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公开(公告)号：US20150119104A1
公开(公告)日：2015-04-30
申请号：US14275788
申请日：2014-05-12
Applicant: Taiyo Yuden Co., Ltd.
Inventor： Tetsuo SAJI , Hiroshi NAKAMURA
CPC classification number: H04B1/40 , H04B1/3805 , H04B1/525 , H04W88/10
Abstract: A circuit module includes: an RFIC that has a transceiver circuit for processing high-frequency signals related to mobile phone communication and a reception circuit for processing reception signals related to GPS, which is a satellite positioning system; GPS front end components; and mobile phone front end components. The mobile phone front end components are mounted on one main surface of a circuit substrate, and at least one of the GPS front end components (a second band-pass filter) is embedded in the circuit substrate.
Abstract translation: 电路模块包括：具有用于处理与移动电话通信有关的高频信号的收发器电路的RFIC和用于处理与作为卫星定位系统的GPS相关的接收信号的接收电路; GPS前端部件; 和手机前端组件。 移动电话前端部件安装在电路基板的一个主表面上，并且至少一个GPS前端部件（第二带通滤波器）嵌入在电路基板中。
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公开(公告)号：US20150049439A1
公开(公告)日：2015-02-19
申请号：US14090387
申请日：2013-11-26
Applicant: Taiyo Yuden Co., Ltd.
Inventor： Masaya SHIMAMURA , Kenzo KITAZAKI , Eiji MUGIYA , Tatsuro SAWATARI , Tetsuo SAJI , Hiroshi NAKAMURA
IPC: H05K1/02
CPC classification number: H05K1/0216 , H01L21/561 , H01L23/3135 , H01L23/552 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/12042 , H01L2924/15159 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , H05K1/0218 , H05K3/107 , H05K3/284 , H05K2201/0715 , H05K2201/09036 , H05K2201/09827 , H05K2201/09972 , H01L2924/00
Abstract: A circuit module includes a circuit substrate, a mount component, a sealing body, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench formed from a main surface of the sealing body to the mount surface. The trench includes side walls configured of a first side wall at a mount surface side and a second side wall at a main surface side. A straight line connecting the first point and the second point has a second slope gentler than the first slope against the mount surface. The shield covers the sealing body and has an inner shield section formed within the trench and an outer shield section disposed on the main surface and the inner shield.
Abstract translation: 电路模块包括电路基板，安装部件，密封体和屏蔽件。 电路基板包括安装表面。 安装部件安装在安装表面上。 密封体形成在安装表面上，覆盖安装部件，并且具有从密封体的主表面到安装表面形成的沟槽。 沟槽包括由安装表面侧的第一侧壁和主表面侧的第二侧壁构成的侧壁。 连接第一点和第二点的直线具有比靠着安装表面的第一斜坡更缓和的第二斜率。 屏蔽罩覆盖密封体并具有形成在沟槽内的内屏蔽部分和设置在主表面和内屏蔽上的外屏蔽部分。
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公开(公告)号：US20150043172A1
公开(公告)日：2015-02-12
申请号：US14103601
申请日：2013-12-11
Applicant: Taiyo Yuden Co., Ltd.
Inventor： Eiji MUGIYA , Kenzo KITAZAKI , Masaya SHIMAMURA , Tetsuo SAJI , Hiroshi NAKAMURA
CPC classification number: H05K1/0218 , H01L2224/16225 , H01L2924/16152 , H01L2924/16153 , H01L2924/181 , H01L2924/19105 , H05K1/0215 , H05K1/0216 , H05K3/284 , H05K3/303 , H05K9/0024 , H05K9/0045 , H05K2201/0723 , H05K2201/09036 , H05K2201/09145 , H05K2201/0919 , H05K2201/09972 , H05K2201/1056 , H05K2203/108 , Y10T29/4913 , H01L2924/00012
Abstract: There is provided a circuit module and a method of producing the same where interlayer wirings of a circuit substrate are prevented from damaging by laser irradiation, and a shield is assuredly electrically connected to the superficial conductor of the circuit substrate. The circuit substrate includes mount components, a sealing body, and a shield. The circuit substrate is a multi-layer substrate on which interlayer wirings are formed, and includes a mount surface on which a superficial conductor is disposed. The mount components are mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench including a first trench section reaching the superficial conductor and a second trench section not reaching the superficial conductor. The shield has an outer shield section and an inner shield section.
Abstract translation: 提供一种电路模块及其制造方法，可以防止电路基板的层间布线受到激光照射的损害，并且屏蔽层可靠地电连接到电路基板的表面导体。 电路基板包括安装部件，密封体和屏蔽件。 电路基板是形成有层间配线的多层基板，具有设置有表面导体的安装面。 安装部件安装在安装表面上。 密封体形成在安装表面上，覆盖安装部件，并且具有包括到达表面导体的第一沟槽部分和没有到达表面导体的第二沟槽部分的沟槽。 屏蔽件具有外屏蔽部分和内屏蔽部分。
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公开(公告)号：US20140299358A1
公开(公告)日：2014-10-09
申请号：US14072648
申请日：2013-11-05
Applicant: Taiyo Yuden Co., Ltd.
