公开(公告)号：US20140017829A1

公开(公告)日：2014-01-16

申请号：US14025684

申请日：2013-09-12

Applicant: NICHIA CORPORATION

Inventor： Tomohide MIKI ,  Kenji TAKINE ,  Ryohei YAMASHITA

IPC: H01L33/54

CPC classification number: H01L33/507 ,  H01L25/0753 ,  H01L33/505 ,  H01L33/508 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The light emitting device comprises a substrate (2), a positive electrode (6) and a negative electrode (4) formed on the substrate (2), a light emitting diode (8) connected to the positive electrode (6) and the negative electrode (4), the transparent resin (12 and 14) that covers the light emitting diode (8), a fluorescent material (16) that absorbs at least part of light emitted by the light emitting diode (8) and converts it to light of longer wavelength, and the lens that changes the direction of light emission from the light emitting diode (8) and/or the fluorescent material (16). The resin (12 and 14) includes the fluorescent material (16) and is formed so as to constitute the lens of substantially semi-cylindrical shape, and the fluorescent material (16) included in the resin (12 and 14) is distributed with a higher concentration in a region near the surface of the light emitting diode (8) than in a region near the surface of the portion that constitutes the lens.

Abstract translation: 发光装置包括：基板（2），形成在基板（2）上的正极（6）和负极（4）;与正极（6）连接的发光二极管（8） 电极（4），覆盖发光二极管（8）的透明树脂（12和14），吸收由发光二极管（8）发射的光的至少一部分并将其转换为光的荧光材料（16） 以及改变来自发光二极管（8）和/或荧光材料（16）的发光方向的透镜。 树脂（12和14）包括荧光材料（16）并且形成为构成大致半圆柱形状的透镜，并且包含在树脂（12和14）中的荧光材料（16）分布在 在发光二极管（8）的表面附近的区域中比在构成透镜的部分的表面附近的区域更高的浓度。

公开(公告)号：US20210336094A1

公开(公告)日：2021-10-28

申请号：US17371943

申请日：2021-07-09

Applicant: NICHIA CORPORATION

Inventor： Hirofumi ICHIKAWA ,  Masaki HAYASHI ,  Shimpei SASAOKA ,  Tomohide MIKI

IPC: H01L33/48 ,  H01L33/00 ,  H01L33/64 ,  H01L33/60 ,  H01L33/62 ,  B29C45/00 ,  H01L33/50 ,  H01L23/00 ,  H01L33/56 ,  B29C45/14

Abstract: A light emitting device includes: a resin package including: a resin part, and a plurality of leads including a first lead and a second lead, wherein the resin package has a concave portion having a bottom face at which a part of an upper surface of the first lead and a part of an upper surface of the second lead are exposed from the resin part; a light emitting element mounted on the bottom face of the concave portion; and a sealing member covering the light emitting element in the concave portion. The plurality of leads comprise a plurality of notch parts including a first notch part on a first side corresponding to a first outer side surface of the resin package and a second notch part on a second side corresponding to a second outer side surface of the resin package.

公开(公告)号：US20180006205A1

公开(公告)日：2018-01-04

申请号：US15692542

申请日：2017-08-31

Applicant: NICHIA CORPORATION

Inventor： Masato FUJITOMO ,  Hiroto TAMAKI ,  Shinji NISHIJIMA ,  Yuichiro TANDA ,  Tomohide MIKI

IPC: H01L33/62 ,  H01L31/02 ,  H01L33/48 ,  H01L33/52 ,  H01L23/00 ,  H01L31/0203 ,  H01L25/16

CPC classification number: H01L33/62 ,  H01L24/97 ,  H01L25/167 ,  H01L31/02002 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2924/00012

Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

公开(公告)号：US20170256695A1

公开(公告)日：2017-09-07

申请号：US15603653

申请日：2017-05-24

Applicant: NICHIA CORPORATION

Inventor： Tomohide MIKI

IPC: H01L33/62

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A light emitting device includes a package, a light emitting element, and a sealing member. The package is equipped with a lead and a molded resin that holds the lead. The lead has an upper surface and a lower surface, and has a metal board and a plating layer. The plating layer includes a first plating layer that contains a nickel plating layer, a gold plating layer, and a silver plating layer, that is provided to an upper surface of the metal board, and that is not provided to a lower surface of the metal board. The light emitting element is mounted in the package. The sealing member seals the light emitting element.

公开(公告)号：US20170133568A1

公开(公告)日：2017-05-11

申请号：US15416221

申请日：2017-01-26

Applicant: NICHIA CORPORATION

Inventor： Tomohide MIKI

IPC: H01L33/64 ,  H01L33/62 ,  H01L33/60

CPC classification number: H01L33/647 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device includes a resin package and a light emitting element. The resin package includes a molded resin part and a pair of leads. The molded resin part defines a part of a recessed portion. Each of the leads includes a plating layer including a first plating portion and a second plating portion. Each of the leads is exposed from the molded resin part at a lower surface of the resin package with the first plating portion being arranged in at least a part of the lead exposed at the lower surface of the resin package. Each of the leads includes an exposed portion exposed from the molded resin part at a lateral side surface of the resin package with the second plating portion being arranged in an outer periphery of the exposed portion. The light emitting element is mounted on the bottom surface of the recessed portion.

