公开(公告)号：US5109269A

公开(公告)日：1992-04-28

申请号：US726780

申请日：1991-07-08

Applicant: Ofer Holzman

Inventor： Ofer Holzman

IPC: H05K3/34 ,  H05K3/40 ,  H05K13/04

CPC classification number: H05K3/341 ,  H05K13/046 ,  H05K3/3426 ,  H05K2201/09663 ,  H05K2201/09781 ,  H05K2201/1028 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10931 ,  H05K2201/10962 ,  H05K2201/10969 ,  H05K2203/048 ,  H05K3/4015 ,  Y02P70/613 ,  Y10S269/903 ,  Y10T29/49144

Abstract: An SMT electronic component is mounted to a solder-bearing floatation plate by fusible or other heat-responsive releasable mounting means which suspend the component above the floatation plate. The bottom of the floatation plate is effectively substantially the mirror image of a component-positioning pad formed on the board surface adjacent the solder-bearing contact pads corresponding to the electrical contacts on the component. In the assembly process, the floatation plate is placed on the positioning pad. The solder on the bottom of the floatation plate has a melting point lower than the release temperature of the mounting means and the melting point of the solder on the contact pads. With the floatation plate on the component-positioning pad, on heating the solder on the floatation plate liquifies first, wetting the component-positioning pad and floating the floatation plate and component on a thin film of molten solder. Surface tension forces bring the floatation plate into registry with the component-positioning pad. On further heating, the solder on the contact pads liquifies, and the heat-responsive mounting means allows the component to fall freely onto the contact pads. Guide means are provided to prevent rotational and lateral displacement of the component during the fall. The disclosure includes alternative floatation plate constructions and component mounting arrangements.

Abstract translation: SMT电子部件通过可熔或其它热响应的可释放的安装装置安装到焊料浮动板上，该安装装置将浮动板上方的部件悬挂。 漂浮板的底部基本上是形成在板表面上的与形成在组件上的电触点对应的焊料支承接触垫相邻的部件定位焊盘的镜像。 在组装过程中，将浮选板放置在定位垫上。 浮选板底部的焊料的熔点低于安装装置的释放温度和接触焊盘上焊料的熔点。 通过浮动板在组件定位垫上，加热漂浮板上的焊料首先液化，润湿组件定位垫，并将浮选板和组件浮在熔融焊料薄膜上。 表面张力使浮板与元件定位垫对准。 在进一步加热时，接触焊盘上的焊料液化，并且热响应安装装置允许部件自由落入接触焊盘。 提供引导装置以防止部件在坠落期间的旋转和横向位移。 本公开包括替代的漂浮板结构和部件安装布置。

公开(公告)号：US4630174A

公开(公告)日：1986-12-16

申请号：US546990

申请日：1983-10-31

Applicant: Lance R. Kaufman

Inventor： Lance R. Kaufman

IPC: H01L23/495 ,  H01L25/07 ,  H05K3/32 ,  H05K3/34 ,  H05K1/18

CPC classification number: H05K3/325 ,  H01L23/49541 ,  H01L23/49575 ,  H01L25/072 ,  H01L2924/0002 ,  H05K2201/10409 ,  H05K2201/10659 ,  H05K2201/10924 ,  H05K2201/10946 ,  H05K3/3447

Abstract: A circuit package 2 is provided for heat dissipating power semiconductors and the like. Circuit means 10, including lead frames 12 and power conditioning components 13, is mounted on an electrically insulating thermally conductive substrate 4 and covered by an electrically insulating housing 6. Power lead frames 14 extend integrally externally of the housing 6 and have external portions 22 bent laterally across the to surface of the housing 6 to cooperate with terminal connection means 28 there below in the top wall 24 of the housing 6. Internal connection means 50 is provided for selectively connecting a peripheral power lead frame portion 46 to a central portion 52 of circuit means 10 and insulatively bypassing designated portions 54 of circuit means 10 therebetween. In one embodiment, circuit package 2 is provided in combination with an external printed circuit board 40 extending across the top surface 24 of the housing and connected to control lead frames 18 and power lead frames 14.

Abstract translation: 为散热功率半导体等提供电路封装2。 包括引线框架12和功率调节部件13的电路装置10安装在电绝缘导热基板4上并被电绝缘壳体6覆盖。电源引线框架14在壳体6的外部整体延伸，并且外部部分22弯曲 横向跨过壳体6的表面，以与下面的端子连接装置28在壳体6的顶壁24中配合。内部连接装置50用于选择性地将外围电源引线框架部分46连接到壳体6的中心部分52 电路装置10并且间隔地旁路电路装置10的指定部分54。 在一个实施例中，电路封装2与外部印刷电路板40组合提供，该外部印刷电路板40延伸穿过壳体的顶表面24并连接到控制引线框架18和电源引线框架14。

公开(公告)号：US4577923A

公开(公告)日：1986-03-25

申请号：US593614

申请日：1984-03-26

Applicant: Hiroshi Ikemizu

Inventor： Hiroshi Ikemizu

IPC: H01L23/66 ,  H05K1/02 ,  H05K3/34 ,  H01R4/02

CPC classification number: H05K3/3447 ,  H01L23/66 ,  H05K1/0243 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K2201/09809 ,  H05K2201/10371 ,  H05K2201/10606 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10818 ,  H05K2201/10871 ,  H05K2201/10969 ,  H05K2203/1147 ,  H05K2203/1178

Abstract: A microwave integrated circuit includes a mounting device surrounding a lead adapted to be electrically connected to a circuit board. The mounting device comprises electrically conductive material spaced from the lead to form a coaxial structure suitable for microwave operation. Apertures, grooves, or the like extend from the space defined between the mounting device and the lead to the outside of the mounting device to provide an exit for a flux gas evolved during soldering of the microwave integrated circuit to a circuit board. The mounting device may exist separately from the microwave integrated circuit.

