公开(公告)号：US20070296555A1

公开(公告)日：2007-12-27

申请号：US11809246

申请日：2007-05-31

申请人： Masayoshi Kanno

发明人： Masayoshi Kanno

IPC分类号： H04B1/59

CPC分类号： H01Q1/38 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07781 ,  H01F17/0013 ,  H01F27/40 ,  H01F2017/0046 ,  H01L23/544 ,  H01L23/66 ,  H01L2223/54473 ,  H01L2223/6677 ,  H01L2924/0002 ,  H01Q1/2225 ,  H01Q7/00 ,  H01L2924/00

摘要： Disclosed herein is a radio frequency identification tag including, a substrate, an antenna provided at the substrate, the antenna formed by winding a conductor in a coil pattern around, and on a plane orthogonal to, a center axis of the substrate, the center axis extending in a direction parallel to the thickness direction of the substrate, a radio frequency identification chip attached to the substrate and operative to perform radiocommunication with a reader/writer apparatus through the antenna, and a package sealing the substrate and the antenna as well as the radio frequency identification chip therein, wherein a mark for specifying the center axis is formed on an outside surface where the package is exposed to the outside.

摘要翻译： 本发明公开了一种射频识别标签，包括基板，设置在基板上的天线，天线通过以与基板的中心轴正交的平面绕成线圈图案而形成，该中心轴 在与基板的厚度方向平行的方向上延伸的射频识别芯片，附接到基板的操作用于通过天线与读取器/写入器设备进行无线电通信的射频识别芯片，以及密封基板和天线的封装以及 射频识别芯片，其中用于指定中心轴的标记形成在外部暴露于外部的外表面上。

公开(公告)号：US07161542B2

公开(公告)日：2007-01-09

申请号：US10433606

申请日：2001-12-18

申请人： Takanori Endo ,  Tadashi Yonezawa ,  Seirou Yahata

发明人： Takanori Endo ,  Tadashi Yonezawa ,  Seirou Yahata

IPC分类号： H01Q1/24

CPC分类号： H01Q1/2225 ,  G06K19/0726 ,  G06K19/07749 ,  G06K19/07771 ,  G06K19/07779 ,  G06K19/07781 ,  G06K19/07783 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q7/00 ,  H01Q7/06 ,  H01Q9/27

摘要： An antenna for RFID (Radio Frequency Identification) configured to be electrically connected to an IC (Integrated Circuit) chip or capacitor and configured to be affixed to an article. The antenna includes: a planar conductive member having a first side configured to be mounted on the article; and a coil body configured with coil turns and mounted on or at a second side which is opposite to the first side of the conductive member. The number of the coil turns and diameter of the coil body are adjusted such that a characteristic of said coil body has a predetermined value. The conductive member shields the coil body from the article.

摘要翻译： 一种用于RFID（射频识别）的天线，被配置为电连接到IC（集成电路）芯片或电容器并且被配置为附着到物品上。 天线包括：平面导电构件，其具有被配置为安装在制品上的第一侧; 以及线圈体，其配置有线圈，并安装在与所述导电构件的所述第一侧相对的第二侧上或第二侧。 调整线圈匝数和线圈体的直径，使得所述线圈体的特性具有预定值。 导电构件将线圈体与物品隔离。

公开(公告)号：US20050248429A1

公开(公告)日：2005-11-10

申请号：US10512845

申请日：2003-04-29

申请人： Nicolas Schieli ,  Christian Bussiere

发明人： Nicolas Schieli ,  Christian Bussiere

IPC分类号： G06K19/077 ,  H01F5/00 ,  H01F27/28 ,  H01F41/06

CPC分类号： G06K19/07779 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07781 ,  H01F5/00 ,  H01F41/066 ,  H01F41/098 ,  Y10T29/4902

摘要： A coil arrangement for radio-frequency identification devices, process and an apparatus for making such a coil arrangement are described herein. The coil arrangement includes first and second terminals having a geometry different from one another and from the active coil winding of the arrangement. The apparatus is in the form of a spindle having three axially adjacent portions defining cross-sectional profiles.

