公开(公告)号：US09455241B2

公开(公告)日：2016-09-27

申请号：US14754230

申请日：2015-06-29

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yonggang Jin ,  Kiyoshi Kuwabara ,  Xavier Baraton

IPC: H01L23/00 ,  H01L21/48 ,  H01L21/683 ,  H01L23/498 ,  H01L23/538 ,  H01L21/311 ,  H01L21/56 ,  H01L21/768

CPC classification number: H01L24/83 ,  H01L21/311 ,  H01L21/4821 ,  H01L21/486 ,  H01L21/56 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/768 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/18 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/18 ,  H01L2224/2518 ,  H01L2224/8385 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00

Abstract: Aspects of the invention are directed towards an integrated circuit package and method of forming the same, and more particularly to a redistributed chip packaging for an integrated circuit. The integrated circuit package includes an integrated circuit having a protective material on at least a portion of the integrated circuit. A lead frame is coupled to the integrated circuit and a conductive layer is also coupled to the interconnect. A solder ball is coupled to the conductive layer and a passivation layer is on the conductive layer. Active and passive components are electrically coupled to the integrated circuit.

Abstract translation: 本发明的方面涉及一种集成电路封装及其形成方法，更具体地涉及用于集成电路的重新分配的芯片封装。 集成电路封装包括在集成电路的至少一部分上具有保护材料的集成电路。 引线框架耦合到集成电路，并且导电层也耦合到互连。 焊球与导电层耦合，钝化层位于导电层上。 有源和无源部件电耦合到集成电路。

公开(公告)号：US09437798B2

公开(公告)日：2016-09-06

申请号：US13929525

申请日：2013-06-27

Applicant: STMicroelectronics Pte Ltd.

Inventor： Olivier Le Neel ,  Suman Cherian ,  Calvin Leung ,  Ravi Shankar ,  Tien Choy Loh ,  Shian Yeu Kam

IPC: G01N27/327 ,  H01L35/34

CPC classification number: H01L35/34 ,  G01N27/3274 ,  Y10T29/49117

Abstract: A bio-fluid sensor is formed by depositing polyimide on a glass substrate. Gold and platinum are deposited on the polyimide and patterned to form fluid sensing electrodes, signal traces, and a temperature sensor. The fluid sensor is then fixed to a flexible tape and peeled off of the glass substrate.

Abstract translation: 通过在玻璃基板上沉积聚酰亚胺形成生物流体传感器。 金和铂沉积在聚酰亚胺上并图案化以形成流体感测电极，信号迹线和温度传感器。 然后将流体传感器固定到柔性带并从玻璃基板上剥离。

公开(公告)号：US09418920B2

公开(公告)日：2016-08-16

申请号：US14589094

申请日：2015-01-05

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Wing Shenq Wong

IPC: H01L23/495 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/29 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/49568 ,  H01L21/4825 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/32245 ,  H01L2224/48106 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/838 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/17738 ,  H01L2924/17763 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit (IC) package includes a die pad and an IC die secured on the die pad. The IC die had outer edges aligned with outer edges of the die pad. An encapsulating material body surrounds the die pad and IC die. Leads extend outwardly from the encapsulating material body and are coupled to the IC die. Each lead has an upper surface coplanar with an upper surface of the IC die. The die pad has a lower surface exposed through the encapsulating material body, and has a thickness greater than a thickness of each of the plurality of leads.

Abstract translation: 集成电路（IC）封装包括芯片焊盘和固定在裸片焊盘上的IC芯片。 IC芯片具有与芯片焊盘的外边缘对准的外边缘。 封装材料体围绕芯片焊盘和IC芯片。 引线从封装材料体向外延伸并耦合到IC管芯。 每个引线具有与IC芯片的上表面共面的上表面。 管芯焊盘具有通过封装材料体暴露的下表面，并且其厚度大于多个引线中的每一个的厚度。

公开(公告)号：US09379034B1

公开(公告)日：2016-06-28

申请号：US14585566

申请日：2014-12-30

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Kim-Yong Goh ,  Yiyi Ma ,  Xueren Zhang

IPC: H01L23/10 ,  H01L23/31 ,  H01L23/498 ,  H01L23/367 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L23/3135 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of making an electronic device may include positioning an integrated circuit (IC) die on an upper surface of a grid array substrate having connections on a lower surface thereof and coupling respective bond pads of the IC die to the grid array with bond wires. The method may also include forming a first encapsulating layer over the IC die and bond wires and positioning a heat spreader on the substrate above the first encapsulating layer after forming the first encapsulating layer. The method may further include forming a second encapsulating layer over the first encapsulating layer and embedding the heat spreader in the second encapsulating layer.

