-
公开(公告)号：US20100224398A1
公开(公告)日：2010-09-09
申请号：US12738430
申请日：2008-10-16
IPC分类号： H05K1/18
CPC分类号： H01L21/563 , H01L23/13 , H01L23/3121 , H01L24/16 , H01L25/0655 , H01L2224/16 , H01L2224/73203 , H01L2224/83102 , H01L2224/83855 , H01L2224/92125 , H01L2924/01004 , H01L2924/01019 , H01L2924/15311 , H01L2924/15313 , H05K1/0224 , H05K3/28 , H05K3/3452 , H05K2201/0969 , H05K2201/0989 , H05K2201/10977
摘要： In order to easily inject underfill resin and perform molding with reliability, groove sections are formed on a surface of a circuit board such that the ends of the groove sections extend to semiconductor elements. Low-viscosity underfill resin applied dropwise is guided by the groove sections and flows between the circuit board and the semiconductor elements. The underfill resin hardly expands to regions outside the semiconductor elements.
摘要翻译： 为了容易地注入底部填充树脂并且可靠地进行模制，在电路板的表面上形成槽部，使得槽部的端部延伸到半导体元件。 滴下的低粘度底部填充树脂由槽部引导，在电路基板与半导体元件之间流动。 底部填充树脂几乎不扩展到半导体元件外部的区域。
-
公开(公告)号：US08450859B2
公开(公告)日：2013-05-28
申请号：US13000391
申请日：2009-10-27
CPC分类号： H01L23/49894 , H01L21/563 , H01L23/49816 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/10126 , H01L2224/13099 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13566 , H01L2224/16058 , H01L2224/16225 , H01L2224/73203 , H01L2224/812 , H01L2224/81801 , H01L2224/83192 , H01L2224/83194 , H01L2224/83855 , H01L2224/83856 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/3436 , H05K3/3452 , H05K3/3463 , H05K3/3484 , H05K2201/10977 , H05K2201/10992 , Y02P70/613 , H01L2924/01083 , H01L2924/00014 , H01L2924/0105
摘要： A semiconductor device mounted structure includes a semiconductor device having a plurality of first electrodes, a circuit board having a plurality of second electrodes, a plurality of bumps respectively formed on the plurality of first electrodes, a plurality of bonding members respectively positioned between the bumps and the second electrodes to electrically connect the first electrodes to the second electrodes via the bumps, and a plurality of reinforcing resin members respectively positioned around the bonding members so as to cover at least the bonding members and bonding regions between the bonding members and the bumps. Adjacent reinforcing resin members are spaced away from each other so as not to have contact with each other without being in contact with the semiconductor device. This semiconductor device mounted structure enhances the reliability of joints in impact resistance and makes it easy to repair it.
摘要翻译： 半导体器件安装结构包括具有多个第一电极的半导体器件，具有多个第二电极的电路板，分别形成在多个第一电极上的多个凸块，分别位于凸块之间的多个接合部件和 所述第二电极经由所述凸块将所述第一电极与所述第二电极电连接，以及分别位于所述接合部件周围的多个增强树脂部件，以至少覆盖所述接合部件和所述凸块之间的接合部件和接合部。 相邻的增强树脂构件彼此间隔开，以便不与半导体器件接触而彼此不接触。 该半导体器件安装结构提高了接头在耐冲击性方面的可靠性，并且使其易于修复。
-
公开(公告)号：US08293370B2
公开(公告)日：2012-10-23
申请号：US12376370
申请日：2007-08-03
CPC分类号： H05K3/321 , B23K35/025 , B23K35/26 , B23K35/262 , B23K35/264 , B23K35/3613 , B23K35/3618 , B23K35/362 , H01B1/22 , H05K3/3484 , Y10T403/479 , Y10T428/31678
摘要： Disclosed is a solder material which enables to realize a lower mounting temperature when an electronic component is mounted. Also disclosed are a solder paste and a conductive adhesive. Specifically disclosed is a solder material having a basic composition composed of Sn, Bi and In. This solder material may further contain at least one metal selected from the group consisting of Cu, Ge and Ni. A solder paste which enables to realize a low-temperature mounting can be obtained by blending a flux component into the solder material. A conductive adhesive which enables to realize a low-temperature mounting can be obtained by blending a resin component into the solder material.
摘要翻译： 公开了一种焊接材料，其能够在安装电子部件时实现较低的安装温度。 还公开了焊膏和导电粘合剂。 具体公开了具有由Sn，Bi和In构成的基本组成的焊料。 该焊料材料还可含有选自Cu，Ge和Ni中的至少一种金属。 可以通过将助焊剂成分混合到焊料材料中来获得能够实现低温安装的焊膏。 可以通过将树脂成分混合到焊料材料中来获得能够实现低温安装的导电粘合剂。
-
公开(公告)号：US08182923B2
公开(公告)日：2012-05-22
申请号：US12427275
申请日：2009-04-21
CPC分类号： H01B1/22 , B23K35/025 , B23K35/262 , B23K2101/36 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2924/00014 , H05K3/3484 , H05K2201/0272 , Y10T428/31681 , H01L2224/05599
摘要： A conductive paste includes a filler component and a flux component; the filler component including a first conductive filler and a second conductive filler having different melting points, and the melting point of the first conductive filler being higher than the melting point of the second conductive filler by 20° C. or more; the flux component including a first flux and a second flux having different melting points, the melting point of the first flux being higher than the melting point of the second flux, and the melting point of the first flux being higher than the melting point of the second conductive filler by 15° C. to 45° C.; and the melting point of the second flux being equal to or less than the melting point of the second conductive filler.