Abstract translation: 微波集成电路包括围绕引线的安装装置，其适于电连接到电路板。 安装装置包括与引线隔开的导电材料以形成适于微波操作的同轴结构。 孔，凹槽等从限定在安装装置和引线之间的空间延伸到安装装置的外部，以提供在将微波集成电路焊接到电路板期间放出的焊剂气体的出口。 安装装置可以与微波集成电路分开存在。

公开(公告)号：US4377316A

公开(公告)日：1983-03-22

申请号：US238873

申请日：1981-02-27

Applicant: Mario E. Ecker ,  Leonard T. Olson

Inventor： Mario E. Ecker ,  Leonard T. Olson

IPC: H01L23/32 ,  H01L21/48 ,  H01L23/12 ,  H01L23/498 ,  H01L23/52 ,  H01L23/538 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K1/18

CPC classification number: H05K3/303 ,  H01L21/486 ,  H01L23/4985 ,  H01L23/5384 ,  H05K3/363 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/16152 ,  H05K1/0206 ,  H05K1/113 ,  H05K1/141 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09572 ,  H05K2201/10659 ,  H05K2201/10666 ,  H05K2201/10681 ,  H05K2201/10727 ,  H05K2201/10878 ,  H05K2201/2036 ,  H05K2203/043 ,  H05K3/308 ,  H05K3/3447 ,  H05K3/3452 ,  H05K3/3457 ,  Y02P70/613

Abstract: A system for connecting a semiconductor chip carrier to a printed circuit card is described. The semiconductor chip carrier has a flexible, extendable wiring membrane attached to the bottom thereof which extends beyond the periphery of the semiconductor chip carrier and in the area beyond the periphery is provided with electrical contacts. The electrical contacts are mated to complementary contacts in a printed circuit card which is biased from the semiconductor chip carrier by electrical and thermal contact means. The membrane, inter alia, provides high density electrical contact between the semiconductor and printed circuit card. Various elements thereof and a process for forming the same are described.

Abstract translation: 描述了用于将半导体芯片载体连接到印刷电路卡的系统。 半导体芯片载体具有附接到其底部的柔性的可延伸的布线膜，其延伸超出半导体芯片载体的周边，并且在超过外围的区域中设置有电触点。 电触点与印刷电路卡中的互补触点配合，印刷电路卡通过电接触和热接触装置从半导体芯片载体偏置。 该膜尤其在半导体和印刷电路卡之间提供了高密度的电接触。 对其各种要素及其形成方法进行说明。

公开(公告)号：US4254447A

公开(公告)日：1981-03-03

申请号：US28875

申请日：1979-04-10

Applicant: Patrick D. Griffis

Inventor： Patrick D. Griffis

IPC: H01L23/36 ,  H01L23/367 ,  H01L23/40 ,  H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0203 ,  H01L23/3672 ,  H01L23/4093 ,  H01L2924/0002 ,  H05K2201/066 ,  H05K2201/10659 ,  H05K2201/10689

Abstract: An integrated circuit heat dissipator is provided which will additionally hold the integrated circuit in a printed circuit board prior to soldering. The heat dissipator is comprised of a single elastic piece of metallic material having oppositely facing sides joined by a fold at the top. A tab is located at the bottom of each of the sides which is suitable for insertion into a printed circuit board. The tabs have a width which allows them to contact only the heat-conducting pins of the integrated circuit. The heat dissipator is mounted adjacent to the integrated circuit with one of the tabs contacting the heat-conducting pins. The elastic material gives the heat dissipator a spring-like property which causes the tabs to press outwardly from each other when inserted in a board so as to fixedly hold the heat dissipator and the integrated circuit in the printed circuit board prior to soldering.

Abstract translation: 提供集成电路散热器，其在焊接之前将集成电路另外保持在印刷电路板中。 散热器由单一的金属材料弹性件组成，具有在顶部由折叠面相对的相对侧。 每个侧面的底部都有一个凸片，适用于插入印刷电路板。 突片具有允许它们仅接触集成电路的导热引脚的宽度。 散热器靠近集成电路安装，其中一个接头与导热销接触。 弹性材料使得散热器具有类似弹簧的特性，当插入板中时突片彼此向外挤压，以便在焊接之前将散热器和集成电路固定在印刷电路板中。

公开(公告)号：US3628105A

公开(公告)日：1971-12-14

申请号：US3628105D

申请日：1969-02-26

Applicant: HITACHI LTD

Inventor： SAKAI KANAME ,  MASAKI AKIRA

IPC: H01L23/04 ,  H01L23/495 ,  H01L23/50 ,  H01L23/66 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H05K3/40 ,  H01L11/00 ,  H01L15/00

CPC classification number: H01L23/49534 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0243 ,  H05K1/182 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/4046 ,  H05K2201/0715 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10969 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A semiconductor integrated circuit means comprising a semiconductor substrate having a plurality of circuit elements formed therein and a package enclosing said substrate, wherein the wires for leading out the electrodes of said circuit elements from said package are formed of strip lines and the grounded conductor for said strip lines is made of a common metal plate.