公开(公告)号：US20060001180A1

公开(公告)日：2006-01-05

申请号：US10882998

申请日：2004-06-30

Applicant: Brian Taggart ,  Robert Nickerson ,  Ronald Spreitzer

Inventor： Brian Taggart ,  Robert Nickerson ,  Ronald Spreitzer

IPC: H01L23/48 ,  H01L21/44

CPC classification number: H01L24/85 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/5386 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/4554 ,  H01L2224/45644 ,  H01L2224/45669 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/48482 ,  H01L2224/49052 ,  H01L2224/49175 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/85051 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2224/78 ,  H01L2924/00

Abstract: A wire-bonding substrate includes in-line wire bonds that are substantially of the same pitch on the die bond pads as on the substrate bond pads. A wire-bonding substrate also includes staggered bond pads on at least one of the die and the substrate. A substrate bond pad includes a first wire-bond pad and a first via that is disposed directly below the first wire-bond pad in the wire-bonding substrate. A package is also disclosed that includes a die that is coupled to the first wire-bonding pad. A computing system is also disclosed that includes the in-line wire-bonding configuration.

Abstract translation: 引线键合衬底包括在衬底接合焊盘上的芯片接合焊盘上基本上具有相同间距的在线引线键合。 引线键合衬底还包括在芯片和衬底中的至少一个上的交错键合焊盘。 衬底接合焊盘包括第一引线接合焊盘和直接设置在引线接合衬底中的第一引线接合焊盘下方的第一通孔。 还公开了包括耦合到第一引线接合焊盘的管芯的封装。 还公开了包括在线引线结构配置的计算系统。

公开(公告)号：US07818878B2

公开(公告)日：2010-10-26

申请号：US12042222

申请日：2008-03-04

Applicant: Robert M. Nickerson ,  Ronald L. Spreitzer ,  John C. Conner ,  Brian Taggart

Inventor： Robert M. Nickerson ,  Ronald L. Spreitzer ,  John C. Conner ,  Brian Taggart

IPC: H05K3/30

CPC classification number: H01L23/5387 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K7/1061 ,  H05K2201/056 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer and a substrate folded around the interposer. Other embodiments are described and claimed.

Abstract translation: 在一个实施例中，组装包装堆叠包括第一集成电路封装和第二集成电路封装，所述第一集成电路封装使用中介层和围绕插入件折叠的衬底机械地和电连接。 描述和要求保护其他实施例。

公开(公告)号：US20090212091A1

公开(公告)日：2009-08-27

申请号：US12038809

申请日：2008-02-27

Applicant: Siuyoung Yao ,  Brian Taggart

Inventor： Siuyoung Yao ,  Brian Taggart

IPC: B23K1/00 ,  B23K35/02

CPC classification number: B23K1/00 ,  B23K3/063 ,  B23K35/0227 ,  B23K35/262 ,  B23K35/3006 ,  B23K35/362 ,  B23K35/365 ,  Y10T428/12222

Abstract: Improved solder and soldering methods are disclosed. In accordance with one technique, a solder having a plurality of individual wire strands braided together is used. In accordance with another technique, the braided solder comprises both the same solder composition and wire gauge in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least two different solder compositions used in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least two different wire gauges used in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least one wire strand where the primary surface is coated with a thin layer of a noble metal. In accordance with another technique, the braided solder comprises at least one wire strand where flux material is present. In accordance with one soldering technique, a method of soldering is accomplished by melting a plurality of braided solder strands to join a plurality of metallic surfaces together.

Abstract translation: 公开了改进的焊料和焊接方法。 根据一种技术，使用具有编织在一起的多个单独的线股的焊料。 根据另一种技术，编织焊料包括单个焊丝股线中相同的焊料组成和线规。 根据另一种技术，编织焊料包括用于各个焊丝线中的至少两种不同的焊料组合物。 根据另一技术，编织焊料包括在单独的焊丝股线中使用的至少两种不同的线规。 根据另一种技术，编织焊料包括至少一根线股，其中主表面涂覆有贵金属的薄层。 根据另一种技术，编织焊料包括至少一根线束，其中存在焊剂材料。 根据一种焊接技术，焊接方法是通过熔化多个编织的焊料线来将多个金属表面结合在一起来实现的。

公开(公告)号：US20080148559A1

公开(公告)日：2008-06-26

申请号：US12042222

申请日：2008-03-04

Applicant: Robert M. NICKERSON ,  Ronald L. SPREITZER ,  John C. CONNER ,  Brian TAGGART

Inventor： Robert M. NICKERSON ,  Ronald L. SPREITZER ,  John C. CONNER ,  Brian TAGGART

IPC: H05K3/30

CPC classification number: H01L23/5387 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K7/1061 ,  H05K2201/056 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer and a substrate folded around the interposer. Other embodiments are described and claimed.

