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公开(公告)号：US08999742B1
公开(公告)日：2015-04-07
申请号：US14101554
申请日：2013-12-10
Applicant: Nthdegree Technologies Worldwide Inc.
Inventor： Mark D. Lowenthal , Tricia A. Youngbull , William J. Ray
IPC: H01L31/18 , B29C39/00 , B29C39/02 , B29C39/38 , B29C39/36 , B29C39/26 , B29C33/38 , B29K105/00 , B29L31/34
CPC classification number: H01L31/1804 , B29C33/3842 , B29C39/003 , B29C39/02 , B29C39/26 , B29C39/36 , B29C39/38 , B29K2105/0064 , B29K2105/251 , B29K2909/08 , B29K2995/0005 , B29K2995/0094 , B29L2031/3406 , H01L21/02532 , H01L21/02601 , H01L21/02628 , H01L31/035209 , H01L31/035281 , Y02E10/547 , Y02P70/521
Abstract: Small silicon spheres, less than 200 um in diameter, are desirable for use in forming solar panels. To make such small spheres, a large-area glass substrate has etched in its surface millions of identical indentations, such as having diameters less than 200 um. A silicon ink, formed of a fluid containing nanoparticles of milled silicon, is then deposited over the substrate to completely fill the indentations, and the excess ink is removed. The ink is heated to evaporate the fluid and melt the silicon nanoparticles. A photonic system is used to rapidly melt the silicon. The melted silicon forms a sphere in each indentation by surface tension. Since the density of the silicon in the ink and the volume of each indentation are well defined, the volume of each sphere is well defined. The substrates are reusable. Hundreds of millions of spheres may be produced per minute using the process.
Abstract translation: 直径小于200um的小硅球是用于形成太阳能电池板的理想材料。 为了制造这样的小球体，大面积玻璃基板在其表面上蚀刻了数百万个相同的凹痕，例如直径小于200μm。 然后将由含有研磨硅的纳米颗粒的流体形成的硅油墨沉积在基材上以完全填充凹痕，并且除去多余的油墨。 将油墨加热以蒸发流体并熔化硅纳米颗粒。 光子系统用于快速熔化硅。 熔融的硅通过表面张力在每个压痕中形成球体。 由于油墨中的硅的密度和每个压痕的体积被很好地限定，所以每个球体的体积被很好地限定。 底物可重复使用。 使用该过程可能每分钟产生数亿个球体。
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公开(公告)号：US20150076711A1
公开(公告)日：2015-03-19
申请号：US14552212
申请日：2014-11-24
Applicant: Nthdegree Technologies Worldwide Inc.
Inventor： Richard A. Blanchard , William J. Ray , Mark D. Lowenthal , Xiaorong Cai , Theodore Kamins
IPC: H01L23/48
CPC classification number: H01L23/481 , H01L21/288 , H01L21/486 , H01L21/76879 , H01L21/76882 , H01L21/76898 , H01L23/49827 , H01L23/5226 , H01L23/5328 , H01L24/05 , H01L24/06 , H01L24/08 , H01L24/19 , H01L24/80 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2224/03002 , H01L2224/0332 , H01L2224/05568 , H01L2224/0557 , H01L2224/06181 , H01L2224/08146 , H01L2224/08165 , H01L2224/73265 , H01L2224/76155 , H01L2224/83191 , H01L2224/94 , H01L2225/06513 , H01L2225/06517 , H01L2225/06572 , H01L2924/12042 , H01L2224/03 , H01L2224/80 , H01L2924/00
Abstract: Vias (holes) are formed in a wafer or a dielectric layer. A low viscosity conductive ink, containing microscopic metal particles, is deposited over the top surface of the wafer to cover the vias. An external force is applied to urge the ink into the vias, including an electrical force, a magnetic force, a centrifugal force, a vacuum, or a suction force for outgas sing the air in the vias. Any remaining ink on the surface is removed by a squeegee, spinning, an air knife, or removal of an underlying photoresist layer. The ink in the vias is heated to evaporate the liquid and sinter the remaining metal particles to form a conductive path in the vias. The resulting wafer may be bonded to one or more other wafers and singulated to form a 3-D module.
