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公开(公告)号：US5206795A
公开(公告)日：1993-04-27
申请号：US814645
申请日：1991-12-30
Applicant: Thomas D. Belanger, Jr.
Inventor： Thomas D. Belanger, Jr.
Abstract: An electrical substrate including a flexible printed circuit mounted on the substrate arranged to provide electrical contact between the flexible printed circuit and circuit contacts on an associated carrier substrate. Portions of the flexible printed circuit extended from the top surface of the electrical substrate to the bottom of the substrate by way of recesses included in the geometry of the electrical substrate. Portions of the flexible printed circuit are folded under the bottom side of the electrical substrate and fastened thereto by some compliant material. Properly positioned, electrical contact is established between the flexible printed circuit and circuit contacts on the carrier substrate.
Abstract translation: 一种电气基板，包括安装在基板上的柔性印刷电路，布置成在柔性印刷电路和相关联的载体基板上的电路触点之间提供电接触。 柔性印刷电路的部分通过包括在电气基板的几何形状中的凹槽从电气基板的顶表面延伸到基板的底部。 柔性印刷电路的一部分折叠在电气基板的底部下方并由一些柔性材料固定在其上。 在柔性印刷电路和载体基板上的电路触点之间建立正确定位的电接触。
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公开(公告)号：US4901193A
公开(公告)日：1990-02-13
申请号：US082514
申请日：1987-08-07
Applicant: Seiichi Kinugawa , Seio Kainoh , Takashi Kawashima , Katsumi Okabe
Inventor： Seiichi Kinugawa , Seio Kainoh , Takashi Kawashima , Katsumi Okabe
CPC classification number: H05K3/0061 , H01H13/702 , H01H2229/034 , H01H2229/038 , H01H2239/008 , H01H2239/01 , H01H2239/018 , H05K1/0254 , H05K1/0393 , H05K2201/0367 , H05K2201/056 , H05K2201/09063
Abstract: An electronic apparatus including a flexible circuit board, with an electric wiring pattern, having an opening therein, an a supporter for supporting the flexible circuit board, the supporter being provided with an least one protruding member, wherein the protruding member is inserted into the opening of the flexible circuit board, so that the flexible circuit board with the wiring pattern is folded over both sides of said supporter means.
Abstract translation: 一种电子设备，包括具有电路布线图案的柔性电路板，其中具有开口，支撑柔性电路板的支撑件，支撑件设置有至少一个突出构件，其中突出构件插入到开口 的柔性电路板，使得具有布线图案的柔性电路板在所述支撑装置的两侧折叠。
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公开(公告)号：US3805213A
公开(公告)日：1974-04-16
申请号：US23686772
申请日：1972-03-22
Applicant: DATA GENERAL CORP
Inventor： AUSTIN J
CPC classification number: H01R12/77 , H05K1/117 , H05K1/118 , H05K3/0058 , H05K2201/056 , H05K2201/09063 , H05K2201/10189 , H05K2201/2009 , H05K2203/167
Abstract: A flexible circuit edge connector in which two sets of connector elements in a flexible circuit member are bonded to opposite sides of an edge of a rigid member so as to be independently connectible to circuit leads on the same side of the flexible circuit member.
Abstract translation: 柔性电路边缘连接器，其中柔性电路部件中的两组连接器元件结合到刚性部件的边缘的相对侧，以便可独立地连接到柔性电路部件的同一侧的电路引线。
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公开(公告)号：US3113248A
公开(公告)日：1963-12-03
申请号：US4262860
申请日：1960-07-13
Applicant: SPERRY RAND CORP
Inventor： JOSEPH FRIEDMAN
CPC classification number: H05K1/189 , H05K1/0289 , H05K1/141 , H05K1/147 , H05K3/3447 , H05K3/361 , H05K2201/056 , H05K2201/09418 , H05K2201/10515 , H05K2201/10704 , H05K2203/1311
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公开(公告)号：US12127430B2
公开(公告)日：2024-10-22
申请号：US17589872
申请日：2022-01-31
Applicant: Meta Platforms Technologies, LLC
Inventor： Giti Karimi Moghaddam , Douglas Moskowitz , Kyung Won Park , Ryan Fleming , Alexander Klement , Donghee Nam , Yi-Chen Kuo , Mark Shintaro Ando
CPC classification number: H10K50/87 , H01L25/18 , H05K1/0204 , H05K1/189 , H05K7/20972 , H05K7/2099 , H05K2201/056 , H05K2201/10128 , H05K2201/10159 , H05K2201/2036
Abstract: A device includes a micro-organic light emitting diode (μ-OLED) display panel and an electronic component. An electrical connector electrically couples the μ-OLED display panel and the electronic component. A standoff is disposed between the electronic component and the μ-OLED display panel. The standoff physically couples the electronic component and the μ-OLED display panel with a gap therebetween. The gap thermally decouples the electronic component from the μ-OLED display panel. A U-shaped heat sink can be disposed in the standoff, and heat generated by the μ-OLED display can be mitigated by a system fan when a U-shaped heat sink is disposed in the standoff.
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Patent Agency Ranking
266.发明授权公开(公告)号：US12040530B2
公开(公告)日：2024-07-16
申请号：US17878229
申请日：2022-08-01
Applicant: DONGWOO FINE-CHEM CO., LTD.
