公开(公告)号：US20160343911A1

公开(公告)日：2016-11-24

申请号：US15226304

申请日：2016-08-02

Applicant: Seoul Viosys Co., Ltd.

Inventor： Jong Hyeon CHAE ,  Jong Min JANG ,  Won Young ROH ,  Daewoong SUH ,  Dae Sung CHO ,  Joon Sup LEE ,  Kyu Ho LEE ,  Chi Hyun IN

IPC: H01L33/40 ,  H01L33/46 ,  H01L33/42 ,  H01L33/20 ,  H01L33/32 ,  H01L33/12

CPC classification number: H01L33/405 ,  H01L33/0075 ,  H01L33/08 ,  H01L33/12 ,  H01L33/14 ,  H01L33/20 ,  H01L33/22 ,  H01L33/32 ,  H01L33/38 ,  H01L33/42 ,  H01L33/44 ,  H01L33/46 ,  H01L33/486 ,  H01L33/62 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0058

Abstract: A light emitting diode including a first conductive type semiconductor layer, a mesa disposed on the first conductive type semiconductor layer, the mesa including an active layer and a second conductive type semiconductor layer, a reflective electrode disposed on the mesa and configured to be in ohmic-contact with the second conductive type semiconductor layer, a current spreading layer disposed on the mesa and the reflective electrode, the current spreading layer including a first portion configured to be in ohmic-contact with an upper surface of the first conductive type semiconductor layer, a first n-contact region spaced apart from a second n-contact region with the mesa disposed between the first and second n-contact regions, and an insulation layer including a first opening exposing the reflective electrode between the first and second n-contact regions. The first and second n-contact regions have a second opening that exposes the first conductive type semiconductor layer.

Abstract translation: 一种发光二极管，包括第一导电类型半导体层，设置在第一导电类型半导体层上的台面，包括有源层和第二导电类型半导体层的台面，设置在台面上并被配置为欧姆的反射电极 与第二导电型半导体层接触，设置在台面和反射电极上的电流扩散层，电流扩展层包括构造成与第一导电类型半导体层的上表面欧姆接触的第一部分， 与设置在第一和第二n接触区域之间的台面的第二n接触区域间隔开的第一n接触区域以及包括在第一和第二n-接触区域之间暴露反射电极的第一开口的绝缘层 。 第一和第二n接触区域具有暴露第一导电类型半导体层的第二开口。

公开(公告)号：US20160240759A1

公开(公告)日：2016-08-18

申请号：US15140155

申请日：2016-04-27

Applicant: Seoul Viosys Co., Ltd.

Inventor： Jong Hyeon CHAE ,  So Ra LEE ,  Kyung Hee YE

IPC: H01L33/62 ,  H01L33/24 ,  H01L33/38 ,  H01L33/06 ,  H01L33/36 ,  H01L33/32

CPC classification number: H01L33/62 ,  H01L33/08 ,  H01L33/36 ,  H01L33/38

Abstract: A light emitting device in which a bonding pad is soldered to a mounting substrate, wherein the bonding pad may be formed in various shapes that can minimize the occurrence of voids during soldering or heat fusion.

Abstract translation: 一种发光器件，其中将焊盘焊接到安装基板上，其中所述接合焊盘可以形成为可以在焊接或热熔融期间最小化空隙的发生的各种形状。

公开(公告)号：US20140167086A1

公开(公告)日：2014-06-19

申请号：US14105919

申请日：2013-12-13

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Min JANG ,  Kyu-Ho LEE ,  Chang Suk HAN ,  Hwa Mok KIM ,  Daewoong SUH ,  Chi Hyun IN ,  Jong Hyeon CHAE

IPC: H01L33/22 ,  H01L21/02 ,  H01L33/00 ,  H01L29/06

CPC classification number: H01L33/22 ,  H01L21/0237 ,  H01L21/02458 ,  H01L21/0254 ,  H01L21/02639 ,  H01L21/02647 ,  H01L29/0657 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/20 ,  H01L33/24 ,  H01L33/32

Abstract: An epitaxial wafer having a void for separation of a substrate and a semiconductor device fabricated using the same. The epitaxial wafer includes a substrate, a mask pattern disposed on the substrate and comprising a masking region and an opening region, and an epitaxial layer covering the mask pattern. The epitaxial layer includes a void disposed on the masking region.The epitaxial layer can be separated from the growth substrate by applying chemical lift-off or stress lift-off, at the void.

Abstract translation: 具有用于分离衬底的空隙的外延晶片和使用其制造的半导体器件。 外延晶片包括衬底，设置在衬底上并包括掩模区域和开口区域的掩模图案以及覆盖掩模图案的外延层。 外延层包括设置在掩蔽区域上的空隙。 通过在空隙处施加化学剥离或应力剥离，外延层可以与生长衬底分离。

公开(公告)号：US20250160094A1

公开(公告)日：2025-05-15

申请号：US19020138

申请日：2025-01-14

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Chung Hoon LEE ,  Jong Hyeon CHAE

IPC: H10H29/14 ,  G09G3/32 ,  H01L25/075 ,  H10H20/813 ,  H10H20/82 ,  H10H20/824 ,  H10H20/832 ,  H10H20/857

Abstract: A display apparatus including a plurality of pixel regions disposed on a support substrate, each of the pixel regions including a plurality of subpixel stacks including a first epitaxial stack, a second epitaxial stack, and a third epitaxial stack, in which light generated from the first epitaxial stack is to be emitted to the outside of the display apparatus through the second and third epitaxial stacks, light generated from the second epitaxial stack is to be emitted to the outside of the display apparatus through the third epitaxial stack, during operation, one of the subpixel stacks within each pixel region is configured to be selected and driven, and at least one subpixel stack further includes an electrode disposed between the first epitaxial stack and the support substrate to be in ohmic contact with the first epitaxial stack.

