公开(公告)号：US09899309B2

公开(公告)日：2018-02-20

申请号：US15084762

申请日：2016-03-30

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shih-Ching Chen ,  Shih-Liang Peng ,  Chieh-Lung Lai ,  Jia-Wei Pan ,  Chang-Lun Lu

IPC: H01L23/00 ,  H01L23/48 ,  H01L29/02 ,  H01L25/065 ,  H01L23/498 ,  H01L23/31 ,  H01L25/16 ,  H01L21/48

CPC classification number: H01L21/4846 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/562 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/16 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2924/15151

Abstract: A semiconductor substrate is provided, including a substrate body having a lateral surface, and a protruding structure extending outward from the lateral surface. The semiconductor substrate distributes stresses generated during a manufacturing process through the protruding structure, and is thus prevented from delamination or being cracked. An electronic package having the semiconductor substrate is also provided.

公开(公告)号：US09875949B2

公开(公告)日：2018-01-23

申请号：US14981521

申请日：2015-12-28

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Hsiao-Chun Huang ,  Hsien-Wen Chen ,  Shih-Ching Chen ,  Guang-Hwa Ma

IPC: H01L23/12 ,  H01L21/00 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L23/3121 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5385 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105

Abstract: An electronic package is provided, which includes: a circuit structure having opposite first and second sides; at least an electronic element disposed on the first side of the circuit structure; an encapsulant formed on the first side of the circuit structure for encapsulating the electronic element; a dielectric layer formed on portions of the second side of the circuit structure; and a metal structure formed on the dielectric layer and the circuit structure. The metal structure has a first metal layer bonded to the circuit structure and a second metal layer formed on the first metal layer and the dielectric layer. Therefore, by replacing a conventional silicon interposer with the circuit structure, the invention eliminates the need to fabricate through silicon vias so as to greatly reduce the fabrication difficulty and cost. The invention further provides a method for fabricating the electronic package.

公开(公告)号：US20160329267A1

公开(公告)日：2016-11-10

申请号：US14981521

申请日：2015-12-28

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Hsiao-Chun Huang ,  Hsien-Wen Chen ,  Shih-Ching Chen ,  Guang-Hwa Ma

IPC: H01L23/48 ,  H01L23/29 ,  H01L21/768 ,  H01L23/532 ,  H01L23/498 ,  H01L21/56 ,  H01L23/31 ,  H01L23/528

CPC classification number: H01L23/3121 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5385 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105

Abstract: An electronic package is provided, which includes: a circuit structure having opposite first and second sides; at least an electronic element disposed on the first side of the circuit structure; an encapsulant formed on the first side of the circuit structure for encapsulating the electronic element; a dielectric layer formed on portions of the second side of the circuit structure; and a metal structure formed on the dielectric layer and the circuit structure. The metal structure has a first metal layer bonded to the circuit structure and a second metal layer formed on the first metal layer and the dielectric layer. Therefore, by replacing a conventional silicon interposer with the circuit structure, the invention eliminates the need to fabricate through silicon vias so as to greatly reduce the fabrication difficulty and cost. The invention further provides a method for fabricating the electronic package.

Abstract translation: 提供电子封装，其包括：具有相对的第一和第二侧的电路结构; 至少设置在电路结构的第一侧上的电子元件; 形成在用于封装电子元件的电路结构的第一侧上的密封剂; 形成在电路结构的第二侧的部分上的电介质层; 以及形成在电介质层和电路结构上的金属结构。 金属结构具有接合到电路结构的第一金属层和形成在第一金属层和介电层上的第二金属层。 因此，通过用电路结构代替传统的硅插入器，本发明消除了通过硅通孔制造的需要，从而大大降低了制造难度和成本。 本发明还提供一种制造电子封装的方法。

公开(公告)号：US20160307833A1

公开(公告)日：2016-10-20

申请号：US14981588

申请日：2015-12-28

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Hsien-Wen Chen ,  Shih-Ching Chen ,  Hsiao-Chun Huang ,  Guang-Hwa Ma

IPC: H01L23/498 ,  H01L21/78 ,  H01L21/683 ,  H01L21/48 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L21/78 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L2221/68318 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An electronic packaging structure is provided, including a circuit portion, an electronic element disposed on an upper side of the circuit portion and a glass carrier disposed on a lower side of the circuit portion. By replacing a conventional silicon wafer with the glass carrier, the present invention eliminates the need of an adhesive layer and allows quick removal of the glass carrier during a subsequent process, thus saving the fabrication time and increasing the product yield. The present invention further provides a method for fabricating an electronic package.

Abstract translation: 提供一种电子封装结构，包括电路部分，设置在电路部分上侧的电子元件和设置在电路部分下侧的玻璃载体。 通过用玻璃载体代替传统的硅晶片，本发明消除了对粘合剂层的需要，并允许在随后的工艺中快速去除玻璃载体，从而节省制造时间并提高产品产量。 本发明还提供一种电子封装的制造方法。

公开(公告)号：US20160141227A1

公开(公告)日：2016-05-19

申请号：US14940554

申请日：2015-11-13

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chun-Tang Lin ,  Shih-Ching Chen ,  Yi-Che Lai ,  Hong-Da Chang ,  Hung-Wen Liu ,  Yi-Wei Liu ,  Hsi-Chang Hsu

IPC: H01L23/48 ,  H01L23/528 ,  H01L25/00 ,  H01L21/56 ,  H01L21/683 ,  H01L21/768 ,  H01L23/31 ,  H01L25/065

CPC classification number: H01L25/50 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/48 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/06548 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method for fabricating a package structure is provided, which includes: providing a first carrier having a circuit layer thereon; forming a plurality of conductive posts on the circuit layer and disposing at least an electronic element on the first carrier; forming an encapsulant on the first carrier to encapsulate the conductive posts, the circuit layer and the electronic element; and removing the first carrier, thereby dispensing with the conventional hole opening process for forming the conductive posts and hence reducing the fabrication costs.

