公开(公告)号：US20140183751A1

公开(公告)日：2014-07-03

申请号：US14196363

申请日：2014-03-04

Applicant: PANASONIC CORPORATION

Inventor： Shingo YOSHIOKA ,  Hiroaki FUJIWARA ,  Hiromitsu TAKASHITA ,  Tsuyoshi TAKEDA

IPC: H01L23/482

CPC classification number: G11B5/486 ,  H01L21/4846 ,  H01L21/565 ,  H01L22/12 ,  H01L23/145 ,  H01L23/3121 ,  H01L23/49866 ,  H01L24/24 ,  H01L24/25 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/82 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/24011 ,  H01L2224/2405 ,  H01L2224/24051 ,  H01L2224/24137 ,  H01L2224/24146 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/25175 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73267 ,  H01L2224/82009 ,  H01L2224/82039 ,  H01L2224/82101 ,  H01L2224/82385 ,  H01L2224/82399 ,  H01L2224/82931 ,  H01L2224/82947 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15798 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/386 ,  H01L2924/3862 ,  H05K1/111 ,  H05K1/181 ,  H05K3/184 ,  H05K2201/0376 ,  H05K2201/09472 ,  H05K2203/1461 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45015 ,  H01L2924/207

Abstract: One aspect of the present invention is a three-dimensional structure in which a wiring is formed on a surface, the three-dimensional structure having an insulating resin layer that contains a filler formed from at least one element selected from typical non-metal elements and typical metal elements, wherein a recessed gutter for wiring is formed on a surface of the insulating resin layer, and at least a part of a wiring conductor is embedded in the recessed gutter for wiring.

Abstract translation: 本发明的一个方面是一种三维结构，其中在表面上形成布线，所述三维结构具有绝缘树脂层，所述绝缘树脂层含有由选自典型非金属元素中的至少一种元素形成的填料和 典型的金属元件，其中在绝缘树脂层的表面上形成用于布线的凹槽，并且布线导体的至少一部分嵌入到凹槽中用于布线。

公开(公告)号：US20140182887A1

公开(公告)日：2014-07-03

申请号：US14196370

申请日：2014-03-04

Applicant: PANASONIC CORPORATION

Inventor： Shingo YOSHIOKA ,  Hiroaki FUJIWARA ,  Hiromitsu TAKASHITA ,  Tsuyoshi TAKEDA

IPC: H05K1/02

CPC classification number: G11B5/486 ,  H01L21/565 ,  H01L22/12 ,  H01L23/3121 ,  H01L24/24 ,  H01L24/25 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/82 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/24011 ,  H01L2224/2402 ,  H01L2224/2405 ,  H01L2224/24051 ,  H01L2224/241 ,  H01L2224/24137 ,  H01L2224/24146 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/25175 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73267 ,  H01L2224/82009 ,  H01L2224/82039 ,  H01L2224/82101 ,  H01L2224/82105 ,  H01L2224/82931 ,  H01L2224/82947 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/386 ,  H01L2924/3862 ,  H05K1/111 ,  H05K1/181 ,  H05K3/184 ,  H05K2201/0376 ,  H05K2201/09472 ,  H05K2203/1461 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/82102 ,  H01L2224/8284 ,  H01L2224/0401 ,  H01L2224/45015 ,  H01L2924/207

Abstract: One aspect of the present invention is a three-dimensional structure that has a concave-convex form including a gutter for wiring having at least partially a width of 20 μm or less, wherein at least a part of a wiring conductor is embedded in the gutter for wiring, and a wiring that extends in such a manner as to creep along the concave-convex form is provided.

Abstract translation: 本发明的一个方面是具有凹凸形状的三维结构，该凹凸形状包括具有至少部分宽度为20μm或更小的布线的布线槽，其中布线导体的至少一部分嵌入沟槽 并且布线以沿凹凸形状蠕动的方式延伸。

公开(公告)号：US20150156873A1

公开(公告)日：2015-06-04

申请号：US14554334

申请日：2014-11-26

Applicant: Panasonic Corporation

Inventor： Shingo YOSHIOKA ,  Hiroaki FUJIWARA ,  Hiromitsu TAKASHITA ,  Tsuyoshi TAKEDA

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H01L21/4846 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/82385 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K3/107 ,  H05K3/184 ,  H05K3/38 ,  H05K2201/0373 ,  H05K2201/0391 ,  H05K2201/09736 ,  H05K2201/2072 ,  H05K2203/0307 ,  H05K2203/0565 ,  Y02P70/611 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A circuit board includes an electric circuit having a wiring section and a pad section in the surface of an insulating base substrate. The electric circuit is configured such that a conductor is embedded in a circuit recess formed in the surface of the insulating base substrate, and the surface roughness of the conductor is different in the wiring section and the pad section of the electric circuit. In this case, it is preferable that the surface roughness of the conductor in the pad section is greater than the surface roughness of the conductor in the wiring section.