公开(公告)号：US20250081705A1

公开(公告)日：2025-03-06

申请号：US18952256

申请日：2024-11-19

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Chung Hoon LEE ,  Jong Hyeon CHAE ,  Seong Gyu JANG ,  Ho Joon LEE

IPC: H01L27/15 ,  G09G3/20 ,  G09G3/32 ,  H01L25/075 ,  H01L25/16 ,  H01L33/30 ,  H01L33/40 ,  H01L33/50

Abstract: A display device including a substrate, a light emitting stacked structure disposed on the substrate and including a plurality of epitaxial sub-units disposed one over another, a first adhesive layer bonding the epitaxial sub-units to the substrate; and a line part disposed on the substrate and configured to apply a light emitting signal to each of the epitaxial sub-units, in which the light emitting stacked structure is configured to provide light having various colors by a combination of light emitted from each of the epitaxial sub-units, and the first adhesive layer includes a conductive and non-transparent material.

公开(公告)号：US20250063877A1

公开(公告)日：2025-02-20

申请号：US18939470

申请日：2024-11-06

Applicant: Seoul Viosys Co., Ltd.

Inventor： Jong Hyeon CHAE ,  Seom Geun LEE ,  Seong Kyu JANG

IPC: H01L27/15

Abstract: A display panel including a circuit board having pads thereon, and a plurality of pixel regions arranged on the circuit board, each of the pixel regions including a first LED stack disposed on the circuit board, a first bonding layer disposed between the first LED stack and the circuit board, a second LED stack disposed on the first LED stack, a third LED stack disposed on the second LED stack, first through-vias passing through the first LED stack and the first bonding layer, second through-vias passing through the second LED stack, and third through-vias passing through the third LED stack, in which the first through-vias pass through the first LED stack and the first bonding layer, and are connected to the pads of the circuit board.

公开(公告)号：US20250056952A1

公开(公告)日：2025-02-13

申请号：US18927345

申请日：2024-10-25

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon CHAE ,  Seom Geun LEE ,  Seong Kyu JANG

IPC: H01L27/15 ,  H01L25/075 ,  H01L33/00 ,  H01L33/22 ,  H01L33/42 ,  H01L33/60 ,  H01L33/62

Abstract: A light emitting device for a display including a first LED stack configured to generate light having a first peak wavelength, a second LED stack disposed under the first LED stack, and configured to generate light having a second peak wavelength, a third LED stack disposed under the second LED stack, and configured to generate light having a third peak wavelength; and a floating reflection layer disposed over the first LED stack, in which the first peak wavelength is longer than the second and third peak wavelengths, the first LED stack has a roughened surface to increase the luminous intensity of the light generated in the first LED stack entering the second LED stack, and the floating reflection layer has a high reflectance of 80% or more over light having the first peak wavelength.

公开(公告)号：US20230081487A1

公开(公告)日：2023-03-16

申请号：US17990735

申请日：2022-11-20

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon CHAE ,  Ik Kyu YOU ,  Seom Geun LEE ,  Seong Kyu JANG ,  Yong Woo RYU

IPC: H01L25/075 ,  H01L33/62 ,  H01L23/00

Abstract: A display panel including a circuit board having first pads, light emitting devices disposed on the circuit board and having second pads and including at least one first light emitting device to emit light having a first peak wavelength and second light emitting devices to emit light having a second peak wavelength, and a metal bonding layer electrically connecting the first pads and the second pads, in which the metal bonding layer of the first light emitting device has a thickness different from that of the metal bonding layer of the second light emitting devices while including a same material, and an upper surface of the second light devices are disposed at an elevation between an upper surface and a bottom surface of the first light emitting device.

公开(公告)号：US20220130898A1

公开(公告)日：2022-04-28

申请号：US17518602

申请日：2021-11-04

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon CHAE ,  Seong Gyu JANG ,  Ho Joon LEE ,  Chang Yeon KIM ,  Chung Hoon LEE

IPC: H01L27/15 ,  H01L33/62 ,  H01L25/075 ,  H01L33/00 ,  H01L25/13 ,  H01L33/10 ,  H01L33/40 ,  H01L33/42 ,  H01L33/50

Abstract: A light emitting diode (LED) stack for a display including a first LED stack including a first conductivity-type semiconductor layer and a second conductivity-type semiconductor layer, a second LED stack disposed on the first LED stack, a third LED stack disposed on the second LED stack, an intermediate bonding layer disposed between the first LED stack and the second LED stack to bond the second LED stack to the first LED stack, an upper bonding layer disposed between the second LED stack and the third LED stack to couple the third LED stack to the second LED stack, and a first hydrophilic material layer disposed between the first LED stack and the upper bonding layer.

公开(公告)号：US20210335887A1

公开(公告)日：2021-10-28

申请号：US17366510

申请日：2021-07-02

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon CHAE ,  Chung Hoon Lee ,  Seong Gyu Jang ,  Chang Yeon Kim ,  Ho Joon Lee

IPC: H01L27/15 ,  H01L25/075 ,  H01L33/10 ,  H01L33/30 ,  H01L33/40 ,  H01L33/50

Abstract: A light emitting diode (LED) pixel for a display including a first LED stack, a second LED stack disposed on a partial region of the first LED stack, a third LED stack disposed on a partial region of the second LED stack, a first ohmic electrode disposed on the first LED stack and forming ohmic contact with the first LED stack, a second transparent electrode disposed between the second LED stack and the third LED stack and in ohmic contact with an upper surface of the second LED stack, and a third transparent electrode in ohmic contact with an upper surface of the third LED stack, in which the first ohmic electrode is laterally spaced apart from the second LED stack.