Abstract translation: 制造电子设备的方法可以包括将集成电路（IC）管芯定位在具有在其下表面上的连接的栅格阵列衬底的上表面上，并且将IC芯片的各个接合焊盘与接合线耦合到栅极阵列。 该方法还可以包括在IC芯片上方形成第一封装层，并且在形成第一封装层之后，将第一封装层上的基板上的散热器定位在第一封装层上方的基板上。 该方法还可以包括在第一封装层上形成第二封装层，并将散热器嵌入第二封装层中。

公开(公告)号：US09377678B2

公开(公告)日：2016-06-28

申请号：US14084773

申请日：2013-11-20

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Alan Lee ,  Xi Ge

IPC: G03F7/20 ,  G03F1/00 ,  G03F1/42

CPC classification number: G03F1/00 ,  G03F1/42 ,  G03F1/50 ,  G03F7/70283 ,  G03F7/70425

Abstract: A method of processing a semiconductor wafer may include providing a rotatably alignable photolithography mask that includes different mask images. Each mask image may be in a corresponding different mask sector. The method may also include performing a series of exposures with the rotatably alignable photolithography mask at different rotational alignments with respect to the semiconductor wafer so that the different mask images produce at least one working semiconductor wafer sector, and at least one non-working semiconductor wafer sector.

Abstract translation: 一种处理半导体晶片的方法可以包括提供包括不同掩模图像的可旋转对准的光刻掩模。 每个掩模图像可以在相应的不同的掩模扇区中。 该方法还可以包括使用相对于半导体晶片的不同旋转对准的可旋转对准的光刻掩模执行一系列曝光，使得不同的掩模图像产生至少一个工作半导体晶片扇区，以及至少一个非工作半导体晶片 部门。

公开(公告)号：US09234876B2

公开(公告)日：2016-01-12

申请号：US13853805

申请日：2013-03-29

Applicant: STMicroelectronics Pte Ltd.

Inventor： Olivier Le Neel ,  Ravi Shankar

IPC: G01N27/74

CPC classification number: H01L43/14 ,  G01N27/74 ,  H01L21/8234 ,  H01L43/04 ,  H01L43/065 ,  H01L43/10 ,  Y10T29/4913

Abstract: A miniature oxygen sensor makes use of paramagnetic properties of oxygen gas to provide a fast response time, low power consumption, improved accuracy and sensitivity, and superior durability. The miniature oxygen sensor disclosed maintains a sample of ambient air within a micro-channel formed in a semiconductor substrate. O2 molecules segregate in response to an applied magnetic field, thereby establishing a measureable Hall voltage. Oxygen present in the sample of ambient air can be deduced from a change in Hall voltage with variation in the applied magnetic field. The magnetic field can be applied either by an external magnet or by a thin film magnet integrated into a gas sensing cavity within the micro-channel. A differential sensor further includes a reference element containing an unmagnetized control sample. The miniature oxygen sensor is suitable for use as a real-time air quality monitor in consumer products such as smart phones.

Abstract translation: 微型氧传感器利用氧气的顺磁特性提供快速的响应时间，低功耗，提高的精度和灵敏度以及优异的耐久性。 所公开的微型氧传感器在半导体衬底中形成的微通道内保持环境空气样品。 O 2分子响应于施加的磁场而分离，从而建立可测量的霍尔电压。 环境空气样品中存在的氧气可以从施加磁场变化的霍尔电压变化推导出来。 磁场可以由外部磁体或集成到微通道内的气体感测腔中的薄膜磁体施加。 差分传感器还包括含有非磁化控制样品的参考元件。 微型氧传感器适用于智能手机等消费类产品中的实时空气质量监控。

公开(公告)号：US20150332995A1

公开(公告)日：2015-11-19

申请号：US14278458

申请日：2014-05-15

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Kim-Yong GOH ,  Wing Shenq Wong

IPC: H01L23/498 ,  H01L23/31 ,  H05K1/18

CPC classification number: H05K3/3426 ,  H01L23/13 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49555 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/1815 ,  H05K3/3436 ,  H05K2201/10515 ,  H05K2201/10757 ,  Y02P70/613 ,  Y10T29/49147 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An electronic device may include a surface mount integrated circuit (IC) package to be attached to a printed circuit board (PCB). The surface mount IC package may include at least one IC and an encapsulating material surrounding the at least one IC and having a component receiving cavity defined therein on a bottom surface thereof to be positioned adjacent the PCB. The surface mount IC package may also include electrical leads coupled to the at least one IC and extending outwardly from the encapsulating material to be coupled to the PCB. The electronic device may also include at least one electronic component carried within the component receiving cavity and that includes electrical contacts to be coupled to the PCB.