摘要翻译： 导电浆料包括填料组分和助熔剂组分; 所述填充剂组分包括具有不同熔点的第一导电填料和第二导电填料，并且所述第一导电填料的熔点高于所述第二导电填料的熔点20℃或更高; 所述通量成分包括具有不同熔点的第一助熔剂和第二助熔剂，所述第一焊剂的熔点高于所述第二焊剂的熔点，所述第一焊剂的熔点高于所述熔点 第二导电填料15℃至45℃。 并且第二通量的熔点等于或小于第二导电填料的熔点。
-
15.发明授权Electroconductive bonding material and electric/electronic device using the same 失效导电接合材料和使用其的电气/电子设备公开(公告)号：US08012379B2
公开(公告)日：2011-09-06
申请号：US12870275
申请日：2010-08-27
CPC分类号： H05K1/095 , C08G59/66 , C08G59/687 , C08K5/37 , C09J163/00 , H01B1/22 , H05K3/321 , H05K3/4069 , H05K2201/0224 , H05K2203/122
摘要： A conductive bonding material having an improved preservation stability, and hardens when desired, preferably immediately hardens at a low temperature is provided. In one invention, the conductive bonding material comprises a conductive particle ingredient, an epoxy resin ingredient, and a hardening agent ingredient for said epoxy resin and the hardening agent ingredient for said epoxy resin further comprise a reforming agent having a thiol group. In another invention, a conductive bonding material comprising an epoxy resin hardening ingredient, wherein said epoxy resin hardening ingredient contains a sulfur-containing compound having an end group which can coordinate with a surface of the metallic particles, and the sulfur-containing compound comes to perform as a hardening agent for the epoxy resin by dissociating from the surface of the metallic particles. The conductive bonding material may contain fragrance.
摘要翻译： 提供具有改善的保存稳定性并且当需要时硬化的导电粘合材料优选在低温下立即硬化。 在一个发明中，导电接合材料包括导电颗粒成分，环氧树脂成分和用于所述环氧树脂的硬化剂成分和用于所述环氧树脂的硬化剂成分，还包含具有硫醇基的重整剂。 在另一发明中，包含环氧树脂硬化成分的导电性接合材料，其中所述环氧树脂硬化成分含有具有可与金属粒子表面配位的端基的含硫化合物，含硫化合物进入 通过从金属颗粒的表面离解，作为环氧树脂的硬化剂。 导电接合材料可能含有香料。
-
公开(公告)号：US20100006329A1
公开(公告)日：2010-01-14
申请号：US12517460
申请日：2007-12-03
CPC分类号： H01L21/563 , C08G59/4021 , C08L63/00 , C09K3/10 , C09K2200/0645 , C09K2200/0647 , C09K2200/065 , H01L23/293 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/01004 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , Y02P20/582 , Y10T29/4913 , Y10T29/49146 , Y10T29/49726 , H01L2924/00
摘要： A sealing material is provided, upon mounting semiconductor devices and/or electronic components which are relatively weak on a circuit board, which shows sealing characteristics that enables itself to seal the semiconductor devices and/or electronic components and connections therebetween with low stress and high reliability; and suitable repairability that enables merely semiconductor devices and/or electronic components which were determined to be off-specification after being sealed to be repaired with ease. The sealing material contains at least (a) a heat-curable resin component and (b) a hardener component therefor, and is characterized in that, once the sealing material is cured by being heated, the cured material has a glass transition temperature (Tg) in a temperature range of from −80° C. to 50° C.
摘要翻译： 提供了一种密封材料，在安装在电路板上相对较弱的半导体器件和/或电子元件时，其表现出密封特性，其能够以低应力和高可靠性使其本身密封半导体器件和/或电子元件及其间的连接 ; 以及适合的可修复性，其仅使得能够容易地修复被确定为脱离规格的半导体器件和/或电子部件被密封以进行修复。 密封材料至少含有（a）可热固化树脂组分和（b）其固化剂组分，其特征在于，一旦密封材料通过加热固化，固化材料的玻璃化转变温度（Tg ）在-80℃至50℃的温度范围内
-
公开(公告)号：US20090116205A1
公开(公告)日：2009-05-07
申请号：US12260219
申请日：2008-10-29
IPC分类号： H05K7/00
CPC分类号： H05K3/3484 , B23K35/264 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H05K3/284 , H05K3/321 , H05K3/3463 , H01L2924/3512 , H01L2924/00
摘要： A plurality of semiconductor elements is adjacently mounted on a substrate by a solder with a melting point of 200° C. or lower, an electronic part other than the semiconductor elements is mounted on the substrate between the adjacently mounted semiconductor elements by a solder with a melting point of 200° C. or lower, and spaces between the plurality of semiconductor elements and the substrate, spaces between the electronic part and the substrate, and spaces between the plurality of semiconductor elements and the electronic part are integrally molded with a molding resin.