Abstract translation: 通孔（孔）形成在晶片或电介质层中。 包含微观金属颗粒的低粘度导电油墨沉积在晶片的顶表面上以覆盖通孔。 施加外力以将油墨推入通孔中，包括电力，磁力，离心力，真空或用于排气通过通孔中的空气的吸力。 表面上的任何剩余的油墨都被刮刀，纺丝，气刀或下面的光致抗蚀剂层除去。 将通孔中的油墨加热以蒸发液体并烧结剩余的金属颗粒，以在通孔中形成导电路径。 所得到的晶片可以结合到一个或多个其它晶片并且被单个化以形成3-D模块。
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公开(公告)号：US08940627B2
公开(公告)日：2015-01-27
申请号：US14075089
申请日：2013-11-08
Applicant: Nthdegree Technologies Worldwide Inc.
Inventor： Richard A. Blanchard , William J. Ray , Mark D. Lowenthal , Xiaorong Cai , Theodore Kamins
IPC: H01L21/44 , H01L21/4763 , H01L21/768 , H01L21/288 , H01L23/48 , H01L23/00
CPC classification number: H01L23/481 , H01L21/288 , H01L21/486 , H01L21/76879 , H01L21/76882 , H01L21/76898 , H01L23/49827 , H01L23/5226 , H01L23/5328 , H01L24/05 , H01L24/06 , H01L24/08 , H01L24/19 , H01L24/80 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2224/03002 , H01L2224/0332 , H01L2224/05568 , H01L2224/0557 , H01L2224/06181 , H01L2224/08146 , H01L2224/08165 , H01L2224/73265 , H01L2224/76155 , H01L2224/83191 , H01L2224/94 , H01L2225/06513 , H01L2225/06517 , H01L2225/06572 , H01L2924/12042 , H01L2224/03 , H01L2224/80 , H01L2924/00
Abstract: Vias (holes) are formed in a wafer or a dielectric layer. A low viscosity conductive ink, containing microscopic metal particles, is deposited over the top surface of the wafer to cover the vias. An external force is applied to urge the ink into the vias, including an electrical force, a magnetic force, a centrifugal force, a vacuum, or a suction force for outgassing the air in the vias. Any remaining ink on the surface is removed by a squeegee, spinning, an air knife, or removal of an underlying photoresist layer. The ink in the vias is heated to evaporate the liquid and sinter the remaining metal particles to form a conductive path in the vias. The resulting wafer may be bonded to one or more other wafers and singulated to form a 3-D module.
Abstract translation: 通孔（孔）形成在晶片或电介质层中。 包含微观金属颗粒的低粘度导电油墨沉积在晶片的顶表面上以覆盖通孔。 施加外力以将油墨推入通孔中，包括用于使过孔中的空气排气的电力，磁力，离心力，真空或吸力。 表面上的任何剩余的油墨都被刮刀，纺丝，气刀或下面的光致抗蚀剂层除去。 将通孔中的油墨加热以蒸发液体并烧结剩余的金属颗粒，以在通孔中形成导电路径。 所得到的晶片可以结合到一个或多个其它晶片并且被单个化以形成3-D模块。
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公开(公告)号：US20140355251A1
公开(公告)日：2014-12-04
申请号：US14292069
申请日：2014-05-30
Applicant: Nthdegree Technologies Worldwide Inc.
Inventor： Eric William Kahrs , Bradley Steven Oraw
CPC classification number: H01L33/58 , F21K9/65 , F21V33/0052 , H01L25/0753 , H01L2224/32245 , H01L2924/0002 , H01L2924/00
Abstract: An initially flat light sheet is formed by printing conductor layers and microscopic LEDs over a flexible substrate to connect the LEDs in parallel. The light sheet is then subjected to a molding process which forms 3-dimensional features in the light sheet, such as bumps of any shape. The features may be designed to create a desired light emission profile, increase light extraction, and/or create graphical images. In one embodiment, an integrated light sheet and touch sensor is formed, where the molded features convey touch positions of the sensor. In one embodiment, a curable resin is applied to the light sheet to fix the molded features. In another embodiment, optical features are molded over the flat light sheet. In another embodiment, each molded portion of the light sheet forms a separate part that is then singulated from the light sheet.