Abstract translation: 电子设备可以包括要附着到印刷电路板（PCB）的表面贴装集成电路（IC）封装。 表面安装IC封装可以包括至少一个IC和围绕至少一个IC的封装材料，并且在其底表面上具有限定在其中的部件容纳腔，以邻近PCB定位。 表面贴装IC封装还可以包括耦合到至少一个IC并从封装材料向外延伸以耦合到PCB的电引线。 电子设备还可以包括在部件接收腔内承载的至少一个电子部件，并且包括要联接到PCB的电触点。

公开(公告)号：US09140683B2

公开(公告)日：2015-09-22

申请号：US13285894

申请日：2011-10-31

Applicant: Suman Cherian ,  Olivier Le Neel

Inventor： Suman Cherian ,  Olivier Le Neel

IPC: G01N33/00 ,  G01N33/487

CPC classification number: G01N33/48785 ,  Y02B10/70 ,  Y10T436/143333 ,  Y10T436/144444 ,  Y10T436/172307 ,  Y10T436/184 ,  Y10T436/19 ,  Y10T436/204998 ,  Y10T436/205831

Abstract: A semiconductor die includes a chemical sensor, a digital to analog converter, and microcontroller formed therein. The chemical sensor detects the presence of a chemical and outputs an analog signal to the digital to analog converter. The analog to digital converter converts the analog signal to a digital signal. The analog to digital converter outputs the digital signal to the microcontroller. Microcontroller calculates a value of the concentration of the selected chemical.

Abstract translation: 半导体管芯包括化学传感器，数模转换器和形成在其中的微控制器。 化学传感器检测化学物质的存在，并将模拟信号输出到数模转换器。 模数转换器将模拟信号转换为数字信号。 模数转换器将数字信号输出到微控制器。 微控制器计算所选化学品的浓度值。

公开(公告)号：US20150253276A1

公开(公告)日：2015-09-10

申请号：US14200828

申请日：2014-03-07

Applicant: STMicroelectronics Pte Ltd.

Inventor： Olivier Le Neel ,  Suman Cherian ,  Calvin Leung

IPC: G01N27/327 ,  A61B5/1473

CPC classification number: A61B5/1473 ,  A61B5/14532 ,  A61B5/1468 ,  G01N27/3272

Abstract: A universal electrochemical micro-sensor can be used either as a biosensor or an environmental sensor. Because of its small size and flexibility, the micro-sensor is suitable for continuous use to monitor fluids within a live subject, or as an environmental monitor. The micro-sensor can be formed on a reusable glass carrier substrate. A flexible polymer backing, together with a set of electrodes, forms a reservoir that contains an electrolytic fluid chemical reagent. During fabrication, the glass carrier substrate protects the fluid chemical reagent from degradation. A conductive micromesh further contains the reagent while allowing partial exposure to the ambient biological or atmospheric environment. The micromesh density can be altered to accommodate fluid reagents having different viscosities. Flexibility is achieved by attaching a thick polymer tape and peeling away the micro-sensor from the glass carrier substrate. The final structure is thereby transferred to the polymer tape, providing a flexible product.

Abstract translation: 通用电化学微传感器可用作生物传感器或环境传感器。 由于其微小的尺寸和灵活性，微型传感器适用于连续使用，以监测活体内的流体，或作为环境监测器。 微传感器可以形成在可重复使用的玻璃载体基板上。 柔性聚合物背衬与一组电极一起形成包含电解液化学试剂的储存器。 在制造过程中，玻璃载体衬底保护流体化学试剂不被降解。 导电微胶粒还含有试剂，同时允许部分暴露于环境生物或大气环境。 可以改变微孔密度以适应具有不同粘度的流体试剂。 柔性通过附加厚的聚合物带并将微传感器从玻璃载体基底上剥离来实现。 由此将最终结构转移到聚合物带上，提供柔性产品。

公开(公告)号：US20150137148A1

公开(公告)日：2015-05-21

申请号：US14083102

申请日：2013-11-18

Applicant: STMicroelectronics Pte Ltd.

Inventor： Wing Shenq Wong

IPC: H01L25/16

CPC classification number: H01L25/167 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/16151 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to an optical package that includes a stacked arrangement with a plurality of optical devices arranged over an image sensor processor die that is coupled to a first substrate. Between the two optical devices and the image sensor processor die there is provided at least a second substrate. In one embodiment, the optical package is a proximity sensor package and the optical devices include a light-emitting diode die and a light-receiving diode die. In one embodiment, the light-emitting diode die is secured to a surface of the second substrate and the light-receiving diode die is secured to a surface of a third substrate. The second and the third substrate may be secured to a surface of the image sensor processor die or to a surface of encapsulation material.

Abstract translation: 一个或多个实施例涉及用于光学装置的包装系统（SiP），包括接近传感器封装。 一个实施例涉及一种光学封装，其包括具有布置在耦合到第一衬底的图像传感器处理器裸片上的多个光学器件的堆叠布置。 在两个光学器件和图像传感器处理器管芯之间提供至少第二衬底。 在一个实施例中，光学封装是接近传感器封装，并且光学器件包括发光二极管管芯和光接收二极管管芯。 在一个实施例中，发光二极管管芯固定到第二衬底的表面，并且光接收二极管管芯固定到第三衬底的表面。 第二和第三基板可以固定到图像传感器处理器管芯的表面或者封装材料的表面。