Inventor： Na Yeon Kim , Young Ju Kim , Hee Jun Park , Won Hee Lee
CPC classification number: H01Q1/12 , H05K1/0243 , H05K1/0277 , H05K1/112 , H05K2201/056 , H05K2201/10098
Abstract: A package board according to an embodiment includes a first core layer having a first surface and a second surface that face each other, a feeding wiring extending on the first surface of the first core layer, a first via structure penetrating through the first core layer, a first connection pad disposed on the second surface of the first core layer to be electrically connected to the feeding wiring through the first via structure, the first connection pad including a head portion in contact with the first via structure and an extension portion protruding from the head portion, and a first connector mounted on the second surface of the first core layer, the first connector including a first terminal electrically connected to the extension portion of the first connection pad.
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公开(公告)号：US11997793B2
公开(公告)日：2024-05-28
申请号：US17169336
申请日：2021-02-05
Applicant: NIDEC CORPORATION
Inventor： Shinri Ono , Tomohiro Egawa , Genki Tanaka , Soichiro Kimura , Tsungting Hsieh , Kwun-Yao Ho
CPC classification number: H05K1/189 , G03B5/00 , H05K1/0281 , H05K2201/056
Abstract: An optical unit includes a movable body including an optical module, a fixed body, a support mechanism, a flexible printed circuit board, and a positioning part. A bent part of the flexible printed circuit board has a first bent portion closest to a connection part between the connection part and the positioning part along an extension direction, and a second bent portion close to the connection part next to the first bent portion between the connection part and the positioning part along the extension direction. The second bent portion is located on a reference plane or on a side different from the side where the connection part is located with respect to the reference plane.
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公开(公告)号：US20240164022A1
公开(公告)日：2024-05-16
申请号：US17915707
申请日：2021-11-01
Inventor： Jing WANG , Mingming JIA , Lili WANG , Sha FENG , Chao LIU , Ming ZHAI , Haiwei SUN , Lingyun SHI , Liqiang WANG , Jingjing ZHANG
IPC: H05K1/18 , H01L23/00 , H01L25/075 , H05K1/11
CPC classification number: H05K1/189 , H01L24/05 , H01L24/06 , H01L24/32 , H01L24/83 , H05K1/118 , H01L25/0753 , H01L2224/05573 , H01L2224/06155 , H01L2224/32225 , H01L2224/8313 , H01L2224/83201 , H05K2201/056 , H05K2201/10128
Abstract: A display module includes a display panel with a plurality of bonding electrodes arranged at intervals along a selected side edge of a non-display surface and divided into two bonding electrode groups, a first flexible circuit board and a second flexible circuit board. For the first flexible circuit board, each first conductive contact piece in a first wiring region is connected to a bonding electrode in a first bonding electrode group. For the second flexible circuit board, each second conductive contact piece in a second wiring region is connected to a bonding electrode in a second bonding electrode group. The first wiring region is closer to the selected side edge than the second wiring region in a first direction. The first fan-out region is spaced apart from the second wiring region in a second direction perpendicular to the first direction.
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公开(公告)号：US11980724B2
公开(公告)日：2024-05-14
申请号：US17480086
申请日：2021-09-20
Applicant: Boston Scientific Scimed Inc.
Inventor： Steven J. Meyer , James E. Blood , David A. Chizek , Matthew Hein , Daniel J. Foster
IPC: A61M25/01 , A61B5/00 , A61B5/06 , A61M25/00 , G01B7/004 , H05K1/02 , H05K1/11 , H05K1/18 , H05K3/28 , H05K3/30 , H05K7/14
CPC classification number: A61M25/0127 , A61B5/062 , A61B5/6852 , A61M25/0012 , G01B7/004 , H05K1/028 , H05K1/111 , H05K1/181 , H05K3/284 , H05K3/303 , H05K7/1427 , A61B5/6851 , A61B5/686 , A61B2562/0223 , A61B2562/043 , A61B2562/164 , A61M2025/0166 , H05K2201/056 , H05K2201/10151
Abstract: A sensor assembly includes a multilayer circuit, a first magnetic field sensor, and a second magnetic field sensor. The multilayer circuit extends between a proximal end and a distal end along a longitudinal axis. The multilayer circuit includes a plurality of electrical pads positioned at the proximal end. The first magnetic field sensor is coupled to the multilayer circuit and has a primary sensing direction aligned with the longitudinal axis. The second magnetic field sensor is coupled to the multilayer circuit and oriented with respect to the first magnetic field sensor such that the second magnetic field sensor has a primary sensing direction aligned with an axis orthogonal to the longitudinal axis.
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公开(公告)号：US11937382B2
公开(公告)日：2024-03-19
申请号：US18152918
申请日：2023-01-11
Applicant: LG INNOTEK CO., LTD.
Inventor： Hyun Woo Ryou
CPC classification number: H05K3/4691 , H04N23/54 , H04N23/55 , H04N23/57 , H05K1/02 , H05K1/0281 , H05K1/14 , H05K1/147 , H05K1/144 , H05K3/365 , H05K2201/056 , H05K2201/09163 , H05K2201/10121
Abstract: The present invention relates to a substrate unit and a substrate assembly, and a camera module using the same. The present invention may comprise: a first substrate part having rigidity; a second substrate part stacked on one surface of the first substrate part and having flexibility; a third substrate part extending outwardly from the second substrate part and having flexibility; and a reinforcing part which is disposed at a portion where the edge portions of the first substrate part and the third substrate part meet, the reinforcing part having a recessed portion which is formed by recessing the first substrate part inwardly so as to inhibit interference between the first substrate part and the third substrate part. The present invention is capable of resolving the interference between a rigid PCB and a flexible PCB and the tearing thereof by providing a reinforcing part in a connection portion of the rigid PCB and the flexible PCB.
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