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11.
公开(公告)号:US20220254798A1
公开(公告)日:2022-08-11
申请号:US17351720
申请日:2021-06-18
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Ramy Nashed Bassely SAID , Yanli ZHANG , Jiahui YUAN , Raghuveer S. MAKALA , Senaka KANAKAMEDALA
IPC: H01L27/11556 , H01L29/49
Abstract: A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers, memory opening fill structures extending through the alternating stack, where each of the memory opening fill structures includes a vertical semiconductor channel, a tunneling dielectric layer, and a vertical stack of memory elements located at levels of the electrically conductive layers between a respective vertically neighboring pair of the insulating layers. Each of the memory elements is located at a level of a respective one of the electrically conductive layers between the respective vertically neighboring pair of the insulating layers. Each of the memory elements includes a first memory material portion, and a second memory material portion that is vertically spaced from the first memory material portion. The second memory material portion has a different material composition from the first memory material portion.
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12.
公开(公告)号:US20210183883A1
公开(公告)日:2021-06-17
申请号:US16710572
申请日:2019-12-11
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Yanli ZHANG , Dong-il MOON , Raghuveer S. MAKALA , Peng ZHANG , Wei ZHAO , Ashish BARASKAR
IPC: H01L27/11582 , H01L27/11556 , H01L23/528 , H01L23/532 , H01L23/522 , H01L21/768 , H01L21/28 , H01L27/11526 , H01L27/11519 , H01L27/11565 , H01L27/11573
Abstract: A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers located over a substrate, memory openings vertically extending through the alternating stack, and memory stack structures extending through the alternating stack. Each of the memory stack structures contains a memory film and a vertical semiconductor channel. At least one of the electrically conductive layers contains a first conductive material portion having a respective inner sidewall that contacts a respective one of the memory films at a vertical interface, and a second conductive material portion that has a different composition from the first conductive material portion, and contacting the first electrically conductive material portion. The first conductive material portion has a lower work function than the second conductive material portion.
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13.
公开(公告)号:US20200243498A1
公开(公告)日:2020-07-30
申请号:US16261869
申请日:2019-01-30
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Yanli ZHANG , Kwang-Ho KIM , Johann ALSMEIER
IPC: H01L25/18 , H01L25/065 , H01L25/00 , H01L23/00 , H01L23/48 , H01L27/11524 , H01L27/11556 , H01L27/11529 , H01L27/1157 , H01L27/11582 , H01L27/11573 , G11C16/04
Abstract: A memory device includes a memory die containing memory elements, a support die containing peripheral devices and bonded to the memory die, and an electrically conductive path between two of the peripheral devices which extends at least partially through the memory die. The electrically conductive path is electrically isolated from the memory elements.
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14.
公开(公告)号:US20200006358A1
公开(公告)日:2020-01-02
申请号:US16019856
申请日:2018-06-27
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Masatoshi NISHIKAWA , Shinsuke YADA , Yanli ZHANG
IPC: H01L27/1157 , H01L27/11582 , H01L29/10 , H01L29/06 , H01L21/28 , H01L21/762 , H01L21/768 , H01L21/3213 , H01L21/311
Abstract: A three-dimensional memory device includes an alternating stack of insulating layers and word-line-level electrically conductive layers located over a substrate, and a drain-select-level electrically conductive layer located over the alternating stack. Memory stack structures extend through the alternating stack and the drain-select-level electrically conductive layer. Dielectric divider structures including a respective pair of straight sidewalls and drain-select-level isolation structures including a respective pair of sidewalls that include a respective set of concave vertical sidewall segments divide the drain-select-level electrically conductive layer into multiple strips. The drain-select-level electrically conductive layer and the drain-select-level isolation structures are formed by replacement of a drain-select-level sacrificial material layer with a conductive material and by replacement of drain-select-level sacrificial line structures with dielectric material portions.
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15.
公开(公告)号:US20180197876A1
公开(公告)日:2018-07-12
申请号:US15401426
申请日:2017-01-09
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Chun GE , Yanli ZHANG , Johann ALSMEIER , Fabo YU , Jixin YU
IPC: H01L27/11582 , H01L27/1157 , H01L27/11573 , H01L27/11524 , H01L27/11556 , H01L27/11529 , H01L23/522 , H01L23/528
CPC classification number: H01L27/11582 , H01L23/5226 , H01L23/5283 , H01L27/11524 , H01L27/11529 , H01L27/11556 , H01L27/11565 , H01L27/1157 , H01L27/11573 , H01L27/11575
Abstract: After formation of an alternating stack of insulating layers and sacrificial material layers, a memory opening can be formed through the alternating stack, which is subsequently filled with a columnar semiconductor pedestal portion and a memory stack structure. Breakage of the columnar semiconductor pedestal portion under mechanical stress can be avoided by growing a laterally protruding semiconductor portion by selective deposition of a semiconductor material after removal of the sacrificial material layers to form backside recesses. At least an outer portion of the laterally protruding semiconductor portion can be oxidized to form a tubular semiconductor oxide spacer. Electrically conductive layers can be formed in the backside recesses to provide word lines for a three-dimensional memory device.
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16.
