公开(公告)号：US20050056687A1

公开(公告)日：2005-03-17

申请号：US10913370

申请日：2004-08-09

申请人： Kazutaka Matsumoto ,  Masahiro Tadauchi ,  Izuru Komatsu

发明人： Kazutaka Matsumoto ,  Masahiro Tadauchi ,  Izuru Komatsu

IPC分类号： B23K35/363 ,  B23K35/02 ,  B23K35/22 ,  B23K35/26 ,  B23K35/36 ,  C08G59/42 ,  H05K3/34 ,  B23K31/00

CPC分类号： H05K3/3484 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K35/36 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3618 ,  B23K2101/40 ,  H05K3/3489 ,  H05K2201/10977

摘要： The invention aims to provide a thermosetting flux suitable for solder bonding of a semiconductor element and an electronic part and making solder bonding with a high bonding strength and a high heat resistant strength at a high temperature possible and a paste containing the flux and a non-lead type solder paste and with respect to the thermosetting flux, an epoxy resin, a hardening agent, and at least one of rosin derivatives having functional groups reactive on the epoxy resin and selected from maleic acid-modified rosin, a fumaric acid-modified rosin, and acrylic acid-modified rosin are used. The flux can be used in form of a solder paste while being mixed and kneaded with the non-lead type solder alloy powder.

摘要翻译： 本发明的目的是提供一种适用于半导体元件和电子部件的焊接的热固性焊剂，并且可以在高温下具有高接合强度和高耐热强度的焊接，并且含有焊剂和非焊接材料， 铅类焊膏，相对于热固化性助焊剂，环氧树脂，硬化剂，以及具有官能团的至少一种具有在环氧树脂上反应并且选自马来酸改性松香，富马酸改性松香 ，和丙烯酸改性松香。 焊剂可以以焊膏的形式使用，同时与非铅型焊料合金粉末混合和捏合。

公开(公告)号：US06673310B2

公开(公告)日：2004-01-06

申请号：US09749606

申请日：2000-12-28

申请人： Masahiro Tadauchi ,  Izuru Komatsu ,  Hiroshi Tateishi ,  Kouichi Teshima ,  Kazutaka Matsumoto ,  Tetsuji Hori

发明人： Masahiro Tadauchi ,  Izuru Komatsu ,  Hiroshi Tateishi ,  Kouichi Teshima ,  Kazutaka Matsumoto ,  Tetsuji Hori

IPC分类号： C22C1300

CPC分类号： B23K35/282 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/28 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/36 ,  B23K2101/36 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/97 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3463 ,  H01L2924/00 ,  H01L2924/00012

摘要： Disclosed is a high-temperature solder material which is composed of tin, zinc and silver, or of 0.01 to 2 wt % germanium or aluminum and the balance tin, or tin and zinc at a ratio of 80/20 to 70/30. The tin/zinc/silver solder has a composition ratio that the ratio of till to zinc is within a range of 97/3 to 79/21 by weight, and the ratio of the sum of tin and zinc to silver is within a range of 88/12 to 50/50 by weight, or that the ratio of tin to zinc is within a range of 70/30 to 5/95 by weight, and the ratio of silver to the sum of tin, zinc and silver is 15% by weight or less. The solder material is used for producing electric or electronic devices and equipments.

摘要翻译： 公开了由锡，锌和银组成的高温焊料材料，或0.01至2重量％的锗或铝，余量为锡，或锡和锌的比例为80/20至70/30。 锡/锌/银焊料的组成比为：直到锌的比例在97/3〜79/21的范围内，锡和锌与银的和的比例在 88/12〜50/50，或锡与锌的比例在70/30〜5/95的范围内，银与锡，锌和银之和的比率为15％ 以下。 焊料用于生产电气或电子设备和设备。

公开(公告)号：US20130063957A1

公开(公告)日：2013-03-14

申请号：US13601217

申请日：2012-08-31

申请人： Makoto SAKAI ,  Takumi Suwa ,  Shinji Nakata ,  Daigo Suzuki ,  Izuru Komatsu ,  Michinobu Inoue ,  Kumiko Ioka ,  Kazuki Tateyama ,  Yasuhide Okada

发明人： Makoto SAKAI ,  Takumi Suwa ,  Shinji Nakata ,  Daigo Suzuki ,  Izuru Komatsu ,  Michinobu Inoue ,  Kumiko Ioka ,  Kazuki Tateyama ,  Yasuhide Okada

