公开(公告)号：US20130099385A1

公开(公告)日：2013-04-25

申请号：US13280157

申请日：2011-10-24

Applicant: Meng-Tse Chen ,  Chun-Cheng Lin ,  Yu-Peng Tsai ,  Hsiu-Jen Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Meng-Tse Chen ,  Chun-Cheng Lin ,  Yu-Peng Tsai ,  Hsiu-Jen Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L23/538 ,  H01L21/66

CPC classification number: H01L25/50 ,  H01L21/31105 ,  H01L21/565 ,  H01L22/12 ,  H01L22/20 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/562 ,  H01L24/09 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/1131 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16113 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81447 ,  H01L2224/81801 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A device includes a package component having conductive features on a top surface, and a polymer region molded over the top surface of the first package component. A plurality of openings extends from a top surface of the polymer region into the polymer region, wherein each of the conductive features is exposed through one of the plurality of openings. The plurality of openings includes a first opening having a first horizontal size, and a second opening having a second horizontal size different from the first horizontal size.

公开(公告)号：US20130099370A1

公开(公告)日：2013-04-25

申请号：US13277575

申请日：2011-10-20

Applicant: Ming-Da CHENG ,  Chih-Wei LIN ,  Kuei-Wei HUANG ,  Yu-Peng TSAI ,  Chun-Cheng LIN ,  Chung-Shi LIU

Inventor： Ming-Da CHENG ,  Chih-Wei LIN ,  Kuei-Wei HUANG ,  Yu-Peng TSAI ,  Chun-Cheng LIN ,  Chung-Shi LIU

IPC: H01L23/498 ,  H01L21/60

CPC classification number: H01L24/16 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05572 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/13005 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/1601 ,  H01L2224/16104 ,  H01L2224/16238 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/206 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor package includes a workpiece with a conductive trace and a chip with a conductive pillar. The chip is attached to the workpiece and a solder joint region is formed between the conductive pillar and the conductive trace. The distance between the conductive pillar and the conductive trace is less than or equal to about 16 μm.

Abstract translation: 半导体封装包括具有导电迹线的工件和具有导电柱的芯片。 芯片附着在工件上，并且在导电柱和导电迹线之间形成焊点区域。 导电柱和导电迹线之间的距离小于或等于约16μm。

公开(公告)号：US20130062761A1

公开(公告)日：2013-03-14

申请号：US13228768

申请日：2011-09-09

Applicant: Chih-Wei Lin ,  Ming-Da Cheng ,  Wen-Hsiung Lu ,  Hsiu-Jen Lin ,  Bor-Ping Jang ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Chen-Hua Yu ,  Meng-Tse Chen ,  Chun-Cheng Lin ,  Yu-Peng Tsai ,  Kuei-Wei Huang ,  Wei-Hung Lin

Inventor： Chih-Wei Lin ,  Ming-Da Cheng ,  Wen-Hsiung Lu ,  Hsiu-Jen Lin ,  Bor-Ping Jang ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Chen-Hua Yu ,  Meng-Tse Chen ,  Chun-Cheng Lin ,  Yu-Peng Tsai ,  Kuei-Wei Huang ,  Wei-Hung Lin

IPC: H01L23/498 ,  H01L21/56

CPC classification number: H01L25/0657 ,  H01L21/52 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/05 ,  H01L24/09 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/92 ,  H01L24/97 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68377 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/06515 ,  H01L2224/09181 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/73259 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/9202 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15322 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/03 ,  H01L2924/014 ,  H01L2924/00

Abstract: Packaging methods and structures for semiconductor devices are disclosed. In one embodiment, a packaged semiconductor device includes a redistribution layer (RDL) having a first surface and a second surface opposite the first surface. At least one integrated circuit is coupled to the first surface of the RDL, and a plurality of metal bumps is coupled to the second surface of the RDL. A molding compound is disposed over the at least one integrated circuit and the first surface of the RDL.

