduction reaction. A method comprising introducing an interconnect structure in an opening through a dielectric over a contact point, introducing a conductive shunt material having an oxidation number over an exposed surface of the interconnect structure, and reducing the oxidation number of the shunt. An apparatus comprising a substrate comprising a device having contact point, a dielectric layer overlying the device with an opening to the contact point, and an interconnect structure disposed in the opening comprising an interconnect material and a different conductive shunt material.

    摘要翻译： 一种方法，包括在开口中通过接触点上的电介质引入互连结构，以及通过化学诱导的氧化还原反应引入导电分流材料。 一种方法，包括在开口中通过介电层在接触点上引入互连结构，在互连结构的暴露表面上引入具有氧化数的导电分流材料，并减少分流的氧化数。 一种装置，包括：衬底，其包括具有接触点的器件，覆盖所述器件的介电层，所述器件具有到所述接触点的开口;以及布置在所述开口中的互连结构，包括互连材料和不同的导电分流材料。

    High performance metal cone contact
    20.
    发明授权
    High performance metal cone contact 失效
    高性能金属锥接触

    公开(公告)号：US5190463A

    公开(公告)日：1993-03-02

    申请号：US797575

    申请日：1991-11-25

    申请人： Madhav Datta ,  David E. King ,  Alan D. Knight ,  Carlos J. Sambucetti

    发明人： Madhav Datta ,  David E. King ,  Alan D. Knight ,  Carlos J. Sambucetti

    IPC分类号： H01H1/06 ,  H01L21/60 ,  H01R12/04 ,  H01R12/32 ,  H01R13/03 ,  H01R13/22 ,  H01R43/16 ,  H05K1/11 ,  H05K3/06 ,  H05K3/07 ,  H05K3/24 ,  H05K3/38 ,  H05K3/40

    CPC分类号： H05K3/07 ,  H01R13/22 ,  H05K3/4007 ,  H01L2924/0002 ,  H01R13/03 ,  H01R43/16 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2203/0369 ,  H05K3/064 ,  H05K3/383 ,  Y10T29/49222

    摘要： An electrical interconnection, which includes a method for fabricating the device, is disclosed. The interconnection comprises two contact surfaces, on at least one of which is disposed at least one solid metal conical projection in predetermined dimension and location. Rather than necessarily being permanently cojoined, the contact surfaces are attachable and detachable when desired. The conical projections on one contact surface make ohmic contact, either by wiping with an intermeshing like structure on a second contact surface or by contacting a second contact surface which is a substantially flat contact pad. An interconnection, in this invention, is the combination of at least one contact having individual conical projections and another contact, optionally having individual conical projections. The conical projections are formed in metal by electrochemical machining in neutral salt solution, optionally in a continuous foil. The conical projections are also optionally formed on the head of a contact pin.

    摘要翻译： 公开了一种包括制造该装置的方法的电互连。 互连包括两个接触表面，其中至少一个接触表面设置有至少一个预定尺寸和位置的固体金属锥形突起。 不必一定地永久地共同接合，当需要时，接触表面是可附接的和可拆卸的。 一个接触表面上的锥形突起通过在第二接触表面上用相互啮合的结构擦拭或者通过接触作为基本上平坦的接触垫的第二接触表面来进行欧姆接触。 在本发明中的互连是至少一个具有单独的锥形突起的接触件和另一个接触件的组合，可选地具有单独的锥形突出部。 锥形凸起通过在中性盐溶液中的电化学机械加工形成金属，任选地在连续的箔中。 锥形突起也可选地形成在接触销的头部上。