公开(公告)号：US20130137242A1

公开(公告)日：2013-05-30

申请号：US13687937

申请日：2012-11-28

Applicant: Zhian HE ,  David W. PORTER ,  Jonathan D. REID ,  Frederick D. WILMOT

Inventor： Zhian HE ,  David W. PORTER ,  Jonathan D. REID ,  Frederick D. WILMOT

IPC: C25D21/12 ,  H01L21/02

CPC classification number: C25D21/12 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D17/007 ,  C25D17/06 ,  C25D17/10 ,  H01L21/02697

Abstract: Methods, systems, and apparatus for plating a metal onto a work piece are described. In one aspect, an apparatus includes a plating chamber, a substrate holder, an anode chamber housing an anode, an ionically resistive ionically permeable element positioned between a substrate and the anode chamber during electroplating, an auxiliary cathode located between the anode and the ionically resistive ionically permeable element, and an insulating shield with an opening in its central region. The insulating shield may be movable with respect to the ionically resistive ionically permeable element to vary a distance between the shield and the ionically resistive ionically permeable element during electroplating.

Abstract translation: 描述了将金属电镀到工件上的方法，系统和装置。 一方面，一种装置包括电镀室，衬底保持器，容纳阳极的阳极室，在电镀期间位于衬底和阳极室之间的离子电阻离子可渗透元件，位于阳极和离子电阻之间的辅助阴极 离子渗透元件，以及在其中心区域具有开口的绝缘护罩。 绝缘屏蔽件可以相对于离子电离性离子渗透元件移动，以在电镀期间改变屏蔽层与离子电阻性离子渗透元件之间的距离。

公开(公告)号：US20110226614A1

公开(公告)日：2011-09-22

申请号：US13051822

申请日：2011-03-18

Applicant: Robert Rash ,  Richard Abraham ,  David W. Porter ,  Steven T. Mayer

Inventor： Robert Rash ,  Richard Abraham ,  David W. Porter ,  Steven T. Mayer

IPC: C25B15/08 ,  C25B15/00 ,  C25B15/02

CPC classification number: C25D5/08 ,  C25D5/006 ,  C25D17/00 ,  C25D17/002 ,  C25D21/04 ,  C25D21/06 ,  C25D21/14 ,  C25D21/18

Abstract: An electrolyte, and particularly anolyte, may be circulated via an open loop having a pressure regulator, so that the pressure in the plating chamber is maintained at a constant (or substantially constant) value with respect to atmospheric pressure. In these embodiments, a pressure regulator is in fluid communication with the anode chamber.

Abstract translation: 电解质，特别是阳极电解液可以经由具有压力调节器的开环循环，使得电镀室中的压力相对于大气压维持在恒定（或基本上恒定的）值。 在这些实施例中，压力调节器与阳极室流体连通。

公开(公告)号：US20100320081A1

公开(公告)日：2010-12-23

申请号：US12684792

申请日：2010-01-08

Applicant: Steven T. Mayer ,  David W. Porter ,  Mark J. Willey

Inventor： Steven T. Mayer ,  David W. Porter ,  Mark J. Willey

IPC: C25B9/00 ,  B08B3/00

CPC classification number: H01L21/2885 ,  C25D3/38 ,  C25D5/003 ,  C25D5/02 ,  C25D5/34 ,  C25D7/123 ,  C25D17/001 ,  C25D21/04 ,  H01L21/76861 ,  H01L21/76898

Abstract: Disclosed are pre-wetting apparatus designs and methods. These apparatus designs and methods are used to pre-wet a wafer prior to plating a metal on the surface of the wafer. Disclosed compositions of the pre-wetting fluid prevent corrosion of a seed layer on the wafer and also improve the filling rates of features on the wafer.