Abstract translation: 提供一种制造封装结构的方法，其包括：提供其上具有电路层的第一载体; 在所述电路层上形成多个导电柱，并且至少在所述第一载体上布置电子元件; 在所述第一载体上形成密封剂以封装所述导电柱，所述电路层和所述电子元件; 并且移除第一载体，从而分配用于形成导电柱的传统开孔工艺，从而降低制造成本。

公开(公告)号：US20190109092A1

公开(公告)日：2019-04-11

申请号：US16216621

申请日：2018-12-11

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Rui-Feng Tai ,  Hsiao-Chun Huang ,  Chun-Hung Lu ,  Hsi-Chang Hsu ,  Shih-Ching Chen

IPC: H01L23/544 ,  H01L23/00 ,  H01L21/68 ,  H01L21/56

Abstract: A method for fabricating a package structure is provided, which includes the steps of: providing a base portion having at least an electronic element embedded therein and at least a positioning unit formed around a periphery of the electronic element, wherein the positioning unit protrudes from or is flush with a surface of the base portion; and forming at least a circuit layer on the surface of the base portion and the electronic element. The circuit layer is aligned and connected to the electronic element through the positioning unit.

公开(公告)号：US10242972B2

公开(公告)日：2019-03-26

申请号：US14986149

申请日：2015-12-31

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Lu-Yi Chen ,  Chang-Lun Lu ,  Shih-Ching Chen ,  Guang-Hwa Ma ,  Cheng-Hsu Hsiao

IPC: H01L23/58 ,  H01L21/78 ,  H01L25/10 ,  H01L21/683 ,  H01L23/538 ,  H01L23/31 ,  H01L25/03

Abstract: A package structure is provided, which includes: a dielectric layer having opposite first and second surfaces; a circuit sub-layer formed in the dielectric layer; an electronic element disposed on the first surface of the dielectric layer and electrically connected to the circuit sub-layer; a plurality of conductive posts formed on the first surface of the dielectric layer and electrically connected to the circuit sub-layer; and an encapsulant formed on the first surface of the dielectric layer and encapsulating the electronic element and the conductive posts. Upper surfaces of the conductive posts are exposed from the encapsulant so as to allow another electronic element to be disposed on the conductive posts and electrically connected to the circuit sub-layer through the conductive posts, thereby overcoming the conventional drawback that another electronic element can only be disposed on a lower side of a package structure and improving the functionality of the package structure.

公开(公告)号：US20170309534A1

公开(公告)日：2017-10-26

申请号：US15646695

申请日：2017-07-11

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Lu-Yi Chen ,  Chang-Lun Lu ,  Shih-Ching Chen

IPC: H01L23/16 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L23/16 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/562 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/18162

Abstract: An electronic module is provided, including an electronic element and a strengthening layer formed on a side surface of the electronic element but not formed on an active surface of the electronic element so as to strengthen the structure of the electronic module. Therefore, the electronic element is prevented from being damaged when the electronic module is picked and placed.

公开(公告)号：US09601403B2

公开(公告)日：2017-03-21

申请号：US14982276

申请日：2015-12-29

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Lu-Yi Chen ,  Guang-Hwa Ma ,  Shih-Ching Chen ,  Chang-Lun Lu

IPC: H01L27/32 ,  H01L23/31 ,  H01L25/16 ,  H01L25/065 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00

CPC classification number: H01L23/3128 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/568 ,  H01L23/3135 ,  H01L23/49838 ,  H01L25/0652 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/85005 ,  H01L2224/92125 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/37001 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/45099

Abstract: An electronic package is provided, which includes: a first circuit structure; at least first electronic element disposed on a surface of the first circuit structure; at least a first conductive element formed on the surface of the first circuit structure; a first encapsulant encapsulating the first electronic element and the first conductive element; and a second circuit structure formed on the first encapsulant and electrically connected to the first conductive element. By directly disposing the electronic element having high I/O functionality on the circuit structure, the invention eliminates the need of a packaging substrate having a core layer and thus reduces the thickness of the electronic package. The invention further provides a method for fabricating the electronic package.

公开(公告)号：US20160066406A1

公开(公告)日：2016-03-03

申请号：US14516010

申请日：2014-10-16

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Lu-Yi Chen ,  Chang-Lun Lu ,  Shih-Ching Chen

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/10 ,  H05K3/46 ,  H05K3/30 ,  B05D3/12 ,  H05K1/18

CPC classification number: H01L23/16 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/562 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/18162

Abstract: An electronic module is provided, including an electronic element and a strengthening layer formed on a side surface of the electronic element but not formed on an active surface of the electronic element so as to strengthen the structure of the electronic module. Therefore, the electronic element is prevented from being damaged when the electronic module is picked and placed.

Abstract translation: 提供一种电子模块，包括电子元件和形成在电子元件的侧表面上但未形成在电子元件的有效表面上的加强层，以便加强电子模块的结构。 因此，当拾取和放置电子模块时，防止电子元件被损坏。