公开(公告)号：US20140090876A1

公开(公告)日：2014-04-03

申请号：US14096504

申请日：2013-12-04

Applicant: PANASONIC CORPORATION

Inventor： Shingo YOSHIOKA ,  Hiroaki FUJIWARA

IPC: H05K1/11

CPC classification number: H05K1/11 ,  G11B5/486 ,  H01L21/565 ,  H01L22/12 ,  H01L23/3121 ,  H01L24/03 ,  H01L24/05 ,  H01L24/24 ,  H01L24/25 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/82 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/24011 ,  H01L2224/2405 ,  H01L2224/24051 ,  H01L2224/24137 ,  H01L2224/24146 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/25175 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73267 ,  H01L2224/82009 ,  H01L2224/82039 ,  H01L2224/82101 ,  H01L2224/82931 ,  H01L2224/82947 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K3/184 ,  H05K2201/0376 ,  H05K2201/09472 ,  Y02P70/611 ,  Y10T428/1171 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A three-dimensional structure in which a wiring and a pad part are provided on a surface is provided. A recessed gutter for wiring and a hole for the pad part having a depth that is greater than a thickness of the recessed gutter for wiring are provided on the surface of the three-dimensional structure. The hole for the pad part is provided in succession with the recessed gutter for wiring. At least a part of a wiring conductor is embedded in the recessed gutter for wiring and in the hole for the pad part.

Abstract translation: 提供了其中在表面上设置布线和焊盘部分的三维结构。 在三维结构的表面上设置用于布线的凹槽和用于焊盘部分的孔，其深度大于用于布线的凹槽的厚度。 用于焊盘部分的孔连续地设置有用于布线的凹槽。 布线导体的至少一部分嵌入到用于布线的凹槽中和用于垫部的孔中。

公开(公告)号：US20150034366A1

公开(公告)日：2015-02-05

申请号：US14481188

申请日：2014-09-09

Applicant: Panasonic Corporation

Inventor： Shingo YOSHIOKA ,  Hiroaki FUJIWARA ,  Hiromitsu TAKASHITA ,  Tsuyoshi TAKEDA

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/119 ,  H01L2224/81385 ,  H05K1/0284 ,  H05K1/0373 ,  H05K1/111 ,  H05K3/0014 ,  H05K3/0032 ,  H05K3/0044 ,  H05K3/0076 ,  H05K3/0079 ,  H05K3/0085 ,  H05K3/107 ,  H05K3/185 ,  H05K3/4007 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/0239 ,  H05K2201/0376 ,  H05K2201/0769 ,  H05K2201/09227 ,  H05K2201/09472 ,  H05K2201/09736 ,  H05K2201/09745 ,  H05K2201/098 ,  H05K2201/09972 ,  H05K2203/0108 ,  H05K2203/013 ,  H05K2203/0143 ,  H05K2203/0228 ,  H05K2203/0264 ,  H05K2203/0285 ,  H05K2203/0565 ,  H05K2203/0706 ,  H05K2203/0776 ,  H05K2203/1163 ,  Y02P70/611

Abstract: One aspect of the present invention relates to a circuit board including an insulating base substrate; and a circuit layer that is formed of a conductor and that is provided on the surface of the insulating base substrate, wherein the insulating base substrate has a smooth surface having a surface roughness Ra of 0.5 μm or less, and the conductor is at least partially embedded in a wiring groove formed in the surface of the insulating base substrate.

Abstract translation: 本发明的一个方面涉及一种包括绝缘基底的电路板; 以及电路层，其由导体形成，并且设置在所述绝缘基底基板的表面上，其中所述绝缘基底具有表面粗糙度Ra为0.5μm以下的平滑表面，并且所述导体至少部分地 嵌入形成在绝缘性基板的表面的布线槽。