公开(公告)号：US08378364B2

公开(公告)日：2013-02-19

申请号：US12700102

申请日：2010-02-04

Applicant: Ke-Hao Pan ,  Chun-Cheng Lin

Inventor： Ke-Hao Pan ,  Chun-Cheng Lin

IPC: H01L33/00

CPC classification number: H01L25/0753 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

Abstract: Multi-chip light emitting diodes and method for fabricating the same are provided. The multi-chip light emitting diode includes a lead frame including a carrier part. A plurality of chips is disposed on the carrier part, wherein the plurality of chips includes a first chip and a second chip. A first scattering layer is conformally covering the first chip to expose electrodes thereof, wherein the first scattering layer consists of a first scattering material. A second scattering layer is conformally covering the second chip to expose electrodes thereof, wherein the second scattering layer consists of a second scattering material.

Abstract translation: 提供了多芯片发光二极管及其制造方法。 多芯片发光二极管包括具有载体部分的引线框架。 多个芯片设置在载体部分上，其中多个芯片包括第一芯片和第二芯片。 第一散射层保形地覆盖第一芯片以暴露其电极，其中第一散射层由第一散射材料组成。 第二散射层保形地覆盖第二芯片以暴露其电极，其中第二散射层由第二散射材料组成。

公开(公告)号：US20120269243A1

公开(公告)日：2012-10-25

申请号：US13090272

申请日：2011-04-20

Applicant: Chun-Cheng Lin ,  Ming-Shih Yu

Inventor： Chun-Cheng Lin ,  Ming-Shih Yu

IPC: H04B17/00

CPC classification number: H04L7/033 ,  H03L7/0807 ,  H03L7/0891 ,  H03L7/091

Abstract: A phase detector includes a first sampling unit, a sampling module and a phase determining module. The first sampling unit is arranged for sampling a first data input signal to generate a first data signal according to a first clock signal. The sampling module includes a second sampling unit and a third sampling unit. The second sampling unit is arranged for sampling a second data input signal to generate a second data signal according to a second clock signal. The third sampling unit is arranged for sampling the second data signal to generate a third data signal according to the first clock signal. The phase determining module is arranged for generating a phase detecting result according to the first data signal and the third data signal.

Abstract translation: 相位检测器包括第一采样单元，采样模块和相位确定模块。 第一采样单元被布置用于对第一数据输入信号进行采样，以根据第一时钟信号产生第一数据信号。 采样模块包括第二采样单元和第三采样单元。 第二采样单元被布置用于对第二数据输入信号进行采样以根据第二时钟信号产生第二数据信号。 第三采样单元被布置用于对第二数据信号进行采样以根据第一时钟信号产生第三数据信号。 相位确定模块被布置成根据第一数据信号和第三数据信号产生相位检测结果。

公开(公告)号：US08153387B2

公开(公告)日：2012-04-10

申请号：US12490953

申请日：2009-06-24

Applicant: Chun-Cheng Lin ,  Mu-Lin Chen ,  Po-Chiao Lin ,  Yu-Ju Chen ,  Shu-Hua Chen

Inventor： Chun-Cheng Lin ,  Mu-Lin Chen ,  Po-Chiao Lin ,  Yu-Ju Chen ,  Shu-Hua Chen

IPC: G01N33/53

CPC classification number: C07K16/18 ,  C07K17/14 ,  C07K2317/41 ,  C07K2317/52 ,  G01N33/54353

Abstract: A method for immobilizing glycoprotein is disclosed. A surface is provided. Next, a boronic acid is contacted to the surface. The boronic acid is represented as Y—R—B—(OH)2 and includes a boronic acid group (B—(OH)2), a linker R, and a functional group Y, in which the boronic acid is bonded to the surface via the functional group Y. A glycoprotein is contacted to the boronic acid, wherein two spatially adjacent hydroxyl groups of a carbohydrate chain form a boronate ester with the boronic acid group of the boronic acid to immobilize the glycoprotein. The goal of site-specific and covalent protein immobilization without interfering the binding affinity of an antibody to antigen may be thus achieved with the reaction of boronic acid and the carbohydrate chain of Fc region.

