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公开(公告)号：US20190148040A1
公开(公告)日：2019-05-16
申请号：US16231937
申请日：2018-12-24
Applicant: ROHM CO., LTD.
Inventor： Hiroshi TAMAGAWA , Hiroki YAMAMOTO , Katsuya MATSUURA , Yasuhiro KONDO
IPC: H01C1/14 , H01G5/38 , H01G2/16 , H01F27/40 , H01F27/28 , H01C10/50 , H01C10/16 , H01G5/011 , H01L27/08 , H01C17/00 , H01C17/23 , H05K3/34 , H01L33/62 , H01G4/38 , H01G4/40 , H01L25/10 , H01L25/13 , H01L27/15 , H01G4/33 , H01G5/40 , H05K1/18 , H01F29/08 , H01F41/04 , H01L23/00 , H01F29/00
Abstract: A method for manufacturing a chip component includes forming an element, which includes a plurality of element parts, on a substrate. A plurality of fuses are formed, for disconnectably connecting each of the plurality of element parts to an external connection electrode. The external connection electrode, which is arranged to provide external connection for the element, is formed by electroless plating on the substrate.
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公开(公告)号：US20180323011A1
公开(公告)日：2018-11-08
申请号：US16031212
申请日：2018-07-10
Applicant: ROHM CO., LTD.
Inventor： Hiroki YAMAMOTO , Keishi WATANABE , Hiroshi TAMAGAWA
IPC: H01G4/30 , H01L29/66 , H01G2/06 , H01G4/005 , H01G4/228 , H01G4/40 , H01L21/66 , H01L23/522 , H01L23/00 , H01L27/06 , H01L27/10 , H01L27/24 , H05K1/18 , H05K1/16 , H05K1/11 , H01L29/94 , H01L49/02 , H05K3/34 , H01G4/232
Abstract: A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.
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公开(公告)号：US20170250029A1
公开(公告)日：2017-08-31
申请号：US15597105
申请日：2017-05-16
Applicant: ROHM CO., LTD.
Inventor： Hiroki YAMAMOTO , Keishi WATANABE , Hiroshi TAMAGAWA
CPC classification number: H01G4/30 , H01G2/06 , H01G4/005 , H01G4/228 , H01G4/232 , H01G4/40 , H01L22/14 , H01L22/20 , H01L23/5223 , H01L24/48 , H01L24/49 , H01L27/0629 , H01L27/0676 , H01L27/101 , H01L27/2409 , H01L28/40 , H01L29/66189 , H01L29/94 , H01L2224/05644 , H01L2224/05655 , H01L2224/05664 , H01L2224/48227 , H01L2224/49175 , H01L2924/00014 , H01L2924/0002 , H05K1/111 , H05K1/162 , H05K1/18 , H05K1/181 , H05K3/3436 , H05K2201/10015 , H05K2201/10045 , Y02P70/611 , H01L2924/00 , H01L2224/05599 , H01L2224/45099 , H01L2224/85399
Abstract: A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.
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Patent Agency Ranking
公开(公告)号：US20170125143A1
公开(公告)日：2017-05-04
申请号：US15352263
申请日：2016-11-15
Applicant: ROHM CO., LTD.
Inventor： Eiji NUKAGA , Hiroshi TAMAGAWA , Yasuhiro KONDO , Katsuya MATSUURA
IPC: H01C17/00 , H01C7/00 , H01G4/38 , H01G4/40 , H01C13/02 , H01L29/66 , H01L29/861 , H01L23/525 , H01L23/528 , H01L21/78 , H01L21/3065 , H01C17/08 , H01F27/40
CPC classification number: H01C17/006 , H01C7/00 , H01C7/006 , H01C13/02 , H01C17/06 , H01C17/08 , H01C17/242 , H01F27/402 , H01G2/065 , H01G4/38 , H01G4/40 , H01L21/3065 , H01L21/78 , H01L23/5256 , H01L23/528 , H01L29/6609 , H01L29/861 , Y10T29/49082
Abstract: A chip resistor includes: a board having a device formation surface, a back surface opposite from the device formation surface and side surfaces connecting the device formation surface to the back surface, a resistor portion provided on the device formation surface, a first connection electrode and a second connection electrode provided on the device formation surface and electrically connected to the resistor portion, and a resin film covering the device formation surface with the first connection electrode and the second connection electrode being exposed therefrom. Intersection portions of the board along which the back surface intersects the side surfaces each have a rounded shape.
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公开(公告)号：US20170076842A1
公开(公告)日：2017-03-16
申请号：US15271882
申请日：2016-09-21
Applicant: ROHM CO., LTD.
Inventor： Yasuhiro KONDO , Hiroshi TAMAGAWA , Hiroki YAMAMOTO
IPC: H01C13/02 , H01C1/14 , H01G5/019 , H01L23/525 , H01F29/00 , H01G5/38 , H01L49/02 , H01C10/50 , H01C17/00
CPC classification number: H01C13/02 , H01C1/14 , H01C10/50 , H01C17/006 , H01C17/06 , H01F27/402 , H01F29/00 , H01G2/16 , H01G4/40 , H01G5/019 , H01G5/38 , H01L23/5256 , H01L27/0207 , H01L27/0814 , H01L28/20 , H01L2224/16225 , Y10T29/49099
Abstract: A chip resistor includes a substrate, and a plurality of resistor elements each having a resistive film provided on the substrate and an interconnection film provided on the resistive film in contact with the resistive film. An electrode is provided on the substrate. Fuses disconnectably connect the resistor elements to the electrode. The resistive film is made of at least one material selected from the group of NiCr, NiCrAl, NiCrSi, NiCrSiAl, TaN, TaSiO2, TiN, TiNO and TiSiON.
