公开(公告)号：US20070106831A1

公开(公告)日：2007-05-10

申请号：US11378389

申请日：2006-03-20

Applicant: Shan-Kai Yang ,  Lei Ding

Inventor： Shan-Kai Yang ,  Lei Ding

IPC: G06F13/36

CPC classification number: H05K3/222 ,  H05K1/141 ,  H05K2201/10325 ,  H05K2201/10704 ,  H05K2201/10719

Abstract: A computer system includes a bridge module plugged in a processor socket of a motherboard with multiple processors. The bridge module electrically connects two buses which have the same transmission protocol and connect to the socket. Thus, two processors or a processor and a chip set would communicate each other by the bridge module and the two buses without installing any processors or additional buses.

Abstract translation: 计算机系统包括插入具有多个处理器的主板的处理器插座中的桥模块。 桥模块电连接两个具有相同传输协议并连接到插座的总线。 因此，两个处理器或处理器和芯片组将通过桥模块和两个总线彼此通信，而不安装任何处理器或附加总线。

公开(公告)号：US07167379B2

公开(公告)日：2007-01-23

申请号：US10428202

申请日：2003-04-30

Applicant: Joseph T. DiBene, II ,  Edward J. Derian

Inventor： Joseph T. DiBene, II ,  Edward J. Derian

IPC: H01R12/16

CPC classification number: H05K7/1092 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L2924/15192 ,  H05K1/141 ,  H05K3/368 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704

Abstract: An assembly includes an electronic assembly with a microprocessor coupled to a power conversion assembly via a compliant conductor assembly. The compliant conductor assembly includes a plurality of spring conductors mounted in a carrier. Selected ones of the spring conductors are electromagnetically coupled with others of the spring conductors. Additionally, each spring conductor provides multiple conductive paths.

Abstract translation: 组件包括具有微处理器的电子组件，该微处理器通过柔性导体组件耦合到功率转换组件。 柔性导体组件包括安装在载体中的多个弹簧导体。 所选择的弹簧导体与其他弹簧导体电磁耦合。 另外，每个弹簧导体提供多个导电路径。

公开(公告)号：US07148428B2

公开(公告)日：2006-12-12

申请号：US10950827

申请日：2004-09-27

Applicant: Pascal C. H. Meier ,  Sanjay Dabral

Inventor： Pascal C. H. Meier ,  Sanjay Dabral

IPC: H05K1/16

CPC classification number: G06F1/189 ,  G06F1/184 ,  G06F1/185 ,  G06F1/186 ,  H01R12/79 ,  H05K1/14 ,  H05K1/147 ,  H05K3/222 ,  H05K3/305 ,  H05K2201/044 ,  H05K2201/10356 ,  H05K2201/10492 ,  H05K2201/10704 ,  H05K2201/2027 ,  Y10T29/49117

Abstract: A system and method are disclosed in which flex cables are affixed to PCBs, for providing high-speed signaling paths between ICs disposed upon the PCBs. The flex cables are fixably attached to the PCBs so as to substantially mimic their structural orientation. Where the configuration includes more than one PCB, the flex cables include multiple portions which are temporarily separable from one another and from the die, using flex-to-flex and flex-to-package connectors, allowing field maintenance of the configuration. By routing the high-speed signals between ICs onto the flex cable, single-layer PCBs can be used for non-critical and power delivery signals, at substantial cost savings. By disposing the flex cables onto the PCB rather than allowing the cables to float freely, the configuration is thermally managed as if the signals were on the PCB and cable routing problems are avoided.

Abstract translation: 公开了一种系统和方法，其中柔性电缆固定到PCB上，用于在布置在PCB上的IC之间提供高速信号路径。 柔性电缆可固定地连接到PCB，以便基本模拟其结构取向。 在配置包括多于一个PCB的情况下，柔性电缆包括可以使用柔性到柔性和挠性 - 包装连接器彼此临时分离和从模具临时分离的多个部分，从而允许现场维护配置。 通过将IC之间的高速信号路由到柔性电缆上，单层PCB可以用于非关键和电力传输信号，从而节省了大量成本。 通过将柔性电缆布置在PCB上，而不是允许电缆自由浮动，该配置将被热管理，就像信号在PCB上一样，避免了电缆布线问题。