Inventor： Tetsuo SAJI , Hiroshi NAKAMURA
IPC: H05K1/02
CPC classification number: H05K1/025 , H05K1/0298
Abstract: A multilayer circuit substrate includes: a first signal line and a first ground conductor formed in a first conductive layer; and a second signal line and a second ground conductor formed in a second conductive layer, the second conductive layer facing the first conductive layer via an insulating layer. The first signal line intersects with the second signal linein a plan view of the multilayer circuit substrate, and a space between the first ground conductor and first signal line is smaller in an intersection area of the first and second signal lines than a space in a non-intersection area, and a space between the second ground conductor and second signal line is smaller in the intersection area than a space in the non-intersection area.
Abstract translation: 多层电路基板包括：第一信号线和形成在第一导电层中的第一接地导体; 以及形成在第二导电层中的第二信号线和第二接地导体，所述第二导电层经由绝缘层面对所述第一导电层。 第一信号线与多层电路基板的平面图中的第二信号线相交，第一和第二信号线的交叉区域中的第一接地导体与第一信号线之间的间隔比非非空 并且第二接地导体和第二信号线之间的空间在交叉区域中比在非交叉区域中的空间小。
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公开(公告)号：US20140133120A1
公开(公告)日：2014-05-15
申请号：US13909880
申请日：2013-06-04
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Tatsuro SAWATARI , Yuichi SUGIYAMA , Hiroshi NAKAMURA , Masaki NAGANUMA , Tetsuo SAJI
CPC classification number: H05K1/185 , H05K1/0213 , H05K1/0271 , H05K1/0298 , H05K2201/09063 , H05K2203/1178
Abstract: In a first conductive layer and a third conductive layer that are respectively closest to a core layer having a storage portion that penetrates therethrough, four first penetrating holes and four first penetrating holes are formed so as to overlap part of an opening edge of the storage portion that is projected onto the first conductive layer and the third conductive layer, respectively.
Abstract translation: 在分别与具有穿过其的存储部分的芯层最靠近的第一导电层和第三导电层中，形成四个第一穿透孔和四个第一穿透孔，以与存储部分的开口边缘的一部分重叠 其分别投影到第一导电层和第三导电层上。
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Patent Agency Ranking
公开(公告)号：US20180202976A1
公开(公告)日：2018-07-19
申请号：US15839401
申请日：2017-12-12
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Tetsuo SAJI
CPC classification number: G01N29/022 , G01N29/036 , G01N29/2437 , G01N29/30 , G01N29/36 , G01N33/0031 , G01N2291/012 , G01N2291/0256 , G01R23/02 , G01R23/06
Abstract: A sensor circuit includes: a resonator of which a resonant frequency and/or an antiresonant frequency changes as a mass of a sensitive part of the resonator changes; an amplifier outputting an oscillation signal having a frequency corresponding to the resonant frequency or the antiresonant frequency; a phase shift circuit changing a phase difference between a first signal and a second signal branched from the oscillation signal in accordance with a change in frequency of the oscillation signal; and a mixer outputting a signal corresponding to a change in the resonant frequency or the antiresonant frequency of the resonator by mixing the first signal and the second signal between which the phase difference has been changed by the phase shift circuit.
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公开(公告)号：US20170264336A1
公开(公告)日：2017-09-14
申请号：US15434943
申请日：2017-02-16
Applicant: TAIYO YUDEN CO., LTD.
Inventor： Tetsuo SAJI
CPC classification number: H04B1/48 , H03H9/542 , H03H9/605 , H03H9/6403 , H03H9/6483 , H03H2210/012 , H03H2210/025 , H04L5/001 , H04L5/14 , H04W84/042
Abstract: A filter circuit includes: a variable filter that is connected between a common terminal and a node and configured to change a passband thereof; a receive switch connected between a receive terminal, from which a reception signal in a first band is output, and the node; and a transmit switch connected between a transmit terminal, to which a transmission signal in a second band different from the first band is input, and the node.
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公开(公告)号：US20150070849A1
公开(公告)日：2015-03-12
申请号：US14090445
申请日：2013-11-26
Applicant: Taiyo Yuden Co., Ltd.