Abstract translation: 电路板包括在绝缘基底的表面上具有布线部分和焊盘部分的电路。 电路被配置为使得导体嵌入形成在基底绝缘体的表面中的电路凹槽中，并且导体的表面粗糙度在电路的布线部分和焊盘部分中是不同的。 在这种情况下，优选的是，焊盘部中的导体的表面粗糙度大于布线部中的导体的表面粗糙度。

公开(公告)号：US20150271924A1

公开(公告)日：2015-09-24

申请号：US14733308

申请日：2015-06-08

Applicant: PANASONIC CORPORATION

Inventor： Shingo YOSHIOKA ,  Hiroaki FUJIWARA ,  Hiromitsu TAKASHITA ,  Tsuyoshi TAKEDA ,  Yuko KONNO

IPC: H05K3/18 ,  C25D7/06 ,  H05K3/10 ,  H05K3/46

CPC classification number: H05K3/184 ,  C23C18/1608 ,  C23C18/1653 ,  C23C18/1893 ,  C25D7/0607 ,  H01L21/4832 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/49541 ,  H01L23/49582 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2221/68377 ,  H01L2224/24051 ,  H01L2224/24137 ,  H01L2224/24145 ,  H01L2224/24146 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/32145 ,  H01L2224/82001 ,  H01L2224/82039 ,  H01L2224/82101 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06568 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K1/185 ,  H05K3/10 ,  H05K3/284 ,  H05K3/4644 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/0264 ,  H05K2203/072 ,  H05K2203/0723 ,  H05K2203/0769 ,  H05K2203/1407 ,  H05K2203/1469 ,  Y02P70/611 ,  H05K3/4661 ,  H01L2924/00

Abstract: A wiring method is provided in which an insulating layer is formed on a surface of a semiconductor device 1 of which a plurality of connecting terminals are exposed, a resin film is formed on a surface of the insulating layer, a groove of a depth equal to or exceeding a thickness of the resin film is formed from a surface side of the resin film so that the groove passes in a vicinity of connecting terminals that are to be connected, and furthermore communicating holes which reach the connecting terminals to be connected from this portion that groove passes in the vicinity thereof are formed.

Abstract translation: 提供一种布线方法，其中绝缘层形成在半导体器件1的暴露多个连接端子的表面上，树脂膜形成在绝缘层的表面上，深度等于 或超过树脂膜的厚度由树脂膜的表面侧形成，使得沟槽在要连接的连接端子附近通过，此外，连通孔将从该部分到达要连接的连接端子 形成沟槽附近的沟槽。

公开(公告)号：US20150035202A1

公开(公告)日：2015-02-05

申请号：US14446660

申请日：2014-07-30

Applicant: PANASONIC CORPORATION

Inventor： Tsuyoshi TAKEDA ,  Hiromitsu TAKASHITA ,  Keiko KASHIHARA ,  Shingo YOSHIOKA

IPC: B29C41/20

CPC classification number: B29C41/20 ,  B29C39/10 ,  B29K2101/00 ,  B32B37/12 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/12042 ,  H01L2924/3511 ,  H01L2924/00

Abstract: The present invention relates to a manufacturing method of a molded article, including: a molded article forming step of forming a molded article by curing a resin composition on a main surface, on the side of a bendable first supporting medium, of a laminated supporting medium obtained by laminating the first supporting medium and a second supporting medium that is harder than the first supporting medium; a second-supporting medium peeling step of peeling the second supporting medium from the first supporting medium after the molded article forming step; and a first-supporting medium peeling step of peeling the first supporting medium from the molded article while bending the first supporting medium after the second-supporting medium peeling step. The shape of the first supporting medium can be maintained at a curing temperature at which the resin composition is cured in the molded article forming step.

Abstract translation: 成型体的制造方法技术领域本发明涉及成型体的制造方法，其特征在于，包括：成型体形成工序，其通过使主表面上的树脂组合物在可弯曲的第一支撑介质侧固化， 通过层压第一支撑介质和比第一支撑介质更硬的第二支撑介质获得; 第二承载介质剥离步骤，在所述模制品形成步骤之后从所述第一支撑介质剥离所述第二支撑介质; 以及在第二支撑介质剥离步骤之后弯曲第一支撑介质的同时从模制品剥离第一支撑介质的第一支撑介质剥离步骤。 第一支撑介质的形状可以保持在模制品形成步骤中树脂组合物固化的固化温度。