IPC分类号： F21V21/00 ,  F21V17/00

CPC分类号： F21V3/00 ,  F21K9/232 ,  F21K9/60 ,  F21V29/713 ,  F21V29/74 ,  F21Y2115/10 ,  Y10T29/49002

摘要： A lighting device according to an embodiment includes a main body unit, a light source which is provided at one end portion of the main body unit, and includes a light emitting element, a globe which is provided so as to cover the light source, and a heat conducting unit whose end surface on the globe side is exposed on the outside of the globe, and which thermally bonds the globe and a heat radiating surface of the main body unit on the end portion side. The heat conducting unit includes a plate-shaped unit in which a first plate-shaped body, and a second plate-shaped body which crosses the first plate-shaped body are integrally formed.

摘要翻译： 根据实施例的照明装置包括主体单元，设置在主体单元的一个端部处的光源，并且包括发光元件，设置成覆盖光源的球面，以及 导体单元，其在球面侧的端面暴露在球体的外侧，并且在端部侧热接合球体和主体单元的散热面。 导热单元包括板状单元，其中第一板状体和与第一板状体交叉的第二板状体一体形成。

公开(公告)号：US20080073794A1

公开(公告)日：2008-03-27

申请号：US11854187

申请日：2007-09-12

申请人： Susumu Obata ,  Izuru Komatsu ,  Tomohiro Iguchi ,  Tomoyuki Kitani ,  Masako Hirahara ,  Yasunari Ukita ,  Kazuhito Higuchi

发明人： Susumu Obata ,  Izuru Komatsu ,  Tomohiro Iguchi ,  Tomoyuki Kitani ,  Masako Hirahara ,  Yasunari Ukita ,  Kazuhito Higuchi

IPC分类号： H01L23/48 ,  H01L21/4763

CPC分类号： H01L23/49562 ,  H01L23/3135 ,  H01L23/49524 ,  H01L24/24 ,  H01L24/40 ,  H01L24/82 ,  H01L24/84 ,  H01L2224/24246 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/8485 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device (3) is provided with a first electrode (A), a lead (4) has a second electrode (B), and a metallic film (6) electrically interconnects the first electrode (A) and the second electrode (B), allowing for a more reduced internal resistance, high reliability, and facilitated fabrication.

摘要翻译： 半导体器件（3）具有第一电极（A），引线（4）具有第二电极（B），金属膜（6）将第一电极（A）和第二电极（B） ），允许更低的内阻，高可靠性和便于制造。

公开(公告)号：US06949814B2

公开(公告)日：2005-09-27

申请号：US10252088

申请日：2002-09-23

申请人： Cao Minh Thai ,  Hiroshi Tateishi ,  Koichi Teshima ,  Masahiro Tadauchi ,  Izuru Komatsu ,  Tetsuji Hori

发明人： Cao Minh Thai ,  Hiroshi Tateishi ,  Koichi Teshima ,  Masahiro Tadauchi ,  Izuru Komatsu ,  Tetsuji Hori

IPC分类号： H01L21/52 ,  H01L21/60 ,  H01L23/495

CPC分类号： H01L24/83 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49551 ,  H01L24/27 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83194 ,  H01L2224/83439 ,  H01L2224/83801 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01009 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/13091 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device, comprising a frame including a die pad and a lead portion; a semiconductor element; a wire including one end connected to the semiconductor element and another end connected to the lead portion; at least one first bonding portion formed of a solder material and bonding a part of an upper surface of the die pad to a part which is on a lower surface of the semiconductor element and which is opposed to the part of the upper surface of the die pad; and at least one second bonding portion formed of a thermosetting resin and bonding another part of the upper surface of the die pad to another part which is on the lower surface of the semiconductor element and which is opposed to said another part of the upper surface of the die pad.