Abstract translation: 通过在柔性基板上印刷导体层和微观LED以平行地连接LED来形成初始平坦的光片。 然后对光片进行在光片中形成三维特征的成型工艺，例如任何形状的凸块。 特征可以被设计成产生期望的发光轮廓，增加光提取和/或创建图形图像。 在一个实施例中，形成集成的光片和触摸传感器，其中模制特征传送传感器的触摸位置。 在一个实施例中，将可固化树脂施加到光片以固定模制特征。 在另一个实施例中，光学特征被模制在平面光板上。 在另一个实施例中，光片的每个模制部分形成一个单独的部分，然后从光片中分离。
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公开(公告)号：US20140268591A1
公开(公告)日：2014-09-18
申请号：US14204800
申请日：2014-03-11
Applicant: Nthdegree Technologies Worldwide Inc.
Inventor： William Johnstone Ray , Richard Austin Blanchard , Mark David Lowenthal , Bradley Steven Oraw
CPC classification number: H01L24/95 , H01L21/563 , H01L23/3121 , H01L24/06 , H01L24/24 , H01L24/25 , H01L24/32 , H01L24/73 , H01L24/82 , H01L24/92 , H01L25/0655 , H01L25/072 , H01L25/0753 , H01L25/18 , H01L25/50 , H01L33/20 , H01L2221/68381 , H01L2224/06181 , H01L2224/24137 , H01L2224/25105 , H01L2224/25174 , H01L2224/32225 , H01L2224/73267 , H01L2224/82101 , H01L2224/82104 , H01L2224/82143 , H01L2224/92244 , H01L2224/95085 , H01L2224/95101 , H01L2224/95102 , H01L2224/95115 , H01L2224/95143 , H01L2224/95146 , H01L2924/10253 , H01L2924/12 , H01L2924/1203 , H01L2924/12041 , H01L2924/13 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/13062 , H01L2924/13091 , H05K1/029 , H05K1/0296 , H05K3/12
Abstract: A programmable circuit includes an array of printed groups of microscopic transistors or diodes. The devices are pre-formed and printed as an ink and cured. The devices in each group are connected in parallel so that each group acts as a single device. In one embodiment, about 10 devices are contained in each group so the redundancy makes each group very reliable. Each group has at least one electrical lead that terminates in a patch area on the substrate. An interconnection conductor pattern interconnects at least some of the leads of the groups in the patch area to create logic circuits for a customized application of the generic circuit. The groups may also be interconnected to be logic gates, and the gate leads terminate in the patch area. The interconnection conductor pattern then interconnects the gates for form complex logic circuits.
Abstract translation: 可编程电路包括微阵列晶体管或二极管的印刷组阵列。 这些装置被预先形成并印刷成油墨并固化。 每个组中的设备并联连接，以使每个组充当单个设备。 在一个实施例中，每个组中包含约10个设备，因此冗余使得每个组非常可靠。 每个组具有终止于衬底上的贴片区域中的至少一个电引线。 互连导体图案将贴片区域中的组的至少一些引线互连以产生用于通用电路的定制应用的逻辑电路。 这些组也可以互连成逻辑门，并且栅极引线终止于贴片区域。 然后，互连导体图案将形成复合逻辑电路的栅极互连。
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Patent Agency Ranking
公开(公告)号：US20140264460A1
公开(公告)日：2014-09-18
申请号：US14204886
申请日：2014-03-11
Applicant: Nthdegree Technologies Worldwide Inc.
Inventor： Richard Austin Blanchard
CPC classification number: H01L21/84 , H01L21/6835 , H01L24/05 , H01L24/06 , H01L24/24 , H01L24/25 , H01L24/32 , H01L24/73 , H01L24/82 , H01L24/92 , H01L24/95 , H01L24/97 , H01L25/0655 , H01L25/072 , H01L25/0753 , H01L25/50 , H01L27/12 , H01L33/20 , H01L2221/68327 , H01L2221/68381 , H01L2224/05552 , H01L2224/05555 , H01L2224/06051 , H01L2224/06181 , H01L2224/24137 , H01L2224/25105 , H01L2224/25174 , H01L2224/32225 , H01L2224/73267 , H01L2224/82104 , H01L2224/92244 , H01L2224/95085 , H01L2224/95101 , H01L2224/95115 , H01L2224/95144 , H01L2224/95145 , H01L2924/10253 , H01L2924/12041 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/13062 , H01L2924/13091 , H01L2924/00 , H01L2924/00014
Abstract: A layer of microscopic, 3-terminal transistors is printed over a first conductor layer so that bottom electrodes of the transistors electrically contact the first conductor layer. A first dielectric layer overlies the first conductor layer, and a second conductor layer over the first dielectric layer contacts intermediate electrodes on the transistors between the bottom electrodes and top electrodes. A second dielectric layer overlies the second conductor layer, and a third conductor layer over the second dielectric layer contacts the top electrodes. The devices are thus electrically connected in parallel by a combination of the first conductor layer, the second conductor layer, and the third conductor layer. Separate groups of the devices may be interconnected to form more complex circuits. The resulting circuit may be a very thin flex-circuit.
