Abstract:
The invention relates to a method for attaching a flat electronic component (2, 2a; 12; 22; 32; 42), in particular a photovoltaic cell, onto a flexible surface structure (1; 11; 21; 31), to the use of a programmable embroidering machine, to a flexible surface structure (1; 11; 21; 31; 41) comprising at least one electronic component (2, 2a; 12; 22; 32; 42) and to a solar module. At least one conduction path (4, 5; 14, 15; 24, 25; 34, 35; 44, 45) is embroidered onto the flexible surface structure, wherein a first conduction path (4; 14; 24; 34; 44) only contacts a first surface segment, in particular the bottom side (16; 36; 46), of the component (2, 2a; 12; 22; 32; 42) and a second conduction path (5; 15; 25; 35; 45) only contacts a second surface segment, in particular the top side (7; 17), of the same component (2, 2a; 12; 22; 32; 42).
Abstract:
Provided is a solar battery module wherein solar battery cells are electrically connected to each other by using a wiring board having a predetermined wiring pattern formed on a resin base material. A method for manufacturing such solar battery module is also provided. In the wiring board of the solar battery module, a direction wherein a design margin is small is permitted to be a direction wherein the thermal contraction ratio of the resin base material is small, by the shape of an electrode pattern on the solar battery cell and that of the wiring pattern on the wiring board. At the time of manufacturing such solar battery module, temperature in a heat treatment step is set at 100° C. or higher but not higher than 180° C. Electrode designing at a fine pitch is made possible and the solar battery module exhibits high solar battery characteristics, even when the solar battery cells are connected by using wiring boards composed of various types of resin materials having thermal compression ratio not sufficiently low.
Abstract:
The present invention provides a solar cell module in which at least one portion of a wire (109, 110, 1109, 1110) of a wiring substrate at a side opposite to light receiving surfaces of solar cells (100, 1100) is exposed from a sealing material (118, 1118), as well as a method for manufacturing the solar cell module. Further, the present invention provides a solar cell module in which a conductive wire (1200, 1202) for extracting a current to outside has one end (1200a, 1202a, 1203a, 1204a) electrically connected to a wire (109, 110, 1109, 1110) of a wiring substrate and the conductive wire (1200, 1202) has the other end (1200c, 1202b, 1203b, 1204c) drawn to outside from a sealing material (118, 1118), and at least one portion of a surface of the conductive wire (1200, 1202) between the one end (1200a, 1202a, 1203a, 1204a) of the conductive wire (1200, 1202) and the other end (1200c, 1202b, 1203b, 1204c) of the conductive wire (1200, 1202) is covered with at least one of an insulating base (111, 1111) and the insulating sealing material (118, 1118), as well as a method for manufacturing the solar cell module.
Abstract:
A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.
Abstract:
An arrangement is provided reduces deformation induced by vibration movements in electronic devices such as Micro Inertial Measurement systems. The result is achieved by the use and particular arrangement of additional printed circuit boards.
Abstract:
A wireless communication module includes: a wireless circuit configured to transmit/receive a wireless signal; a first inter-board connector; a first board on which the wireless circuit and the first connector are mounted; a signal processing circuit configured to process the wireless signal transmitted/received by the wireless circuit; a second inter-board connector configured to be connected to the first connector; and a second board on which the signal processing circuit and the second connector are mounted. The first board overlaps at least partially with the second board under a condition where the first connector and the second connector are interconnected.
Abstract:
A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.
Abstract:
A wireless communication module includes: a wireless circuit configured to transmit/receive a wireless signal; a first inter-board connector; a first board on which the wireless circuit and the first connector are mounted; a signal processing circuit configured to process the wireless signal transmitted/received by the wireless circuit; a second inter-board connector configured to be connected to the first connector; and a second board on which the signal processing circuit and the second connector are mounted. The first board overlaps at least partially with the second board under a condition where the first connector and the second connector are interconnected.
Abstract:
A device housing package includes a substrate in a form of a rectangle, having a mounting region of a device at an upper surface thereof; a frame body disposed on the substrate so as to extend along an outer periphery of the mounting region, the frame body having a cutout formed at a part thereof; and an input-output terminal disposed in the cutout. The input-output terminal includes a first insulating layer, a second insulating layer overlaid on the first insulating layer, and a third insulating layer overlaid on the second insulating layer. First terminals set at a predetermined potential are disposed on an upper surface of the first insulating layer. Second terminals set at a predetermined potential are disposed on a lower surface of the first insulating layer. Third terminals through which AC signals flow are disposed on an upper surface of the second insulating layer.
Abstract:
Relatively small, electrically isolated LED tiles or PV tiles are fabricated having an anode electrode and a cathode electrode. The LED tiles contain microscopic printed LEDs that are connected in parallel by two conductive layers sandwiching the LEDs. The top conductive layer is transparent. Separately formed from the tiles is a large area backplane having a single layer or multiple layers of metal traces connected to backplane electrodes corresponding to the tile electrodes. Multiple tiles are laminated over the backplane's metal pattern to connect the tile electrodes to the backplane electrodes, such as by a conductive adhesive. The backplane metal pattern may connect the tiles in series and/or parallel, or form an addressable circuit for a display. Groups of tiles may be physically connected to each other prior to the lamination to ease handling and alignment. The backplane has power terminals electrically coupled to the metal traces for receiving power.