摘要翻译： 一种半导体器件，包括：包括管芯焊盘和引线部分的框架; 半导体元件 电线，其包括连接到所述半导体元件的一端和连接到所述引线部分的另一端; 由焊料材料形成的至少一个第一接合部分，并且将所述管芯焊盘的上表面的一部分接合到所述半导体元件的下表面上的与所述管芯的上表面的一部分相对的部分 垫; 以及由热固性树脂形成的至少一个第二接合部分，并且将所述管芯焊盘的上表面的另一部分接合到位于所述半导体元件的下表面上并与所述半导体元件的所述上表面的另一部分相对的另一部分 芯片垫。

公开(公告)号：US06386426B1

公开(公告)日：2002-05-14

申请号：US09655344

申请日：2000-09-05

申请人： Masahiro Tadauchi ,  Kouichi Teshima ,  Izuru Komatsu ,  Mitsuhiro Tomita

发明人： Masahiro Tadauchi ,  Kouichi Teshima ,  Izuru Komatsu ,  Mitsuhiro Tomita

IPC分类号： B23K3102

CPC分类号： H05K3/3463 ,  B23K35/0227 ,  B23K35/0238 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/282 ,  Y10T29/302

摘要： Disclosed is a solder material and a manufacturing method thereof. The solder material has a first layer composed of a first metallic material and a second layer composed of a second metallic material which is different from the first metallic material, the first layer being formed in an elongated shape having axiality, and the second layer covering the first layer to surround the axis of the first layer. The solder material is in a form of a wire, a granule, a sheet, a tape or a planar fragment. The manufacturing method includes: covering a first metallic material with a second metallic material which is different from the first metallic material to prepare a covered body; and rolling the covered body to prepare a solder material comprising a first layer formed of the first metallic material in an elongated shape having axiality and a second layer covering the first layer to surround an axis of the first layer. The solder material may be cut to granulate the solder material, and the second layer can be deformed during or after cutting.

摘要翻译： 公开了一种焊料及其制造方法。 焊料材料具有由第一金属材料构成的第一层和由与第一金属材料不同的第二金属材料构成的第二层，第一层形成为具有轴向的细长形状，第二层覆盖 第一层围绕第一层的轴线。 焊料材料为线材，颗粒，片材，带子或平面片段的形式。 该制造方法包括：用与第一金属材料不同的第二金属材料覆盖第一金属材料以制备覆盖体; 并轧制被覆盖体以制备包括由具有轴向的细长形状的由第一金属材料形成的第一层的焊料材料和覆盖第一层以包围第一层的轴线的第二层。 可以将焊料材料切割以使焊料材料成粒，并且第二层可在切割期间或切割后变形。

公开(公告)号：US06186390B1

公开(公告)日：2001-02-13

申请号：US09220343

申请日：1998-12-24

申请人： Masahiro Tadauchi ,  Kouichi Teshima ,  Izuru Komatsu ,  Mitsuhiro Tomita

发明人： Masahiro Tadauchi ,  Kouichi Teshima ,  Izuru Komatsu ,  Mitsuhiro Tomita

IPC分类号： B23K3514

CPC分类号： H05K3/3463 ,  B23K35/0227 ,  B23K35/0238 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/282 ,  Y10T29/302

摘要： Disclosed is a solder material and a manufacturing method thereof. The solder material has a first layer composed of a first metallic material and a second layer composed of a second metallic material which is different from the first metallic material, the first layer being formed in an elongated shape having axiality, and the second layer covering the first layer to surround the axis of the first layer. The solder material is in a form of a wire, a granule, a sheet, a tape or a planar fragment. The manufacturing method includes: covering a first metallic material with a second metallic material which is different from the first metallic material to prepare a covered body; and rolling the covered body to prepare a solder material comprising a first layer formed of the first metallic material in an elongated shape having axiality and a second layer covering the first layer to surround an axis of the first layer. The solder material may be cut to granulate the solder material, and the second layer can be deformed during or after cutting.

摘要翻译： 公开了一种焊料及其制造方法。 焊料材料具有由第一金属材料构成的第一层和由与第一金属材料不同的第二金属材料构成的第二层，第一层形成为具有轴向的细长形状，第二层覆盖 第一层围绕第一层的轴线。 焊料材料为线材，颗粒，片材，带子或平面片段的形式。 该制造方法包括：用与第一金属材料不同的第二金属材料覆盖第一金属材料以制备覆盖体; 并轧制被覆盖体以制备包括由具有轴向的细长形状的由第一金属材料形成的第一层的焊料材料和覆盖第一层以包围第一层的轴线的第二层。 可以将焊料材料切割以使焊料材料成粒，并且第二层可在切割期间或切割后变形。

公开(公告)号：US6123248A

公开(公告)日：2000-09-26

申请号：US99522

申请日：1998-06-18

申请人： Masahiro Tadauchi ,  Makoto Gonda ,  Yoshiyuki Goto ,  Tomiaki Furuya ,  Kouichi Teshima ,  Izuru Komatsu ,  Takeshi Gotanda