Abstract translation: 在第一导体层上印刷一层微观的3端子晶体管，使得晶体管的底部电极与第一导体层电接触。 第一电介质层覆盖在第一导体层上，第一电介质层上的第二导体层接触底电极和顶电极之间的晶体管上的中间电极。 第二电介质层覆盖在第二导体层上，第二电介质层上的第三导体层接触顶电极。 因此，这些器件通过第一导体层，第二导体层和第三导体层的组合而并联连接。 单独的设备组可以互连以形成更复杂的电路。 所得到的电路可能是非常薄的柔性电路。
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公开(公告)号：US20140264396A1
公开(公告)日：2014-09-18
申请号：US14206985
申请日：2014-03-12
Applicant: Nthdegree Technologies Worldwide Inc.
Inventor： Mark David Lowenthal , Jeffrey Baldridge
IPC: H01L33/08
CPC classification number: H01L33/08 , F21K9/00 , F21Y2103/10 , F21Y2115/10 , G02F1/133603 , H01L24/95 , H01L25/0753 , H01L33/62 , H01L2221/68381 , H01L2224/95085 , H01L2224/95101 , H01L2924/1033 , H01L2924/12041
Abstract: Ultra-thin flexible LED lamp layers are formed over a release layer on a substrate. The LED lamp layers include a first conductor layer overlying the release layer, an array of vertical light emitting diodes (VLEDs) printed over the first conductor layer, where the VLEDs have a bottom electrode electrically contacting the first conductor layer, and a second conductor layer overlying the VLEDs and contacting a top electrode of the VLEDs. Other layers may be formed, such as protective layers, reflective layers, and phosphor layers. The LED lamp layers are then peeled off the substrate, wherein the release layer provides a weak adherence between the substrate and the LED lamp layers to allow the LED lamp layers to be separated from the substrate without damage. The resulting LED lamp layers are extremely flexible, enabling the LED lamp layers to be adhered to flexible target surfaces including clothing.
Abstract translation: 超薄柔性LED灯层形成在基板上的剥离层上。 LED灯层包括覆盖剥离层的第一导体层，印刷在第一导体层上的垂直发光二极管阵列（VLED），其中VLED具有与第一导体层电接触的底部电极，以及第二导体层 覆盖VLED并接触VLED的顶部电极。 可以形成其它层，例如保护层，反射层和荧光体层。 然后将LED灯层从衬底上剥离，其中剥离层在衬底和LED灯层之间提供弱粘附，以允许LED灯层与衬底分离而不损坏。 所得到的LED灯层非常灵活，使得LED灯层能够粘附到包括衣服在内的柔性目标表面上。
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公开(公告)号：US20140254136A1
公开(公告)日：2014-09-11
申请号：US14183115
申请日：2014-02-18
Applicant: Nthdegree Technologies Worldwide Inc.
Inventor： Bradley Steven Oraw , Marc Oliver Meier
CPC classification number: F21V19/004 , A47F11/10 , F21S4/28 , F21V21/088 , F21W2131/305 , F21W2131/405 , F21Y2115/10 , F25D27/00
Abstract: A thin flexible light strip is formed by printing microscopic LEDs in rectangular sections along the light strip, where each rectangular section creates a vertically elongated emission profile. The light strip has a length approximately equal to the length of a shelf supporting products (e.g., bottles) to be illuminated. The shelf may be in a glass-door cooler in a store. Each section is located along the light strip to be centered with a product in the front row on the shelf. The light strip is supported by a plastic holder that attaches to the front of the shelf. The holder angles the light strip upward between 20-40 degrees, relative to vertical, to substantially uniformly illuminate each product equally. The holder may support an additional light strip that is angled downward toward products on a lower shelf.