摘要翻译： 本文描述了用于射频识别装置的线圈装置，工艺和用于制造这种线圈装置的装置。 线圈装置包括具有彼此不同的几何形状的第一和第二端子以及与该装置的有源线圈绕组的第一和第二端子。 该装置是具有限定横截面轮廓的具有三个轴向相邻部分的心轴的形式。

公开(公告)号：US20050148121A1

公开(公告)日：2005-07-07

申请号：US11007645

申请日：2004-12-09

申请人： Shunpei Yamazaki ,  Toru Takayama ,  Yohei Kanno

发明人： Shunpei Yamazaki ,  Toru Takayama ,  Yohei Kanno

IPC分类号： G06K19/07 ,  G06K19/077 ,  H01L21/00 ,  H01L21/68 ,  H01L21/82 ,  H01L23/02 ,  H01L23/498 ,  H01L27/00

CPC分类号： H01L21/6835 ,  G06K19/0704 ,  G06K19/0723 ,  G06K19/07703 ,  G06K19/07718 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07758 ,  G06K19/07779 ,  G06K19/07781 ,  G06K19/07783 ,  H01L23/49855 ,  H01L2221/68318 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/45147 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/00011

摘要： With non-contact and contact IC chips becoming common, it is necessary to mass-produce enormous amount of IC chips, which are utilizable for human beings, animals and plants, commercial products, banknotes, and the like, at low cost. For example, it is necessary to manufacture IC chips to be applied to commercial products, banknotes, and the like at a cost of 1 to several yen per IC chip, preferably, at a cost less than 1 yen, and it is desired to realize a structure of an IC chip that can be mass-produced at low cost and a manufacturing process of the IC chip. A method of-manufacturing a thin film integrated circuit device according to the present invention includes steps of forming a peel-off layer over a thermally oxidized silicon substrate, forming a plurality of thin film integrated circuit devices over the peel-off layer with a base film interposed therebetween, forming a groove between the plurality of thin film integrated circuit devices, and separating the plurality of thin film integrated circuit devices by introducing one of a gas and a liquid including halogen fluoride into the groove to remove the peel-off layer.

摘要翻译： 随着非接触式和接触式IC芯片的普及，需要大量生产大量可用于人类，动植物，商业产品，纸币等的IC芯片，成本低廉。 例如，以IC成本为1〜数日元的成本，优选以不到1日元的成本为代价，制造适用于商品，纸币等的IC芯片是有必要的。 可以低成本大量生产的IC芯片的结构和IC芯片的制造工艺。 根据本发明的制造薄膜集成电路器件的方法包括以下步骤：在热氧化硅衬底上形成剥离层，在剥离层上形成多个薄膜集成电路器件，基底 在所述多个薄膜集成电路器件之间形成沟槽，并且通过将含有卤素氟化物的气体和液体中的一种引入到所述沟槽中以除去所述剥离层来分离所述多个薄膜集成电路器件。

公开(公告)号：US06820314B2

公开(公告)日：2004-11-23

申请号：US10318544

申请日：2002-12-13

申请人： Donald Harold Ferguson ,  Mircea Paun

发明人： Donald Harold Ferguson ,  Mircea Paun

IPC分类号： H01G440

CPC分类号： G06K19/0702 ,  G06K19/04 ,  G06K19/0723 ,  G06K19/07749 ,  G06K19/07758 ,  G06K19/07779 ,  G06K19/07781 ,  G06K19/07783 ,  G08G1/017 ,  H05K1/16 ,  H05K1/165 ,  Y10T29/435 ,  Y10T29/49018 ,  Y10T29/4902 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49171

摘要： A radio frequency identification tag is made with a printed antenna coil integrated on a flexible substrate, and an integrated circuit area of the substrate adjacent to the antenna coil for carrying circuit elements. The radio frequency identification tag is designed to be sufficiently robust to withstand the rigors of mail efficiency processing measurement applications. Robustness is accomplished by encapsulating a sensing circuit formed on the flexible substrate thereby forming a semi-rigid area on the substrate and leaving the antenna portion of the substrate flexible.