Abstract translation: 公开了一种固定糖蛋白的方法。 提供一个表面。 接下来，硼酸与表面接触。 硼酸被表示为Y-R-B-（OH）2，并且包括硼酸基团（B-（OH）2），连接体R和官能团Y，其中硼酸键合到 通过官能团Y表面。糖蛋白与硼酸接触，其中碳水化合物链的两个空间上相邻的羟基与硼酸的硼酸基团形成硼酸酯以固定糖蛋白。 因此可以通过硼酸和Fc区的碳水化合物链的反应来实现位点特异性和共价蛋白固定而不干扰抗体对抗原的结合亲和力的目标。

公开(公告)号：US20100190966A1

公开(公告)日：2010-07-29

申请号：US12490953

申请日：2009-06-24

Applicant: Chun-Cheng LIN ,  Mu-Lin CHEN ,  Po-Chiao LIN ,  Yu-Ju CHEN ,  Shu-Hua CHEN

Inventor： Chun-Cheng LIN ,  Mu-Lin CHEN ,  Po-Chiao LIN ,  Yu-Ju CHEN ,  Shu-Hua CHEN

IPC: C07K16/00 ,  C07K2/00

CPC classification number: C07K16/18 ,  C07K17/14 ,  C07K2317/41 ,  C07K2317/52 ,  G01N33/54353

Abstract: A method for immobilizing glycoprotein is disclosed. A surface is provided. Next, a boronic acid is contacted to the surface. The boronic acid is represented as Y—R—B—(OH)2 and includes a boronic acid group(B—(OH)2), a linker R, and a functional group Y, in which the boronic acid is bonded to the surface via the functional group Y. A glycoprotein is contacted to the boronic acid, wherein two spatially adjacent hydroxyl groups of a carbohydrate chain form a boronate ester with the boronic acid group of the boronic acid to immobilize the glycoprotein. The goal of site-specific and covalent protein immobilization without interfering the binding affinity of an antibody to antigen may be thus achieved with the reaction of boronic acid and the carbohydrate chain of Fc region.

Abstract translation: 公开了一种固定糖蛋白的方法。 提供一个表面。 接下来，硼酸与表面接触。 硼酸被表示为Y-R-B-（OH）2，并且包括硼酸基团（B-（OH）2），连接体R和官能团Y，其中硼酸键合到 通过官能团Y表面。糖蛋白与硼酸接触，其中碳水化合物链的两个空间上相邻的羟基与硼酸的硼酸基团形成硼酸酯以固定糖蛋白。 因此可以通过硼酸和Fc区的碳水化合物链的反应来实现位点特异性和共价蛋白固定而不干扰抗体对抗原的结合亲和力的目标。

公开(公告)号：US20090324619A1

公开(公告)日：2009-12-31

申请号：US12491521

申请日：2009-06-25

Applicant: Jaulang Hwang ,  Chun-Cheng Lin ,  Hsiao-Ling Chiang ,  Fan-Dan Jan ,  Chiao-En Chen ,  Chia-Tse Shu

Inventor： Jaulang Hwang ,  Chun-Cheng Lin ,  Hsiao-Ling Chiang ,  Fan-Dan Jan ,  Chiao-En Chen ,  Chia-Tse Shu

IPC: A61K39/00 ,  C07K16/00 ,  C07H21/00 ,  A61P37/04

CPC classification number: C07K14/21 ,  A61K39/00 ,  A61K39/0011 ,  C07K14/28 ,  C07K14/33 ,  C07K16/3076 ,  C07K16/3084 ,  C07K2319/30 ,  C07K2319/55 ,  Y02A50/472

Abstract: A protein carrier containing an antigen presenting cell binding domain and a cysteine-rich domain. Also described herein is an immunoconjugate containing the protein carrier with an antigen conjugated to multiple cysteine residues in the cysteine-rich domain, and an immune composition containing the immunoconjugate and an adjuvant, as well as their uses in eliciting immune responses.