Abstract translation: 通过在沿着光条的矩形部分中印刷微型LED来形成薄的柔性光条，其中每个矩形部分形成垂直细长的发射轮廓。 光条的长度大致等于待照明的搁板支撑产品（例如瓶）的长度。 货架可能在商店的玻璃门冷却器中。 每个部分沿着光条位于与货架前排中的产品对中。 灯带由附着在货架前部的塑料支架支撑。 支架将灯带向上相对于垂直方向在20-40度之间向上平衡地均匀地照射每个产品。 支架可以支撑向下倾斜的附加灯条，朝向下架上的产品。
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公开(公告)号：US20140240618A1
公开(公告)日：2014-08-28
申请号：US14186172
申请日：2014-02-21
Applicant: Nthdegree Technologies Worldwide Inc.
Inventor： Bradley Steven Oraw
CPC classification number: G06F3/044 , G06F2203/04103 , H01H2239/006
Abstract: A layer of microscopic printed VLEDs is sandwiched between a first conductor layer and a transparent second conductor layer so that light exits the second conductor layer. Touch sensor electrodes are formed overlying the VLED layer so that the VLEDs illuminate the touch sensor. In one embodiment, the touch sensor electrodes are independent from the conductor layers for the VLEDs. In another embodiment, the transparent second conductor layer also serves as a touch sensor electrode. In another embodiment, both the conductor layers for the VLEDs serve as touch sensor electrodes. The conductor layers for the VLEDs may be segmented in groups to selectively illuminate groups of the VLEDs under each touch sensor position. The touch sensor electrodes may be transparent or opaque, depending on whether the electrodes are intended to allow the VLED light to pass through.
Abstract translation: 在第一导体层和透明第二导体层之间夹有显微印刷的VLED层，使得光离开第二导体层。 触摸传感器电极形成在VLED层上方，以便VLED照亮触摸传感器。 在一个实施例中，触摸传感器电极独立于用于VLED的导体层。 在另一个实施例中，透明第二导体层还用作触摸传感器电极。 在另一个实施例中，VLED的导体层都用作触摸传感器电极。 用于VLED的导体层可以被分组成组，以在每个触摸传感器位置下选择性地照亮VLED的组。 根据电极是否允许VLED光通过，触摸传感器电极可以是透明或不透明的。
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200.发明申请YELLOW PHOSPHOR LAYER CONTAINING COLORED BEADS FOR ADJUSTING ITS PERCEIVED OFF-STATE COLOR 有权包含彩色珠粒的黄色磷光体层，用于调整其状态色彩公开(公告)号：US20140203316A1
公开(公告)日：2014-07-24
申请号：US14133029
申请日：2013-12-18
Applicant: Nthdegree Technologies Worldwide Inc.
Inventor： William J. Ray
IPC: H01L33/50
CPC classification number: H01L33/504 , H01L25/0753 , H01L2924/0002 , H01L2933/0091 , H05B33/14 , Y10T428/31507 , Y10T428/31663 , Y10T428/31786 , Y10T428/31935 , H01L2924/00
Abstract: LED dies, emitting blue light, are provided on a first support substrate to form a light emitting layer. A mixture of a transparent binder, yellow phosphor powder, magenta-colored glass beads, and cyan-colored glass beads is printed over the light emitting surface. The mixture forms a wavelength conversion layer when cured. The beads are sized so that the tops of the beads protrude completely through the conversion layer. When the LED dies are on, the combination of the yellow phosphor light and the blue LED light creates white light. When the LEDs are off, white ambient light, such as sunlight, causes the conversion layer to appear to be a mixture of yellow light, magenta light, and cyan light. The percentage of the magenta and cyan beads in the mixture is selected to create a desired off-state color, such as a neutral color, of the conversion layer for aesthetic purposes.
Abstract translation: 在第一支撑基板上设置发射蓝光的LED管芯，以形成发光层。 将透明粘合剂，黄色荧光体粉末，品红色玻璃珠和青色玻璃珠的混合物印刷在发光表面上。 混合物在固化时形成波长转换层。 珠的尺寸使得珠的顶部完全穿过转换层突出。 当LED管芯接通时，黄色荧光灯和蓝色LED灯的组合产生白光。 当LED熄灭时，诸如阳光的白色环境光使得转换层看起来是黄色光，品红色光和青色光的混合物。 选择混合物中品红色和青色珠的百分比以产生用于美学目的的转化层的期望的非状态颜色，例如中性色。
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