公开(公告)号：US07145782B2

公开(公告)日：2006-12-05

申请号：US10892804

申请日：2004-07-16

Applicant: Damion Searls ,  Edward Osburn

Inventor： Damion Searls ,  Edward Osburn

IPC: H05K7/06 ,  H01L23/48

CPC classification number: H01L23/49844 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/1531 ,  H01L2924/19106 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/0262 ,  H05K1/181 ,  H05K2201/1006 ,  H05K2201/10166 ,  H05K2201/10325 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2201/10704 ,  Y10T29/4913 ,  Y10T29/49147 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

Abstract: In one embodiment, the present invention includes a method of mounting a semiconductor device to a first side of a circuit board; and mounting at least one voltage regulator device to a second side of the circuit board, the second side opposite to the first side. The voltage regulator devices may be output filters, inductors, capacitors, and the like. In certain embodiments, the devices may be located directly underneath the semiconductor device.

公开(公告)号：US20060240684A1

公开(公告)日：2006-10-26

申请号：US11377301

申请日：2006-03-17

Applicant: Wen-Chang Chang

Inventor： Wen-Chang Chang

IPC: H01R12/00

CPC classification number: H01R13/2442 ,  B23K1/0016 ,  H01R43/0249 ,  H05K3/3421 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/10189 ,  H05K2201/10704 ,  Y02P70/613

Abstract: A method to solder two electronic devices to each other to maintain good electricity conduction between both devices; one device being disposed with multiple pin-shaped soldering ends, another device being disposed with multiple soldering holes, and solder in relation to each hole; the soldering end being inserted into the hole and soldered by heating to melt the solder; and a circuit board disposed with multiple holes with each containing a soldering portion and solder in relation to each hole.

Abstract translation: 一种将两个电子设备彼此焊接以保持两个设备之间良好的电传导的方法; 一个装置设置有多个销状焊接端，另一个装置设置有多个焊接孔，并且焊接相对于每个孔; 焊接端插入孔中并通过加热焊接以熔化焊料; 以及设置有多个孔的电路板，每个孔相对于每个孔包含焊接部分和焊料。

公开(公告)号：US20060205243A1

公开(公告)日：2006-09-14

申请号：US11372798

申请日：2006-03-10

Applicant: Katsuhiko Sakamoto ,  Noriharu Kurokawa

Inventor： Katsuhiko Sakamoto ,  Noriharu Kurokawa

IPC: H01R12/00

CPC classification number: H01R13/2414 ,  H05K1/0306 ,  H05K1/141 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/049 ,  H05K2201/10318 ,  H05K2201/10704

Abstract: A pitch converting connector is equipped with a ceramic circuit board, formed by a plurality of ceramic green sheets, which are stacked in the thickness direction thereof and sintered. A plurality of conductive paths are formed on a surface of each ceramic green sheet, such that they are provided at a narrow pitch at a first end of the ceramic green sheet, and widen to a wide pitch at a second end thereof. Electrodes are formed on the conductive paths, which are exposed at the first and second ends of the ceramic circuit board.

Abstract translation: 间距转换连接器配备有陶瓷电路板，陶瓷电路板由多个在其厚度方向堆叠并烧结的陶瓷生片形成。 在陶瓷生片的表面上形成多个导电路径，使得它们在陶瓷生片的第一端处以窄的间距设置，并且在其第二端处变宽到较宽的间距。 电极形成在导电路径上，其暴露在陶瓷电路板的第一和第二端。

公开(公告)号：US07095619B2

公开(公告)日：2006-08-22

申请号：US10383028

申请日：2003-02-25

Applicant: Augusto P. Panella ,  John E. Lopata ,  James L. McGrath ,  Arindum Dutta

Inventor： Augusto P. Panella ,  John E. Lopata ,  James L. McGrath ,  Arindum Dutta

IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC classification number: H05K1/0262 ,  H05K1/141 ,  H05K2201/10189 ,  H05K2201/10325 ,  H05K2201/10545 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734

Abstract: A processor mounted to a circuit board is provided with regulated voltage through lower-inductance circuit board traces by mounting a voltage regulator module for the processor, on the side of the circuit opposite to the processor. Current from the voltage regulator is provided to the processor by way of one or more conductors between the regulator and processor that extend through the circuit board from one side to the other. Inductance attributable to lead length is reduced by locating the voltage regulator close to its load. Circuit board space on the processor side of the circuit board is increased by moving the voltage regulator to the opposite side.