Inventor： Masaya SHIMAMURA , Takehiko KAI , Eiji MUGIYA , Tetsuo SAJI , Hiroshi NAKAMURA
IPC: H05K1/02
CPC classification number: H05K1/0216 , H01L21/561 , H01L23/3135 , H01L23/552 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/12042 , H01L2924/15159 , H01L2924/181 , H01L2924/1815 , H01L2924/19105 , H05K1/0215 , H05K1/0269 , H05K3/284 , H05K5/065 , H05K9/0037 , H05K9/0083 , H05K2201/09036 , H05K2201/09145 , H05K2201/09972 , H05K2201/1056 , H01L2224/81 , H01L2924/00 , H01L2924/00012
Abstract: There is provided a circuit module including a circuit substrate having a mount surface; a mount component mounted on the mount surface; a sealing body formed on the mount surface, the sealing body covering the mount component and having a trench formed from a main surface of the sealing body to the mount surface; and a shield having an inner shield section formed within the trench and an outer shield section that covers the sealing body and the inner shield section, the outer shield section including a first section having a flat surface formed on the main surface of the shielding body and a second section formed on the inner shield section and protruded or sagged from the first section.
Abstract translation: 提供一种电路模块，包括具有安装表面的电路基板; 安装在安装表面上的安装部件; 所述密封体形成在所述安装表面上，所述密封体覆盖所述安装部件，并且具有从所述密封体的主表面到所述安装表面形成的沟槽; 以及屏蔽体，其具有形成在所述沟槽内的内屏蔽部和覆盖所述密封体和所述内屏蔽部的外屏蔽部，所述外屏蔽部具有形成在所述屏蔽体的主表面上的平坦面的第一部， 形成在所述内屏蔽部上并从所述第一部分突出或下垂的第二部分。
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公开(公告)号：US20150043170A1
公开(公告)日：2015-02-12
申请号：US14086407
申请日：2013-11-21
Applicant: Taiyo Yuden Co., Ltd.
Inventor： Masaya SHIMAMURA , Kenzo KITAZAKI , Yutaka NAGAI , Hiroshi NAKAMURA , Tetsuo SAJI , Eiji MUGIYA
CPC classification number: H05K9/00 , H01L21/561 , H01L23/3121 , H01L23/552 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/12042 , H01L2924/15159 , H01L2924/1531 , H01L2924/181 , H01L2924/19105 , H05K1/0218 , H05K1/0271 , H05K1/186 , H05K3/0052 , H05K3/284 , H05K3/301 , H05K2201/0715 , Y10T29/4913 , H01L2224/81 , H01L2924/00
Abstract: A circuit module includes a substrate, a mount component, a sealing body, a trench and a shield. The substrate has a mount surface. The mount component is mounted on the mount surface. The sealing body has a main surface and an outer peripheral surface, the sealing body sealing the mount component, the main surface sandwiching the mount component between the main surface and the mount surface, the outer peripheral surface covering the mount component on the mount surface. The trench has a groove-like shape, the trench being recessed from the main surface of the sealing body to the mount surface, the trench being formed to leave a space between the trench and the outer peripheral surface. The shield covers the main surface and the outer peripheral surface of the sealing body, the shield being filled in the trench.
Abstract translation: 电路模块包括基板，安装部件，密封体，沟槽和屏蔽件。 基板具有安装表面。 安装部件安装在安装表面上。 密封体具有主表面和外周面，密封体密封安装部件，主表面将安装部件夹在主表面和安装表面之间，外周表面覆盖安装部件在安装表面上。 沟槽具有凹槽状形状，沟槽从密封体的主表面凹入到安装表面，沟槽形成为在沟槽和外周表面之间留出空间。 屏蔽覆盖密封体的主表面和外周表面，屏蔽件被填充在沟槽中。
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公开(公告)号：US20140285213A1
公开(公告)日：2014-09-25
申请号：US14217002
申请日：2014-03-17
Applicant: Taiyo Yuden Co., Ltd.
Inventor： Shigeo SAKURAI , Tetsuo SAJI
CPC classification number: G01R31/048 , G01R27/26 , G01R31/028 , G01R31/2812 , G01R31/2813 , H05K1/0231 , H05K1/0268 , H05K1/185 , H05K3/4602 , H05K2201/10522 , H05K2201/10636 , Y02P70/611
Abstract: In a component-embedded circuit substrate having a plurality of capacitors embedded therein, the capacitors are connected in parallel, inspection electrodes are formed, and the inspection electrodes connect to respective terminal electrodes of the capacitor through via conductors. At the terminal electrodes of the capacitor, the connection position of the via conductors for connecting the inspection electrodes differs from the connection position of via conductors for connecting respective terminal electrodes of the capacitor.
Abstract translation: 在嵌入有多个电容器的分量嵌入式电路基板中，并联连接电容器，形成检查电极，检查电极通过通孔导体与电容器的各个端子电极连接。 在电容器的端子电极上，用于连接检查电极的通路导体的连接位置与用于连接电容器的各个端子电极的通路导体的连接位置不同。
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