Abstract translation: 公开了预润湿装置的设计和方法。 这些设备的设计和方法用于在将晶片上的金属镀覆在晶片表面之前预先浸湿晶片。 公开的预润湿流体的组合物防止晶片上种子层的腐蚀，并且还改善晶片上特征的填充率。

公开(公告)号：US5814182A

公开(公告)日：1998-09-29

申请号：US934305

申请日：1997-09-19

Applicant: Arthur H. McElroy, II ,  David W. Porter ,  Kean C. Chin ,  Richard A. Deaver

Inventor： Arthur H. McElroy, II ,  David W. Porter ,  Kean C. Chin ,  Richard A. Deaver

IPC: F16L47/02 ,  B29C65/02 ,  B29C65/20 ,  B29L23/00 ,  G05G9/047 ,  B32B31/00 ,  G05G15/00

CPC classification number: B29C65/2084 ,  B29C65/2092 ,  B29C65/7802 ,  B29C65/7841 ,  B29C66/1142 ,  B29C66/5221 ,  B29C66/71 ,  B29C66/86521 ,  B29C66/91231 ,  B29C66/91421 ,  B29C66/91431 ,  B29C66/961 ,  B29C66/8242 ,  B29L2023/22 ,  Y10T29/53978

Abstract: Polyolefin pipes are welded end-to-end by a self-propelled, self-contained machine which performs all steps necessary to the process without need for any other machines or equipment. Hydraulically driven parallel tracks are independently controlled for maximum maneuverability. An hydraulically driven, computer controlled, reversible jaw assembly reciprocates the new pipe section relative to the exiting pipe line. A facer for trimming and squaring the pipe ends to be joined and a heater for melting the pipe ends for fusing are umbilically connected to the machine for on-board or remote operation. The computer, also on an umbilical, enables the operator to operate the machine in a normal mode in which the operator manually controls the facing, soaking and fusing processes or an automatic mode in which the fusing process is automatically controlled by the computer. The computer also allows the operator to choose a data logging mode in which the operating pressure, heater temperature and time data are recorded to provide a history for each joint made by the machine.

Abstract translation: 聚烯烃管通过自推进的独立机器端对端焊接，该机器执行该过程所需的所有步骤，而不需要任何其他机器或设备。 独立控制液压驱动的平行轨道，以实现最大的机动性。 液压驱动的计算机控制的可逆钳口组件相对于离开的管道使新的管段相互往复运动。 用于修整和平整待连接的管端的面，并且用于熔化用于熔融的管端的加热器脐连接到机器以进行机载或远程操作。 计算机也在脐带上，使得操作者能够以正常模式操作机器，其中操作者手动地控制面对，浸泡和熔合过程或其中定影过程由计算机自动控制的自动模式。 计算机还允许操作员选择数据记录模式，其中记录操作压力，加热器温度和时间数据以提供由机器制造的每个接头的历史。

公开(公告)号：US5440878A

公开(公告)日：1995-08-15

申请号：US936842

申请日：1992-08-27

Applicant: Vernon E. Gleasman ,  Keith E. Gleasman ,  Arthur H. McElroy, II ,  David W. Porter

Inventor： Vernon E. Gleasman ,  Keith E. Gleasman ,  Arthur H. McElroy, II ,  David W. Porter

IPC: F01B3/02 ,  F16D39/00

CPC classification number: F01B3/02

Abstract: A hydraulic machine is disclosed in several embodiments as a pump, as a motor, and as a combination pump/motor. The machine's fixed cylinders are positioned circumferentially to a drive shaft, the pistons being driven by, or acting against, a split swash-plate which is supported primarily by the same main bearing in which the drive shaft rotates. The inclination of the split swash-plate is adjusted by an axially-movable servo mechanism which is also arranged circumferentially to the drive shaft. Preferred embodiments include, among other features, (i) various gimballed-yoke supports for the non-rotating portion of the swash-plate, (ii) various designs for a rotating valve-plate, and (iii) a radial valve system. The unique arrangement of elements provides a machine that is remarkably compact and lightweight, being (a) significantly smaller than commercially-available machines having similar horsepower ratings and (b) operable hydrodynamically (i.e., at constant horsepower) at reduced speeds. In one preferred embodiment, pump and motor units are mounted side-by-side within a combined housing having integrated fluid passageways for transferring operating fluid between the units, and the combined housing itself is mounted within a surrounding reservoir.