摘要翻译： 射频识别标签由集成在柔性基板上的印刷天线线圈和与用于承载电路元件的天线线圈相邻的基板的集成电路区域制成。 无线射频识别标签被设计成足够坚固以承受邮件效率处理测量应用的严格性。 通过封装形成在柔性基板上的感测电路，从而在基板上形成半刚性区域并使基板的天线部分变得柔性来实现鲁棒性。

公开(公告)号：US20020053598A1

公开(公告)日：2002-05-09

申请号：US09906148

申请日：2001-07-17

申请人： FUJITSU LIMITED

发明人： Izumi Kobayashi ,  Takanori Watanabe

IPC分类号： G06K019/06

CPC分类号： G06K19/0775 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07781 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4813 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/20759 ,  H01L2924/20758 ,  H01L2924/00014

摘要： An improved contactless integrated circuit (IC) card of the type having one or more laminate members, a wire-wound coil provided on the laminate member for receiving power and for transmitting and receiving signals to and from an external device, and an IC module for inputting and outputting the signals, the wire-wound coil being coupled to the IC module, wherein the improvement comprises an end portion of the wire-wound coil being formed into a buffer portion near the point at which the wire-wound coil is coupled to the IC module so as to absorb tension generated in the wire-wound coil.

摘要翻译： 一种具有一个或多个层叠构件的改进的非接触集成电路（IC）卡，设置在层叠构件上用于接收电力并用于从外部装置发送和接收信号的绕线线圈，以及用于 所述线绕线圈被耦合到所述IC模块，其中所述改进包括所述绕线线圈的端部形成在所述绕线线圈与所述绕线线圈耦合的点附近的缓冲部分 IC模块，以吸收线绕线圈产生的张力。

公开(公告)号：US6088230A

公开(公告)日：2000-07-11

申请号：US716285

申请日：1996-09-20

申请人： David Finn ,  Manfred Rietzler

发明人： David Finn ,  Manfred Rietzler

IPC分类号： H01L21/60 ,  G06K19/077 ,  H01F41/04 ,  H01F41/06 ,  H01F41/10 ,  H01L25/00 ,  H05K3/10 ,  H05K7/02

CPC分类号： G06K19/07749 ,  G06K19/0775 ,  G06K19/07779 ,  G06K19/07781 ,  H01F41/041 ,  H01F41/10 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/45015 ,  H01L2224/45565 ,  H01L2224/4813 ,  H01L2224/78 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

摘要： Procedure for producing a transponder unit (55) provided with at least one chip (16) and one coil (18), and in particular a chip card/chip-mounting board (17) wherein the chip and the coil are mounted on one common substrate (15) and the coil is formed by installing a coil wire (21) and connecting the coil-wire ends (19, 23) to the contact surfaces (20, 24) of the chip on the substrate.

摘要翻译： PCT No.PCT / DE95 / 00416 Sec。 371日期：1996年9月20日 102（e）日期1996年9月20日PCT 1995年3月26日PCT公布。 公开号WO95 / 26538 日期1995年10月5日为制造设置有至少一个芯片（16）和一个线圈（18）的应答器单元（55）的程序，特别是芯片卡/芯片安装板（17），其中芯片和线圈 安装在一个公共基板（15）上，线圈是通过安装线圈线（21）并将线圈线端部（19,23）连接到基板上的芯片的接触表面（20,24）而形成的。

公开(公告)号：US5946198A

公开(公告)日：1999-08-31

申请号：US546990

申请日：1995-10-23

申请人： Joachim Hoppe ,  Arno Hohmann

发明人： Joachim Hoppe ,  Arno Hohmann

IPC分类号： B42D15/10 ,  G06K19/07 ,  G06K19/077 ,  H01Q1/22 ,  H05K1/16 ,  H01L23/495

CPC分类号： H01Q1/2225 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07779 ,  G06K19/07781 ,  H01Q1/22 ,  H01L2224/48091 ,  H01L2924/01068 ,  Y10S257/924

摘要： An electronic module to be installed in a data carrier is described, the electronic module having an integrated circuit disposed on a carrier of the module and connected electrically with a coil for noncontacting data exchange. To make such electronic modules easy to produce and more cost-effective, the inventive module dispenses completely with an additional separate substrate for receiving the integrated circuit and coil.