公开(公告)号：US20150008379A1

公开(公告)日：2015-01-08

申请号：US14496709

申请日：2014-09-25

Applicant: PANASONIC CORPORATION

Inventor： Yuko KONNO ,  Hiromitsu TAKASHITA ,  Tsuyoshi TAKEDA ,  Hiroaki FUJIWARA ,  Shingo YOSHIOKA

IPC: C08K5/3475 ,  H05K3/00

CPC classification number: C08K5/3475 ,  C08K5/005 ,  C08L33/02 ,  C09D125/08 ,  C09D133/08 ,  H05K1/0353 ,  H05K3/0014 ,  H05K3/0026 ,  H05K3/0032 ,  H05K3/107 ,  H05K3/184 ,  H05K2201/0112 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2203/0264 ,  H05K2203/0565 ,  H05K2203/0571

Abstract: The present invention relates to a resin composition which includes a copolymer consisting of a first monomer containing a monomer unit having at least one carboxyl group and a second monomer copolymerizable with the first monomer, and also includes an ultraviolet absorber. The resin composition used is a resin composition for which, when ∈1 represents an absorbance coefficient per unit weight of a resin film 2 in a solution prepared by dissolving, in a solvent, the resin film 2 formed by application of the resin composition as a liquid, ∈1 at a light wavelength at which the resin film 2 is to be irradiated is at least 0.01 (L/(g·cm)).

Abstract translation: 本发明涉及一种树脂组合物，其包含由含有至少一个羧基的单体单元的第一单体和可与第一单体共聚的第二单体组成的共聚物，并且还包括紫外线吸收剂。 使用的树脂组合物是树脂组合物，当∈1表示通过将溶剂中溶解在树脂组合物形成的树脂膜2中制备的溶液中的树脂膜2的每单位重量的吸光度系数作为 在要照射树脂膜2的光波长处的液体，∈1为至少0.01（L /（g·cm））。

公开(公告)号：US20130265729A1

公开(公告)日：2013-10-10

申请号：US13869553

申请日：2013-04-24

Applicant: PANASONIC CORPORATION

Inventor： Hiromitsu TAKASHITA ,  Tsuyoshi TAKEDA ,  Yuko KONNO ,  Hiroaki FUJIWARA ,  Shingo YOSHIOKA

IPC: H05K1/02

CPC classification number: H05K1/0213 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/66 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/105 ,  H01L2223/6605 ,  H01L2224/02311 ,  H01L2224/0235 ,  H01L2224/0237 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05548 ,  H01L2224/05553 ,  H01L2224/05564 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/131 ,  H01L2224/16104 ,  H01L2224/16105 ,  H01L2224/16112 ,  H01L2224/16113 ,  H01L2224/16147 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32104 ,  H01L2224/32105 ,  H01L2224/32147 ,  H01L2224/32148 ,  H01L2224/32227 ,  H01L2224/32237 ,  H01L2224/32238 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2225/06513 ,  H01L2924/00014 ,  H01L2924/10157 ,  H01L2924/12042 ,  H01L2924/30111 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K1/112 ,  H05K1/114 ,  H05K3/323 ,  H05K3/368 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09045 ,  H05K2201/09227 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/09381 ,  H05K2201/09427 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2924/00

Abstract: The present invention relates to electronic components assembly for electrically connecting electronic components to each other, wherein a wiring formed on a surface of a first electronic component and a wiring formed on a surface of a second electronic component face each other, and are bonded to each other with an electric conductor interposed therebetween, so as to electrically connect the first electronic component and the second electronic component. The electric conductor is a resin composition containing solder or conductive filler.

Abstract translation: 本发明涉及将电子部件彼此电连接的电子部件组件，其中形成在第一电子部件的表面上的布线和形成在第二电子部件的表面上的布线彼此面对，并且被接合到每个 另一个电导体插入其间，以便电连接第一电子部件和第二电子部件。 电导体是含有焊料或导电填料的树脂组合物。

公开(公告)号：US20130200522A1

公开(公告)日：2013-08-08

申请号：US13836706

申请日：2013-03-15

Applicant: PANASONIC CORPORATION

Inventor： Shingo YOSHIOKA ,  Hiroaki FUJIWARA

IPC: H01L23/00

CPC classification number: H05K1/11 ,  G11B5/486 ,  H01L21/565 ,  H01L22/12 ,  H01L23/3121 ,  H01L24/03 ,  H01L24/05 ,  H01L24/24 ,  H01L24/25 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/82 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/24011 ,  H01L2224/2405 ,  H01L2224/24051 ,  H01L2224/24137 ,  H01L2224/24146 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/25175 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73267 ,  H01L2224/82009 ,  H01L2224/82039 ,  H01L2224/82101 ,  H01L2224/82931 ,  H01L2224/82947 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K3/184 ,  H05K2201/0376 ,  H05K2201/09472 ,  Y02P70/611 ,  Y10T428/1171 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of mounting a semiconductor chip includes: forming a resin coating on a surface of a path connecting a bonding pad on a surface of a semiconductor chip and an electrode pad formed on a surface of an insulating base material; forming, by laser beam machining, a wiring gutter having a depth that is equal to or greater than a thickness of the resin coating along the path for connecting the bonding pad and the electrode pad; depositing a plating catalyst on a surface of the wiring gutter; removing the resin coating; and forming an electroless plating coating only at a site where the plating catalyst remains.