发明人： Masahiro Tadauchi ,  Makoto Gonda ,  Yoshiyuki Goto ,  Tomiaki Furuya ,  Kouichi Teshima ,  Izuru Komatsu ,  Takeshi Gotanda

IPC分类号： B23K1/06 ,  B23K3/04 ,  B23K31/02 ,  B23K35/26 ,  C22C13/00 ,  H05K3/34 ,  B23K20/10 ,  B23K35/38

CPC分类号： B23K1/06 ,  B23K35/262 ,  B23K2201/40

摘要： Disclosed is a method and an apparatus for soldering a base material. A binary solder essentially consisting of tin and a metal which can form an eutectic alloy with tin and which is exclusive of lead is prepared. The content of other metallic components is 0.1% by weight or less and the content of oxygen is 100 ppm or less. The binary solder is melted in a non-oxidizing environment and dispensed to the base material in an atmosphere in which the oxygen content is 2,000 ppm or less, to solder the base material with the binary solder. The soldering apparatus comprises an oscillator for supplying oscillatory wave energy having frequency of 15 KHz to 1 MHz to the base material. The soldering apparatus can also be realized in the form of a soldering nozzle or a soldering iron.

公开(公告)号：US08618723B2

公开(公告)日：2013-12-31

申请号：US13602055

申请日：2012-08-31

申请人： Makoto Sakai ,  Takumi Suwa ,  Shinji Nakata ,  Michinobu Inoue ,  Izuru Komatsu ,  Daigo Suzuki ,  Kumiko Ioka ,  Kazuki Tateyama ,  Yasuhide Okada

发明人： Makoto Sakai ,  Takumi Suwa ,  Shinji Nakata ,  Michinobu Inoue ,  Izuru Komatsu ,  Daigo Suzuki ,  Kumiko Ioka ,  Kazuki Tateyama ,  Yasuhide Okada

IPC分类号： H01J1/02

CPC分类号： F21V29/004 ,  F21K9/135 ,  F21K9/232 ,  F21K9/60 ,  F21V29/503 ,  F21V29/506 ,  F21Y2115/10

摘要： A luminaire according to embodiments includes a body portion, a light source provided at one end portion of the body portion and having a light-emitting element, a globe provided so as to cover the light source, and a thermal transfer portion thermally joined to at least either one of the globe or a thermal radiating surface of the body portion on the end portion side. Then, an end surface of the thermal transfer portion on the side of the globe is exposed from the globe.

摘要翻译： 根据实施例的照明装置包括主体部分，设置在主体部分的一个端部处并具有发光元件的光源，设置成覆盖光源的灯罩，以及热接合到 至少球体中的任一个或主体部分的端部侧的热辐射表面。 然后，在球体侧的热转印部分的端面从球体露出。

公开(公告)号：US20130063942A1

公开(公告)日：2013-03-14

申请号：US13602055

申请日：2012-08-31

申请人： Makoto SAKAI ,  Takumi Suwa ,  Shinji Nakata ,  Michinobu Inoue ,  Izuru Komatsu ,  Daigo Suzuki ,  Kumiko Ioka ,  Kazuki Tateyama ,  Yasuhide Okada

发明人： Makoto SAKAI ,  Takumi Suwa ,  Shinji Nakata ,  Michinobu Inoue ,  Izuru Komatsu ,  Daigo Suzuki ,  Kumiko Ioka ,  Kazuki Tateyama ,  Yasuhide Okada

IPC分类号： F21V7/20 ,  F21V29/00 ,  F21V3/00

CPC分类号： F21V29/004 ,  F21K9/135 ,  F21K9/232 ,  F21K9/60 ,  F21V29/503 ,  F21V29/506 ,  F21Y2115/10

摘要： A luminaire according to embodiments includes a body portion, a light source provided at one end portion of the body portion and having a light-emitting element, a globe provided so as to cover the light source, and a thermal transfer portion thermally joined to at least either one of the globe or a thermal radiating surface of the body portion on the end portion side. Then, an end surface of the thermal transfer portion on the side of the globe is exposed from the globe.

摘要翻译： 根据实施例的照明装置包括主体部分，设置在主体部分的一个端部处并具有发光元件的光源，设置成覆盖光源的灯罩，以及热接合到 至少球体中的任一个或主体部分的端部侧的热辐射表面。 然后，在球体侧的热转印部分的端面从球体露出。