摘要翻译： 描述了要安装在数据载体中的电子模块，该电子模块具有集成电路，该集成电路设置在模块的载体上，并与用于非接触式数据交换的线圈电连接。 为了使这样的电子模块易于制造并且更具成本效益，本发明的模块完全分配用于接收集成电路和线圈的附加单独的基板。

公开(公告)号：US5943769A

公开(公告)日：1999-08-31

申请号：US7762

申请日：1998-01-15

申请人： Arno Hohmann ,  Joachim Hoppe ,  Yahya Haghiri-Tehrani

发明人： Arno Hohmann ,  Joachim Hoppe ,  Yahya Haghiri-Tehrani

IPC分类号： B42D15/10 ,  G06K19/04 ,  G06K19/077 ,  H05K3/02

CPC分类号： G06K19/07718 ,  G06K19/041 ,  G06K19/077 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07781 ,  H01L2224/48091 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  Y10T29/49128 ,  Y10T29/49146 ,  Y10T29/49155

摘要： A method for making integrated circuits electrically connected to conductive coil elements includes placing integrated circuits in recesses provided at precise locations along a foil carrier web and positioning coils also at designated locations on the foil web so that a coil is associated with each integrated circuit. The web is then cut to produce a planar coil electrically connected to an integrated circuit on a foil element. The integrated circuit and coils may be coated with a casting compound and the coils may be formed using various procedures, including pressing coils into the surface of the foil, sewing the coils to the foil and electrostatically forming the coils on the foil with fusion of the coil material directly onto the foil. Apparatus for carrying out the aforesaid process, including winding of the coils, is described.

摘要翻译： 一种用于制造电连接到导电线圈元件的集成电路的方法包括将集成电路放置在沿着箔片承载片的精确位置处设置的凹部中，并且还在箔片上的指定位置处定位线圈，使得线圈与每个集成电路相关联。 然后将网片切割以产生电连接到箔元件上的集成电路的平面线圈。 集成电路和线圈可以涂覆有铸造复合物，并且线圈可以使用各种方法形成，包括将线圈压入箔的表面，将线圈缝合到箔上，并在箔上静电地形成线圈， 线圈材料直接在箔上。 描述了用于执行上述处理的装置，包括线圈的卷绕。

公开(公告)号：US5809633A

公开(公告)日：1998-09-22

申请号：US812111

申请日：1997-03-05

申请人： Josef Mundigl ,  Detlef Houdeau

发明人： Josef Mundigl ,  Detlef Houdeau

IPC分类号： B42D15/10 ,  G06K19/07 ,  G06K19/077 ,  H01L21/60 ,  H05K3/32 ,  H02P11/00

CPC分类号： G06K19/07747 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07779 ,  G06K19/07781 ,  G06K19/07783 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/4813 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2224/49 ,  H01L24/45 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  Y10T29/49016 ,  Y10T29/49121

摘要： A method for producing a smart card module includes bonding one end of a thin wire onto a first contact zone of a semiconductor chip. The wire is guided in a plurality of turns forming an antenna coil. The wire is bonded onto a second contact area of the semiconductor chip. The wire turns of the antenna coil and the semiconductor chip are placed on a carrier body.

摘要翻译： 一种用于制造智能卡模块的方法包括将细线的一端接合到半导体芯片的第一接触区上。 导线以形成天线线圈的多个匝引导。 导线被接合到半导体芯片的第二接触区域上。 天线线圈的线圈和半导体芯片放置在载体上。