公开(公告)号:US20180138194A1
公开(公告)日:2018-05-17
申请号:US15496359
申请日:2017-04-25
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Keisuke SHIGEMURA , Junichi ARIYOSHI , Masanori TSUTSUMI , Michiaki SANO , Yanli ZHANG , Raghuveer S. MAKALA
IPC: H01L27/11582 , H01L27/11556 , H01L29/423 , H01L23/528 , H01L23/532 , H01L21/28 , H01L27/11524 , H01L21/768 , H01L21/311 , H01L27/1157 , H01L27/11526 , H01L27/11573 , H01L27/11519 , H01L27/11565
CPC classification number: H01L27/11582 , H01L21/28008 , H01L21/31111 , H01L21/76843 , H01L21/76877 , H01L23/528 , H01L23/53266 , H01L27/11519 , H01L27/11524 , H01L27/11526 , H01L27/11556 , H01L27/11565 , H01L27/1157 , H01L27/11573 , H01L29/42324 , H01L29/4234
Abstract: A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers located over a substrate, the alternating stack having a memory array region and a contact region containing stepped surfaces, and memory stack structures having a semiconductor channel and a memory film extending through the memory array region of the alternating stack. The electrically conductive layers include a drain select gate electrode and word lines, where the drain select gate electrode is thicker than each of the word lines.
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17.
公开(公告)号:US20170352678A1
公开(公告)日:2017-12-07
申请号:US15175450
申请日:2016-06-07
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Zhenyu LU , Jixin YU , Johann ALSMEIER , Fumiaki TOYAMA , Yuki MIZUTANI , Hiroyuki OGAWA , Chun GE , Daxin MAO , Yanli ZHANG , Alexander CHU , Yan LI
IPC: H01L27/11582 , H01L21/48 , H01L23/498
CPC classification number: H01L27/11582 , H01L21/4846 , H01L21/4853 , H01L21/486 , H01L23/498 , H01L23/49827 , H01L23/49844 , H01L27/11565 , H01L27/1157 , H01L27/11573 , H01L27/11575
Abstract: Lower level metal interconnect structures are formed over a substrate with semiconductor devices thereupon. A semiconductor material layer and an alternating stack of spacer dielectric layers and insulating layers is formed over the lower level metal interconnect structures. An array of memory stack structures is formed through the alternating stack. Trenches are formed through the alternating stack such that a staircase region is located farther away from a threshold lateral distance from the trenches, while neighboring staircase regions are formed within the threshold lateral distance from the trenches. Portions of the spacer dielectric layers proximal to the trenches are replaced with electrically conductive layers, while a remaining portion of the alternating stack is present in the staircase region. At least one through-memory-level via structure can be formed through the remaining portions of the spacer dielectric layers and the insulating layers to provide a vertically conductive path through a memory-level assembly.
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公开(公告)号:US20230082824A1
公开(公告)日:2023-03-16
申请号:US17562635
申请日:2021-12-27
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Srinivas PULUGURTHA , Yanli ZHANG , Johann ALSMEIER , Mitsuhiro TOGO
Abstract: A semiconductor structure includes a semiconductor substrate containing a shallow trench isolation structure that laterally surrounds a transistor active region, at least one line trench vertically extending into the semiconductor substrate, and a source region and a drain region located in the transistor active region. A contoured channel region continuously extends from the source region to the drain region underneath the at least one line trench. A gate dielectric contacts all surfaces of the at least one line trench and extends over an entirety of the contoured channel region. A gate electrode containing at least one fin portion overlies the gate dielectric.
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公开(公告)号:US20220415924A1
公开(公告)日:2022-12-29
申请号:US17929879
申请日:2022-09-06
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Yanli ZHANG , Johann ALSMEIER
IPC: H01L27/11597 , H01L27/1159 , H01L27/11592 , H01L27/11587
Abstract: A memory device includes a semiconductor channel, a gate electrode, and a stack located between the semiconductor channel and the gate electrode. The stack includes, from one side to another, a first ferroelectric material portion, a second ferroelectric material portion, and a gate dielectric portion that contacts the semiconductor channel.
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公开(公告)号:US20210358952A1
公开(公告)日:2021-11-18
申请号:US16876816
申请日:2020-05-18
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Raghuveer S. Makala , Yanli ZHANG , Fei ZHOU , Rahul SHARANGPANI , Adarsh RAJASHEKHAR , Seung-Yeul YANG
IPC: H01L27/11597 , H01L27/11587 , H01L27/1159 , H01L23/522 , H01L23/528
Abstract: A memory opening or a line trench is formed through an alternating stack of insulating layers and sacrificial material layers. A memory opening fill structure or a memory stack assembly is formed, which includes a vertical stack of discrete intermediate metallic electrodes formed on sidewalls of the sacrificial material layers, a gate dielectric layer, and a vertical semiconductor channel. Backside recesses are formed by removing the sacrificial material layers selective to the insulating layers, and a combination of a ferroelectric dielectric layer and an electrically conductive layer within each of the backside recesses. The electrically conductive layer is laterally spaced from a respective one of the discrete intermediate metallic electrodes by the ferroelectric dielectric layer. Ferroelectric-metal-insulator memory elements are formed around the vertical semiconductor channel.
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