Abstract translation: 在一个实施例中，组装包装堆叠包括第一集成电路封装和第二集成电路封装，所述第一集成电路封装使用中介层和围绕插入件折叠的衬底机械地和电连接。 描述和要求保护其他实施例。

公开(公告)号：US20080023820A1

公开(公告)日：2008-01-31

申请号：US11866239

申请日：2007-10-02

Applicant: Brian Taggart ,  Ronald Apreitzer ,  Robert Nickerson

Inventor： Brian Taggart ,  Ronald Apreitzer ,  Robert Nickerson

IPC: H01L23/04 ,  H05K1/11

CPC classification number: H05K1/111 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49052 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H05K2201/096 ,  H05K2203/049 ,  Y02P70/611 ,  Y10T29/49156 ,  Y10T29/49162 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A wire-bonding substrate is disclosed. The wire-bonding substrate includes a first wire-bond pad and a first via that is disposed directly below the first wire-bond pad in the in the wire-bonding substrate. A package is also disclosed that includes a die that is coupled to the first wire-bonding pad. The package can include a larger substrate that is coupled to the wire-bonding substrate through an electrical connection such as a solder ball. A process of forming the wire-bonding substrate is also disclosed. The process includes via formation to stop on the wire-bond pad. A method of assembling a microelectronic package is also disclosed that includes coupling the die to the wire-bond pad. A computing system is also disclosed that includes the wire-bonding substrate.

Abstract translation: 公开了引线键合衬底。 引线键合衬底包括第一引线接合焊盘和布置在引线接合衬底中的第一引线接合焊盘正下方的第一通孔。 还公开了包括耦合到第一引线接合焊盘的管芯的封装。 封装可以包括通过诸如焊球之类的电连接而与引线键合衬底耦合的较大衬底。 还公开了形成引线接合基板的工艺。 该过程包括通孔形成以在接线焊盘上停止。 还公开了组装微电子封装的方法，其包括将管芯耦合到引线接合焊盘。 还公开了一种包括引线接合衬底的计算系统。

公开(公告)号：US20060202057A1

公开(公告)日：2006-09-14

申请号：US10906774

申请日：2005-03-06

Applicant: Brian Taggart ,  Ryan Dohse

Inventor： Brian Taggart ,  Ryan Dohse

IPC: B05B7/26

CPC classification number: A01C23/042

Abstract: A multi-purpose fertilizer distribution apparatus is described that can be incorporated into a new or existing underground irrigation system that facilitates the distribution of either liquid or solid fertilizer in the form of tablets or pellets. A main canister is adapted with an air sealed removable lid to allow access to replenish the fertilizer. The main canister has an integrated rod to hold specially designed fertilizer tablets and utilizes standard connectors to connect the apparatus to both the fluid source line of the irrigation system and the output line. The main canister permits connectors with integrated filters to be attached to permit easy connection between the apparatus and the irrigation system piping. The entire apparatus may be buried in the ground and is accessible at ground level for replenishment of fertilizer.

Abstract translation: 描述了一种多用途肥料分配设备，其可以并入到新的或现有的地下灌溉系统中，其有利于片剂或小丸形式的液体或固体肥料的分配。 主罐适用于空气密封的可拆卸盖子，以允许进入补充肥料。 主罐具有集成的杆，用于容纳专门设计的肥料片，并使用标准连接器将设备连接到灌溉系统的液体源线和输出线。 主罐允许具有集成过滤器的连接器被连接以允许装置和灌溉系统管道之间的容易连接。 整个设备可能被埋在地下，并可在地面进入补充肥料。

公开(公告)号：US20060000876A1

公开(公告)日：2006-01-05

申请号：US10881741

申请日：2004-06-30

Applicant: Robert Nickerson ,  Brian Taggart ,  Hai Ding

Inventor： Robert Nickerson ,  Brian Taggart ,  Hai Ding

IPC: B23K31/02

CPC classification number: B23K20/004 ,  B23K2101/42 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/5386 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49052 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  Y10T428/249921 ,  Y10T428/26 ,  H01L2224/78 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A wire-bonding substrate includes a curvilinear wire-bond pad. The curvilinear wire-bond pad is used in reverse wire bonding to couple a die with the substrate. A curvilinear wire-bond pad is also disclosed that is located directly above the via in the substrate. A wire-bonding substrate includes a first wire-bond pad and a first via that is disposed directly below the first wire-bond pad in the wire-bonding substrate. A package is includes a chip stack with a total die-side characteristic dimension, and a total substrate-side characteristic dimension that is smaller than the total die-side characteristic dimension. A computing system includes the curvilinear wire-bond pad.

Abstract translation: 引线键合衬底包括曲线性引线键合焊盘。 曲线引线接合焊盘用于反向引线接合以将管芯与衬底耦合。 还公开了一种曲线形接合焊盘，其位于衬底中的通孔正上方。 引线键合衬底包括第一引线接合焊盘和布线键合衬底中的第一引线接合焊盘正下方的第一通孔。 封装包括具有总模侧特性尺寸的芯片堆叠，以及小于总模侧特征尺寸的总基板侧特征尺寸。 一种计算系统包括曲线性的接线焊盘。