公开(公告)号：US10974492B2

公开(公告)日：2021-04-13

申请号：US16795008

申请日：2020-02-19

Applicant: NICHIA CORPORATION

Inventor： Daisuke Sanga ,  Masatsugu Ichikawa ,  Shunsuke Minato ,  Toru Takasone ,  Masahiko Sano

IPC: F21V21/00 ,  B32B38/00 ,  B32B37/02 ,  H01L33/58 ,  H01L33/60 ,  H01L33/00

Abstract: A light emitting device can further improve light extraction efficiency. A method of manufacturing such a light emitting device can also prove advantageous. The light emitting device includes a light emitting element, a light-transmissive member which is disposed on a light extracting surface side of the light emitting element, and a reflecting layer disposed on an element bonding surface of the light transmissive member where the light emitting element is disposed and adjacent to the light emitting element. The light-transmissive member, in a plan view, has a planar dimension greater than the light extracting surface of the light emitting element.

公开(公告)号：US09914288B2

公开(公告)日：2018-03-13

申请号：US14534614

申请日：2014-11-06

Applicant: NICHIA CORPORATION

Inventor： Daisuke Sanga ,  Masatsugu Ichikawa ,  Shunsuke Minato ,  Toru Takasone ,  Masahiko Sano

IPC: F21V9/00 ,  B32B38/00 ,  B32B37/02 ,  H01L33/00 ,  H01L33/58 ,  H01L33/60

CPC classification number: B32B38/0004 ,  B32B37/02 ,  B32B2305/55 ,  B32B2307/412 ,  B32B2551/00 ,  H01L33/0079 ,  H01L33/58 ,  H01L33/60

Abstract: A light emitting device can further improve light extraction efficiency. A method of manufacturing such a light emitting device can also prove advantageous. The light emitting device includes a light emitting element, a light-transmissive member which is disposed on a light extracting surface side of the light emitting element, and a reflecting layer disposed on an element bonding surface of the light transmissive member where the light emitting element is disposed and adjacent to the light emitting element. The light-transmissive member, in a plan view, has a planar dimension greater than the light extracting surface of the light emitting element.

公开(公告)号：US09054271B2

公开(公告)日：2015-06-09

申请号：US14152765

申请日：2014-01-10

Applicant: NICHIA CORPORATION

Inventor： Shunsuke Minato ,  Junya Narita ,  Yohei Wakai ,  Yukio Narukawa ,  Motokazu Yamada

IPC: H01L27/15 ,  H01L29/267 ,  H01L33/24 ,  H01L33/10 ,  H01L33/20 ,  H01L33/32

CPC classification number: H01L33/24 ,  H01L33/10 ,  H01L33/20 ,  H01L33/32 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/00

Abstract: A light emitting element having a recess-protrusion structure on a substrate is provided. A semiconductor light emitting element 100 has a light emitting structure of a semiconductor 20 on a first main surface of a substrate 10. The first main surface of the substrate 10 has substrate protrusion portion 11, the bottom surface 14 of each protrusion is wider than the top surface 13 thereof in a cross-section, or the top surface 13 is included in the bottom surface 14 in a top view of the substrate. The bottom surface 14 has an approximately polygonal shape, and the top surface 13 has an approximately circular or polygonal shape with more sides than that of the bottom surface 14.

Abstract translation: 提供了在基板上具有凹凸结构的发光元件。 半导体发光元件100在基板10的第一主表面上具有半导体20的发光结构。基板10的第一主表面具有基板突出部11，每个突起的底表面14比 顶表面13处于横截面，或者顶表面13以衬底的顶视图包括在底表面14中。 底面14具有近似多边形的形状，并且顶面13具有大致圆形或多边形形状，其侧面比底面14多。

公开(公告)号：US08686457B2

公开(公告)日：2014-04-01

申请号：US13759892

申请日：2013-02-05

Applicant: Nichia Corporation

Inventor： Shunsuke Minato ,  Junya Narita ,  Yohei Wakai ,  Yukio Narukawa ,  Motokazu Yamada

IPC: H01L31/0232

CPC classification number: H01L33/24 ,  H01L33/10 ,  H01L33/20 ,  H01L33/32 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/00

Abstract: A light emitting element having a recess-protrusion structure on a substrate is provided. A semiconductor light emitting element 100 has a light emitting structure of a semiconductor 20 on a first main surface of a substrate 10. The first main surface of the substrate 10 has substrate protrusion portion 11, the bottom surface 14 of each protrusion is wider than the top surface 13 thereof in a cross-section, or the top surface 13 is included in the bottom surface 14 in a top view of the substrate. The bottom surface 14 has an approximately polygonal shape, and the top surface 13 has an approximately circular or polygonal shape with more sides than that of the bottom surface 14.