Abstract translation: 含有抗原呈递细胞结合结构域和富含半胱氨酸的结构域的蛋白质载体。 本文还描述了含有具有与富含半胱氨酸的结构域中的多个半胱氨酸残基缀合的抗原的蛋白质载体的免疫缀合物，以及含有免疫缀合物和佐剂的免疫组合物，以及它们在引发免疫应答中的用途。

公开(公告)号：US20080117621A1

公开(公告)日：2008-05-22

申请号：US11599985

申请日：2006-11-16

Applicant: Chun-Cheng Lin

Inventor： Chun-Cheng Lin

IPC: F21V33/00

CPC classification number: F21V33/008 ,  A47J37/0786 ,  F21V17/007 ,  F21V21/32 ,  F21V21/34 ,  F21V21/40

Abstract: A lighting device for a barbecue stove includes a handle assembly, and a lamp assembly retractably mounted on the handle assembly. The handle assembly includes two spaced fixing seats, and an elongate hollow handle. The lamp assembly includes a guide track, a slide, a receiving seat, a lighting seat, and a flexible pipe. Thus, the lamp assembly is retracted into and stored in the handle assembly when not in use, so that the lamp assembly does not occupy any space, thereby facilitating a user storing the lamp assembly.

Abstract translation: 一种用于烧烤炉的照明装置包括手柄组件和可收回地安装在手柄组件上的灯组件。 手柄组件包括两个间隔开的固定座和细长的中空手柄。 灯组件包括导轨，滑块，接收座，照明座和柔性管。 因此，灯组件在不使用时缩回到手柄组件中并存储在手柄组件中，使得灯组件不占据任何空间，从而便于用户存放灯组件。

公开(公告)号：US20060053846A1

公开(公告)日：2006-03-16

申请号：US10937299

申请日：2004-09-10

Applicant: Lan-Shi Huang ,  Chun-Cheng Lin

Inventor： Lan-Shi Huang ,  Chun-Cheng Lin

IPC: E05B59/00 ,  E05B63/14

CPC classification number: E05B15/02 ,  E05B65/1086 ,  Y10T70/5226

Abstract: A lock assembly includes a fixing plate fixed to an inner side of a door. An inside rose liner is fixed to the fixing plate. A shaft is rotatably mounted in an axial hole of the fixing plate and coupled with a tail piece of an auxiliary lock body. An inside handle includes an inside spindle rotatably mounted in another axial hole of the fixing plate. A control mechanism includes a sliding plate slidably mounted in the inside rose liner, a driving wheel mounted on the inside spindle to turn therewith, and a driven wheel mounted on the shaft to turn therewith. Each of the driving wheel and the driven wheel includes at least one pressing section on an outer periphery thereof for pressing against an associated pressing portion of the sliding plate. The auxiliary lock is simultaneously unlatched when the inside handle is turned.

Abstract translation: 锁组件包括固定在门的内侧的固定板。 里面的玫瑰衬垫固定在固定板上。 轴可旋转地安装在固定板的轴向孔中，并与辅助锁体的尾部件相连。 内手柄包括可旋转地安装在固定板的另一个轴向孔中的内主轴。 控制机构包括可滑动地安装在内部玫瑰衬垫中的滑动板，安装在内侧主轴上以转动的驱动轮以及安装在轴上以与其一起转动的从动轮。 驱动轮和从动轮中的每一个包括在其外周上的至少一个按压部分，用于压靠滑动板的相关联的按压部分。 当内部手柄转动时，辅助锁同时解锁。