摘要翻译： 多个半导体元件通过熔点为200℃以下的焊料相邻地安装在基板上，除了半导体元件之外的电子部件通过焊料与相邻安装的半导体元件之间的基板安装在基板上 熔点为200℃以下，多个半导体元件与基板之间的空间，电子部件与基板之间的空间以及多个半导体元件与电子部件之间的空间与成形树脂一体成型 。
-
18.发明申请公开(公告)号：US20090070994A1
公开(公告)日：2009-03-19
申请号：US12094219
申请日：2006-11-13
IPC分类号： H05K3/30
CPC分类号： H05K3/323 , H05K3/321 , Y10T29/49114 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49165
摘要： A method for manufacturing a circuit board on which an electronic component is mounted, includes at least the steps of (a) supplying a liquid photo-polymerizable adhesive containing conductive particles dispersed therein to a surface of a printed board, to form an adhesive layer on the board surface; (b) irradiating the photo-polymerizable adhesive with ultraviolet light to turn into a gel, to provide adhesiveness to the adhesive layer; and (c) pressing the electronic component against the component mounting portion of the printed board from an upper surface side of the adhesive layer, to form an electrical connection between the electronic component and the component mounting portion, and in the method, the photo-polymerizable adhesive is a delayed reactive adhesive.
摘要翻译： 一种制造其上安装有电子部件的电路板的方法至少包括以下步骤：（a）将包含分散在其中的导电粒子的液体光聚合性粘合剂供应到印刷电路板的表面上，以形成粘合剂层 板表面; （b）用紫外线照射光聚合性粘合剂变成凝胶，以提供粘合剂层的粘附性; 以及（c）从粘合剂层的上表面侧将电子部件压靠在印刷基板的部件安装部上，形成电子部件与部件安装部之间的电连接，在该方法中， 可聚合粘合剂是延迟的反应性粘合剂。
-
公开(公告)号：US08378472B2
公开(公告)日：2013-02-19
申请号：US12738430
申请日：2008-10-16
IPC分类号： H01L23/22
CPC分类号： H01L21/563 , H01L23/13 , H01L23/3121 , H01L24/16 , H01L25/0655 , H01L2224/16 , H01L2224/73203 , H01L2224/83102 , H01L2224/83855 , H01L2224/92125 , H01L2924/01004 , H01L2924/01019 , H01L2924/15311 , H01L2924/15313 , H05K1/0224 , H05K3/28 , H05K3/3452 , H05K2201/0969 , H05K2201/0989 , H05K2201/10977
摘要： In order to easily inject underfill resin and perform molding with reliability, groove sections are formed on a surface of a circuit board such that the ends of the groove sections extend to semiconductor elements. Low-viscosity underfill resin applied dropwise is guided by the groove sections and flows between the circuit board and the semiconductor elements. The underfill resin hardly expands to regions outside the semiconductor elements.
摘要翻译： 为了容易地注入底部填充树脂并且可靠地进行模制，在电路板的表面上形成槽部，使得槽部的端部延伸到半导体元件。 滴下的低粘度底部填充树脂由槽部引导，在电路基板与半导体元件之间流动。 底部填充树脂几乎不扩展到半导体元件外部的区域。
-
20.发明申请公开(公告)号：US20110110050A1
公开(公告)日：2011-05-12
申请号：US12675080
申请日：2008-10-21
CPC分类号： H05K3/305 , H01L21/563 , H01L23/295 , H01L25/0657 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2225/06517 , H01L2225/0652 , H01L2225/06572 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/12044 , H01L2924/15151 , H01L2924/18301 , H05K2201/09036 , H05K2201/09072 , H05K2201/10545 , H05K2201/10674 , H05K2201/10734 , H05K2201/10977 , Y02P70/613 , Y10T29/49139 , H01L2924/00
摘要： A structure with electronic component mounted therein includes a wiring board on which an electronic component is mounted at least on its first face, resin provided at least between the electronic component and the wiring board, and a plurality of holes formed in the wiring board at region corresponding to a mounting position of the electronic component. The holes are filled with the resin. This suppresses warpage of the structure with electronic component mounted therein, and also improves reliability by reducing a stress applied to a bonding section between the wiring board and the electronic component.
摘要翻译： 安装有电子部件的结构包括：至少在其第一面上安装有电子部件的布线基板，至少设置在电子部件和布线基板之间的树脂，以及在布线基板上形成的多个孔 对应于电子部件的安装位置。 孔用树脂填充。 这抑制了安装有电子部件的结构的翘曲，并且还通过减小施加到布线板和电子部件之间的接合部的应力来提高可靠性。
-
-
-
-
-
-
-
-
-
搜索结果
299 条记录 (耗时 0.033 秒)