公开(公告)号：US20060171131A1

公开(公告)日：2006-08-03

申请号：US11339582

申请日：2006-01-26

Applicant: Yueh-Chih Chen ,  Kai-Shun Chang

Inventor： Yueh-Chih Chen ,  Kai-Shun Chang

IPC: H05K7/10

CPC classification number: H05K7/1092 ,  H05K1/141 ,  H05K2201/049 ,  H05K2201/10325 ,  H05K2201/10704

Abstract: An adapter module is described. The adapter module includes a circuit board, a first socket and an adapter device. One face of the first socket is electrically connected to the circuit board on the first face of the circuit. The other face of the first socket connects to a first central processing unit (CPU). One face of the adapter base is electrically connected to the circuit board on the second face of the circuit board. The other face of the adapter base connects to a second socket. The circuit board sends signals from the second socket, through the adapter base and the first socket, to the first CPU. When the adapter base is not connected to the second socket, the second socket is capable of connecting to a second kind of CPU.

公开(公告)号：US20060115975A1

公开(公告)日：2006-06-01

申请号：US11163094

申请日：2005-10-05

Applicant: Shao-Tsu Kung ,  Chen-Hua Liu

Inventor： Shao-Tsu Kung ,  Chen-Hua Liu

IPC: H01L21/44

CPC classification number: H05K3/303 ,  H05K1/0218 ,  H05K3/3436 ,  H05K2201/09781 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49169 ,  Y10T29/49179

Abstract: A method for attaching an IC package to a circuit board, the IC package having a plurality of electrical contacts in an arrangement having a perimeter, first positions the IC package adjacent to the circuit board. Then, electrically connects the IC package to the circuit board through the plurality of electrical contacts. The method finally, disposes at least one anchor mechanically attaching the IC package to the circuit board, the anchor disposed at a location outside of the perimeter of the plurality of electrical contacts. The type, quantity, and exact geometry of the anchors depend on the specific design parameters of the IC package and circuit board.

Abstract translation: 一种用于将IC封装安装到电路板的方法，所述IC封装具有具有周边的布置的多个电触点，首先将IC封装定位成与电路板相邻。 然后，通过多个电触点将IC封装与电路板电连接。 该方法最终将至少一个锚定装置将IC封装机械地附接到电路板，该锚固件设置在多个电接触件的外围的位置。 锚的类型，数量和精确几何取决于IC封装和电路板的具体设计参数。

公开(公告)号：US06963494B2

公开(公告)日：2005-11-08

申请号：US10461840

申请日：2003-06-13

Applicant: Scott Keith Mickievicz ,  John Edward Knaub

Inventor： Scott Keith Mickievicz ,  John Edward Knaub

IPC: H05K1/11 ,  H05K3/34 ,  H05K3/46 ,  H05K1/14

CPC classification number: H05K3/4623 ,  H05K1/112 ,  H05K3/3421 ,  H05K3/4614 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/10704

Abstract: Tails (20) projecting from an electrical component (12) that lies on a circuit board surface, are terminated to traces on a multi-layer circuit board (14) in a manner that minimizes the disadvantages of long through hole soldering and of surface mount techniques. A blind hole is drilled and plated in a first layer (31) that will become the topmost layer of the stack, to form a shallow well (70). The well is filled with a soldering composition (130). A tail (20) is projected downward into the soldering composition, and the soldering composition is heated to solder the tail to the hole plating.

Abstract translation: 从位于电路板表面的电气部件（12）突出的尾部（20）以多层电路板（14）的迹线端接，以最小化长通孔焊接和表面安装的缺点 技术 钻一个盲孔并镀在将成为堆叠的最上层的第一层（31）中以形成浅井（70）。 该井装有焊接组合物（130）。 尾部（20）向下突出到焊接组合物中，并且焊接组合物被加热以将尾部焊接到孔镀层。