PRE-TREATMENT METHOD FOR PLATING AND STORAGE MEDIUM
    223.
    发明申请
    PRE-TREATMENT METHOD FOR PLATING AND STORAGE MEDIUM 有权
    用于镀层和储存介质的预处理方法

    公开(公告)号:US20150140816A1

    公开(公告)日:2015-05-21

    申请号:US14548794

    申请日:2014-11-20

    Abstract: Catalytic metal nanoparticles can be attached on a base. A pre-treatment method for plating includes a catalytic particle-containing film forming process of forming a catalytic particle-containing film on a surface of a substrate by supplying, onto the substrate, a catalytic particle solution which is prepared by dispersing the catalytic metal nanoparticles and a dispersing agent in a solvent containing water; a first heating process of removing moisture contained at least in the catalytic particle-containing film by heating the substrate to a first temperature; and a second heating process of polymerizing the dispersing agent to have a sheet shape by heating the substrate to a second temperature higher than the first temperature after the first heating process and fixing the catalytic metal nanoparticles on a base layer by covering the catalytic metal nanoparticles with the sheet-shaped dispersing agent.

    Abstract translation: 催化金属纳米颗粒可以附着在基底上。 电镀用预处理方法包括:在基板表面上形成含催化剂颗粒膜的催化剂颗粒膜成膜方法,该方法是向基板上提供通过分散催化金属纳米粒子制备的催化剂颗粒溶液 和分散剂在含有水的溶剂中; 通过将基板加热至第一温度来除去至少含有催化剂颗粒的膜中含有的水分的第一加热方法; 以及通过将基板加热至高于第一加热处理后的第一温度的第二温度并将分散剂聚合成具有片状的第二加热方法,并且通过用催化金属纳米粒子覆盖催化金属纳米颗粒而将催化金属纳米颗粒固定在基底层上 片状分散剂。

    ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS
    230.
    发明申请
    ADHESION PROMOTION IN PRINTED CIRCUIT BOARDS 有权
    印刷电路板中的粘合促进

    公开(公告)号:US20140030425A1

    公开(公告)日:2014-01-30

    申请号:US13558019

    申请日:2012-07-25

    Abstract: Compositions and methods for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. Conditioning compositions contain a functional organic compound and preferably a transition metal ion. The functional organic compound, e.g., a purine derivative, is capable of forming a self-assembled monolayer. Adhesion promoting compositions contain an acid, preferably an inorganic acid, and an oxidant. The latter compositions may also contain a corrosion inhibitor and/or a transition metal ion selected from among Zn, Ni, Co, Cu, Ag, Au, Pd or another Pt group metal. The corrosion inhibitor may comprise a nitrogen-containing aromatic heterocyclic compound.

    Abstract translation: 用于在制造印刷电路板期间增强铜导电层和电介质材料之间的粘附性的组合物和方法。 调理组合物含有功能性有机化合物,优选过渡金属离子。 功能性有机化合物,例如嘌呤衍生物,能够形成自组装单层。 粘合促进组合物含有酸,优选无机酸和氧化剂。 后一种组合物还可以含有选自Zn,Ni,Co,Cu,Ag,Au,Pd或其它Pt族金属中的腐蚀抑制剂和/或过渡金属离子。 腐蚀抑制剂可以包含含氮芳族杂环化合物。

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