Abstract translation: 安装半导体芯片的方法包括：在连接半导体芯片的表面上的接合焊盘和形成在绝缘基材的表面上的电极焊盘的路径的表面上形成树脂涂层; 通过激光束加工形成具有等于或大于沿着用于连接焊盘和电极焊盘的路径的树脂涂层的厚度的深度的布线槽; 在布线槽的表面上沉积电镀催化剂; 去除树脂涂层; 并且仅在电镀催化剂保留的部位形成化学镀层。

公开(公告)号：US20150037589A1

公开(公告)日：2015-02-05

申请号：US14446650

申请日：2014-07-30

Applicant: PANASONIC CORPORATION

Inventor： Hiroharu INOUE ,  Shingo YOSHIOKA

IPC: H05K1/05 ,  C08L79/08 ,  C08L63/00 ,  B32B37/16 ,  B32B37/26

CPC classification number: H05K1/0373 ,  B32B2311/00 ,  B32B2457/08 ,  C08G59/245 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/00 ,  C08J2379/08 ,  C08J2433/00 ,  C08L63/00 ,  C08L79/08 ,  C08L2203/20 ,  C08L2205/03 ,  C09D163/00 ,  C09D179/08 ,  H05K1/0346 ,  H05K1/0353 ,  H05K1/0366 ,  H05K2201/0162 ,  H05K2201/09136 ,  Y10T156/10 ,  Y10T428/31529 ,  C08L33/08

Abstract: The present invention relates to a resin composition that becomes a cured product that exhibits force response behavior such that an area surrounded by a tensile stress-strain curve f1(x), when an amount of strain is increased from 0% to 0.3% by pulling at 999 μm/min while plotting the amount of strain on the x axis and tensile stress on the y axis, and also surrounded by the x axis, is greater than an area surrounded by a stress-strain curve f2(x), when the amount of strain is decreased from 0.3%, and also surrounded by the x axis, and the amount of change in the amount of strain when tensile stress is 0, before and after applying tensile stress, is 0.05% or less.

Abstract translation: 本发明涉及一种树脂组合物，其是当通过拉伸将应变量从0％增加到0.3％时，其表现出力响应性能使得由拉伸应力 - 应变曲线f1（x）包围的面积的固化产物 在999μm/分钟的同时，在X轴上绘制应变量和y轴上的拉伸应力，并且也被x轴包围，大于由应力 - 应变曲线f2（x）包围的面积，当 应变量从0.3％下降，并且由x轴包围，拉伸应力为0时的拉伸应力前后的应变量的变化量为0.05％以下。

公开(公告)号：US20140097004A1

公开(公告)日：2014-04-10

申请号：US14096514

申请日：2013-12-04

Applicant: PANASONIC CORPORATION

Inventor： Shingo YOSHIOKA ,  Hiroaki FUJIWARA

IPC: H05K1/11

CPC classification number: H05K1/11 ,  G11B5/486 ,  H01L21/565 ,  H01L22/12 ,  H01L23/3121 ,  H01L24/03 ,  H01L24/05 ,  H01L24/24 ,  H01L24/25 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/82 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/24011 ,  H01L2224/2405 ,  H01L2224/24051 ,  H01L2224/24137 ,  H01L2224/24146 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/25175 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73267 ,  H01L2224/82009 ,  H01L2224/82039 ,  H01L2224/82101 ,  H01L2224/82931 ,  H01L2224/82947 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K3/184 ,  H05K2201/0376 ,  H05K2201/09472 ,  Y02P70/611 ,  Y10T428/1171 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A three-dimensional structure in which a wiring is provided on a surface is provided. At least a part of the surface of the three-dimensional structure includes an insulating layer containing filler. A recessed gutter for wiring is provided on the surface of the three-dimensional structure, and at least a part of a wiring conductor is embedded in the recessed gutter for wiring.

Abstract translation: 提供其中在表面上设置布线的三维结构。 三维结构的表面的至少一部分包括含有填料的绝缘层。 在三维结构的表面上设置用于布线的凹槽，并且布线导体的至少一部分嵌入到凹槽中用于布线。