公开(公告)号：US20160155914A1

公开(公告)日：2016-06-02

申请号：US15017997

申请日：2016-02-08

Applicant: NICHIA CORPORATION

Inventor： Tomohide MIKI

IPC: H01L33/56 ,  H01L33/46 ,  H01L33/50

CPC classification number: H01L33/56 ,  H01L33/46 ,  H01L33/50 ,  H01L33/54 ,  H01L2224/16245 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2933/0025 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2924/00012

Abstract: There is provided a light emitting device including a light emitting element, a covering member for covering a side surface of the light emitting element, and a light-transmissive member disposed on upper surfaces in a light emitting direction of the light emitting element and the covering member and having an end face on substantially the same plane as an end face of the covering member, wherein the covering member has a recess portion or a convex portion on the upper surface, a light emitting surface of the light emitting element and an upper surface other than the recess portion or the convex portion of the covering member are arranged on substantially the same plane, and the light-transmissive member is provided in contact with the recess portion or the convex portion.

公开(公告)号：US20140027780A1

公开(公告)日：2014-01-30

申请号：US14044419

申请日：2013-10-02

Applicant: NICHIA CORPORATION

Inventor： Masafumi KURAMOTO ,  Tomohide MIKI ,  Tomoya TSUKIOKA ,  Tomohisa KISHIMOTO

IPC: H01L33/56 ,  H01L33/32

CPC classification number: H01L33/36 ,  C08G59/3245 ,  C08K3/013 ,  C08K5/005 ,  H01L33/32 ,  H01L33/56 ,  H01L33/60 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed is a light-emitting device comprising a light-emitting element (10) composed of a gallium nitride compound semiconductor having an emission peak wavelength of not less than 430 nm; a molded body (40) provided with a recessed portion having a bottom surface on which the light-emitting element (10) is mounted and a lateral surface; and a sealing member (50) containing an epoxy resin including a triazine derivative epoxy resin, or a silicon-containing resin. The molded body (40) is obtained by using a cured product of a thermosetting epoxy resin composition essentially containing an epoxy resin including a triazine derivative epoxy resin, and has a reflectance of not less than 70% at the wavelengths of not less than 430 nm.

公开(公告)号：US20220158061A1

公开(公告)日：2022-05-19

申请号：US17588882

申请日：2022-01-31

Applicant: NICHIA CORPORATION

Inventor： Masato FUJITOMO ,  Hiroto TAMAKI ,  Shinji NISHIJIMA ,  Yuichiro TANDA ,  Tomohide MIKI

IPC: H01L33/62 ,  H01L23/00 ,  H01L33/48 ,  H01L31/0203 ,  H01L31/02 ,  H01L33/52

Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

公开(公告)号：US20180301600A1

公开(公告)日：2018-10-18

申请号：US16007954

申请日：2018-06-13

Applicant: NICHIA CORPORATION

Inventor： Hirofumi ICHIKAWA ,  Masaki HAYASHI ,  Shimpei SASAOKA ,  Tomohide MIKI

IPC: H01L33/48 ,  H01L33/00 ,  H01L33/56 ,  H01L33/50 ,  B29C45/00 ,  B29C45/14 ,  H01L33/60 ,  H01L33/62

Abstract: A method of manufacturing a light emitting device having a resin package which provides an optical reflectivity equal to or more than 70% at a wavelength between 350 nm and 800 nm after thermal curing, and in which a resin part and a lead are formed in a substantially same plane in an outer side surface, includes a step of sandwiching a lead frame provided with a notch part, by means or an upper mold and a lower mold, a step of transfer-molding a thermosetting resin containing a light reflecting material in a mold sandwiched by the upper mold and the lower mold to form a resin-molded body in the lead frame and a step of cutting the resin-molded body and the lead frame along the notch part.

公开(公告)号：US20170054061A1

公开(公告)日：2017-02-23

申请号：US15241075

申请日：2016-08-19

Applicant: NICHIA CORPORATION

Inventor： Ryoji NAKA ,  Atsushi BANDO ,  Tomohide MIKI ,  Kimihiro MIYAMOTO

IPC: H01L33/56 ,  H01L33/08 ,  H01L33/62 ,  H01L33/48 ,  H01L33/60

CPC classification number: H01L33/56 ,  H01L25/0753 ,  H01L33/08 ,  H01L33/48 ,  H01L33/486 ,  H01L33/52 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/8592 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device includes a package, at least one light emitting element, a light-transmissive resin, and a light reflecting resin. The package has a recess which includes a bottom surface and an inner peripheral surface. The bottom surface includes a light emitting element mounting region and a groove. The groove has an inner peripheral edge and an outer peripheral edge on the bottom surface to define the groove between the inner peripheral edge and the outer peripheral edge. The at least one light emitting element is mounted on the light emitting element mounting region. The light-transmissive resin is provided in the recess to cover the at least one light emitting element and to be in contact with the groove. The light reflecting resin is provided between the inner peripheral surface of the recess and the light-transmissive resin to reach the outer peripheral edge of the groove.

Abstract translation: 发光器件包括封装，至少一个发光元件，透光树脂和光反射树脂。 该包装具有包括底面和内周面的凹部。 底面包括发光元件安装区域和凹槽。 凹槽在底表面上具有内周缘和外周缘，以限定内周边缘和外周边缘之间的凹槽。 至少一个发光元件安装在发光元件安装区域上。 透光树脂设置在凹部中以覆盖至少一个发光元件并与凹槽接触。 光反射树脂设置在凹槽的内周表面和透光树脂之间，以到达凹槽的外周边缘。