Abstract translation: 芯片电阻器包括基板和多个电阻元件，每个电阻元件具有设置在基板上的电阻膜和设置在与电阻膜接触的电阻膜上的互连膜。 在基板上设置电极。 保险丝将电阻元件与电极断开连接。 电阻膜由选自NiCr，NiCrAl，NiCrSi，NiCrSiAl，TaN，TaSiO 2，TiN，TiNO和TiSiON中的至少一种材料制成。
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公开(公告)号：US20160211077A1
公开(公告)日：2016-07-21
申请号：US15051648
申请日：2016-02-23
Applicant: ROHM CO., LTD.
Inventor： Hiroki YAMAMOTO , Keishi WATANABE , Hiroshi TAMAGAWA
CPC classification number: H01G4/30 , H01G2/06 , H01G4/005 , H01G4/228 , H01G4/232 , H01G4/40 , H01L22/14 , H01L22/20 , H01L23/5223 , H01L24/48 , H01L24/49 , H01L27/0629 , H01L27/0676 , H01L27/101 , H01L27/2409 , H01L28/40 , H01L29/66189 , H01L29/94 , H01L2224/05644 , H01L2224/05655 , H01L2224/05664 , H01L2224/48227 , H01L2224/49175 , H01L2924/00014 , H01L2924/0002 , H05K1/111 , H05K1/162 , H05K1/18 , H05K1/181 , H05K3/3436 , H05K2201/10015 , H05K2201/10045 , Y02P70/611 , H01L2924/00 , H01L2224/05599 , H01L2224/45099 , H01L2224/85399
Abstract: A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.
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17.发明申请公开(公告)号：US20160087027A1
公开(公告)日：2016-03-24
申请号：US14956939
申请日：2015-12-02
Applicant: ROHM CO., LTD.
Inventor： Hiroshi TAMAGAWA , Yasuhiro KONDO , Yasuhiro FUWA , Hiroyuki OKADA , Eiji NUKAGA , Katsuya MATSUURA
IPC: H01L49/02 , H01L21/3065
CPC classification number: H01L28/20 , H01C1/14 , H01C13/02 , H01C17/006 , H01C17/242 , H01L21/3065 , H01L21/3083 , H01L27/0676 , H01L27/0802 , H05K3/3431 , H05K2201/10674
Abstract: A compact and refined chip resistor, with which a plurality of types of required resistance values can be accommodated readily with the same design structure, was desired. The chip resistor is arranged to have a resistor network on a substrate. The resistor network includes a plurality of resistor bodies arrayed in a matrix and having an equal resistance value. A plurality of types of resistance units are respectively arranged by one or a plurality of the resistor bodies being connected electrically. The plurality of types of resistance units are connected in a predetermined mode using connection conductor films and fuse films. By selectively fusing a fuse film, a resistance unit can be electrically incorporated into the resistor network or electrically separated from the resistor network to make the resistance value of the resistor network the required resistance value.
Abstract translation: 希望能够以相同的设计结构容易地容纳多种类型的所需电阻值的紧凑且精细的芯片电阻器。 芯片电阻被布置成在基板上具有电阻网络。 电阻网络包括排列成矩阵并具有相等电阻值的多个电阻体。 多个电阻单元分别由电气连接的一个或多个电阻体排列。 多种类型的电阻单元使用连接导体膜和熔丝膜以预定模式连接。 通过选择性地熔断保险膜，可以将电阻单元电连接到电阻网络中或与电阻网络电隔离，使电阻网络的电阻值成为所需的电阻值。
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公开(公告)号：US20160050760A1
公开(公告)日：2016-02-18
申请号：US14781964
申请日：2014-03-27
Applicant: ROHM CO., LTD.
Inventor： Hiroshi TAMAGAWA , Koichi NIINO , Eiji NUKAGA , Keishi WATANABE
CPC classification number: H05K1/181 , H01C1/012 , H01C1/14 , H01G2/065 , H01G4/228 , H01G4/40 , H05K1/11 , H05K3/3442 , H05K5/02 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003
Abstract: The composite chip component includes: plurality of chip elements which are disposed so as to be mutually spaced apart upon a common substrate, and which have mutually different functions; and a pair of electrodes which, in each of the chip elements, are formed on the surface of the substrate. As a result, it is possible to reduce the bond area (footprint) for the mounting substrate, and therefore, it is possible to provide a composite chip component capable of achieving efficiency of mounting operation.
Abstract translation: 复合芯片部件包括：多个芯片元件，其设置成在公共基板上相互间隔开，并且具有相互不同的功能; 以及在每个芯片元件中形成在基板的表面上的一对电极。 结果，可以减少安装基板的接合面积（占地面积），因此，可以提供能够实现安装操作效率的复合芯片部件。
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