Abstract translation: 提供了在基板上具有凹凸结构的发光元件。 半导体发光元件100在基板10的第一主表面上具有半导体20的发光结构。基板10的第一主表面具有基板突出部11，每个突起的底表面14比 顶表面13处于横截面，或者顶表面13以衬底的顶视图包括在底表面14中。 底面14具有近似多边形的形状，并且顶面13具有大致圆形或多边形形状，其侧面比底面14多。

公开(公告)号：US11735699B2

公开(公告)日：2023-08-22

申请号：US17574474

申请日：2022-01-12

Applicant: NICHIA CORPORATION

Inventor： Shunsuke Minato ,  Masahiko Sano

IPC: H01L33/60 ,  H01L33/50 ,  H01L33/58 ,  H01L33/62 ,  H01L33/44 ,  H01L33/54 ,  H01L33/56 ,  H01L25/075

CPC classification number: H01L33/60 ,  H01L33/505 ,  H01L33/507 ,  H01L33/58 ,  H01L33/62 ,  H01L25/0753 ,  H01L33/44 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0568 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/05673 ,  H01L2224/05684 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/013 ,  H01L2933/0091 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05655 ,  H01L2924/00014 ,  H01L2224/05664 ,  H01L2924/00014 ,  H01L2224/05666 ,  H01L2924/00014 ,  H01L2224/05669 ,  H01L2924/00014 ,  H01L2224/05671 ,  H01L2924/00014 ,  H01L2224/05684 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2924/013 ,  H01L2924/00014 ,  H01L2224/05669 ,  H01L2924/013 ,  H01L2924/00014 ,  H01L2224/05664 ,  H01L2924/013 ,  H01L2924/00014 ,  H01L2224/05673 ,  H01L2924/013 ,  H01L2924/00014 ,  H01L2224/05655 ,  H01L2924/013 ,  H01L2924/013 ,  H01L2924/00014 ,  H01L2224/05684 ,  H01L2924/00014 ,  H01L2224/0568 ,  H01L2924/013 ,  H01L2924/00014 ,  H01L2224/05671 ,  H01L2924/013 ,  H01L2924/00014 ,  H01L2224/05666 ,  H01L2924/013 ,  H01L2924/00014

Abstract: A light emitting apparatus includes: a mount substrate; at least one light emitting device mounted on the mount substrate; a light transparent member, wherein a lower surface of the light transparent member is attached to an upper surface of the at least one light emitting device via at least one adhesive material layer, wherein the light transparent member has a plate shape and is positioned to receive incident light emitted from the light emitting devices, and wherein a lateral surface of the light transparent member is located laterally inward of a lateral surface of the at least one light emitting device; and a covering member that contains a light reflective material and covers at least the lateral surface of the light transparent member.

公开(公告)号：US10424693B2

公开(公告)日：2019-09-24

申请号：US15892298

申请日：2018-02-08

Applicant: NICHIA CORPORATION

Inventor： Shunsuke Minato

IPC: H01L33/38 ,  H01L33/00 ,  H01L33/32 ,  H01L33/44

Abstract: A semiconductor light emitting element includes a first semiconductor layer, an active layer, a second semiconductor layer, a first conducting layer, a second conducting layer, and an insulating layer. The insulating layer is disposed at least on or above the upper surface of the second conducting layer. Holes are opened at given intervals through the second semiconductor layer to expose the first semiconductor layer at bottom surfaces of the holes. In each of the holes, the insulating layer covers from a side-wall surface of each of the holes to a first region provided on or above the upper surface of the second conducting layer around a top of each of the holes. The first conducting layer covers from the bottom surface of each of the holes to a second region provided over the second conducting layer and the insulating layer around the top of each of the holes.

公开(公告)号：US09853194B2

公开(公告)日：2017-12-26

申请号：US14688765

申请日：2015-04-16

Applicant: Nichia Corporation

Inventor： Shunsuke Minato ,  Masahiko Sano

IPC: H01L33/60 ,  H01L33/50 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L33/44 ,  H01L33/54 ,  H01L25/075

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L33/44 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/05673 ,  H01L2224/0568 ,  H01L2224/05684 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/013 ,  H01L2933/0091 ,  H01L2924/00014

Abstract: A light emitting apparatus includes at least one light emitting device; a light transparent member that receives incident light emitted from the light emitting device; and a covering member. The light transparent member is a light conversion member that has an externally exposed light emission surface and a side surface contiguous to the light emission surface. The covering member contains a light reflective material, and covers at least the side surface of said light transparent member. A content of said light reflective material is not less than 30 wt %.

公开(公告)号：US20140322844A1

公开(公告)日：2014-10-30

申请号：US14263695

申请日：2014-04-28

Applicant: NICHIA CORPORATION

Inventor： Masatsuga Ichikawa ,  Masahiko Sano ,  Daisuke Sanga ,  Toru Takasone ,  Shunsuke Minato

IPC: H01L33/50

CPC classification number: H01L33/0079 ,  H01L33/505 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: Provided is a method for manufacturing a light emitting device comprising a light emitting element and an optical part, the method comprising the steps of (i) forming a hydroxyl film on a bonding surface of each of the light emitting element and the optical part by an atomic layer deposition, and (ii) bonding the bonding surfaces of the light emitting element and the optical part with each other, each of the bonding surfaces having the hydroxyl film formed thereon, wherein a substep is repeated at least one time in the step (i), in which substep a first raw material gas and a second raw material gas are sequentially supplied onto the bonding surfaces of the light emitting element and the optical part, and wherein the bonding of the bonding surfaces in the step (ii) is performed without a heating treatment.

Abstract translation: 提供一种制造包括发光元件和光学部件的发光器件的方法，所述方法包括以下步骤：（i）在每个发光元件和光学部件的接合表面上形成羟基膜， 原子层沉积，和（ii）将发光元件和光学部件的结合面彼此粘合，每个接合表面上形成有羟基膜，其中子步骤在该步骤中重复至少一次（ i），其中第一原料气体和第二原料气体顺序地供应到发光元件和光学部件的接合表面上，并且其中执行步骤（ii）中的接合表面的接合 没有加热处理。