Abstract translation: 液压机在几个实施例中被公开为泵，电动机以及作为组合的泵/电动机。 机器的固定圆柱体周向地定位在驱动轴上，活塞由主要由驱动轴旋转的相同主轴承支承的旋转斜盘驱动或作用在其上。 分体旋转斜盘的倾斜度由轴向移动的伺服机构调节，伺服机构也沿驱动轴周向设置。 优选实施例包括以下特征：（i）用于旋转斜盘的非旋转部分的各种支撑支架支架，（ii）用于旋转阀板的各种设计，以及（iii）径向阀系统。 元件的独特布置提供了一种非常紧凑和重量轻的机器，其特征在于：（a）比具有相似功率额定值的市售机器显着更小，以及（b）以较低速度可操作地水动力地（即恒功率）。 在一个优选实施例中，泵和马达单元并排安装在具有用于在各单元之间传送工作流体的集成流体通道的组合壳体内，并且组合的壳体本身安装在周围的储存器内。

公开(公告)号：US09404194B2

公开(公告)日：2016-08-02

申请号：US13305384

申请日：2011-11-28

Applicant: Steven T. Mayer ,  David W. Porter

Inventor： Steven T. Mayer ,  David W. Porter

IPC: C25D21/12 ,  C25D21/14 ,  C25D21/18 ,  C25D7/12 ,  C25D3/60 ,  C25D17/00 ,  C25D3/56 ,  C25D5/02 ,  C25C1/20 ,  C25C7/00

CPC classification number: C25D3/60 ,  C25C1/20 ,  C25C7/00 ,  C25D3/56 ,  C25D5/022 ,  C25D5/48 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D21/12 ,  C25D21/14 ,  C25D21/18

Abstract: An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of Sn—Ag alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use.

Abstract translation: 用于连续同时电镀具有基本上不同的标准电沉积电位（例如，用于沉积Sn-Ag合金）的两种金属的装置包括阳极室，用于容纳包含第一少量贵金属（例如锡）的离子的阳极电解液， 但不是第二个，更高贵的金属（例如银）和活性阳极; 阴极室，用于容纳包含第一金属（例如锡）的离子，第二，更贵金属（例如银）的离子和底物的阴极电解液; 位于阳极室和阴极室之间的分离结构，其中分离结构基本上防止更贵族金属从阴极电解液转移到阳极电解液; 流体特征和相关联的控制器，其耦合到所述装置并且被配置为执行连续电镀，同时在延长的使用期限内保持基本恒定的电镀浴组分的浓度。

公开(公告)号：US08962085B2

公开(公告)日：2015-02-24

申请号：US12684787

申请日：2010-01-08

Applicant: Steven T. Mayer ,  David W. Porter ,  Mark J. Willey

Inventor： Steven T. Mayer ,  David W. Porter ,  Mark J. Willey

IPC: C25D5/34 ,  B05D5/12 ,  H05K3/00 ,  B05D3/00 ,  C25D5/02 ,  B05D1/02 ,  B05D1/18 ,  B23H3/00 ,  C25D7/12 ,  H01L21/288 ,  H01L21/768 ,  C25D17/00 ,  C25D21/04 ,  C25D5/00 ,  C25D3/38

CPC classification number: H01L21/2885 ,  C25D3/38 ,  C25D5/003 ,  C25D5/02 ,  C25D5/34 ,  C25D7/123 ,  C25D17/001 ,  C25D21/04 ,  H01L21/76861 ,  H01L21/76898

Abstract: Disclosed are pre-wetting apparatus designs and methods. These apparatus designs and methods are used to pre-wet a wafer prior to plating a metal on the surface of the wafer. Disclosed compositions of the pre-wetting fluid prevent corrosion of a seed layer on the wafer and also improve the filling rates of features on the wafer.

Abstract translation: 公开了预润湿装置的设计和方法。 这些设备的设计和方法用于在将晶片上的金属镀覆在晶片表面之前预先浸湿晶片。 公开的预润湿流体的组合物防止晶片上种子层的腐蚀，并且还改善晶片上特征的填充率。

公开(公告)号：US08597461B2

公开(公告)日：2013-12-03

申请号：US12871662

申请日：2010-08-30

Applicant: Steven T. Mayer ,  David W. Porter

Inventor： Steven T. Mayer ,  David W. Porter

IPC: C23F1/46 ,  C23F1/00 ,  C23F1/08

CPC classification number: C23F1/46 ,  C23F1/08 ,  C23F1/34 ,  C25C7/00 ,  H01L21/30604 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/67051

Abstract: Methods and apparatus for isotropically etching a metal from a work piece, while recovering and reconstituting the chemical etchant are described. Various embodiments include apparatus and methods for etching where the recovered and reconstituted etchant is reused in a continuous loop recirculation scheme. Steady state conditions can be achieved where these processes are repeated over and over with occasional bleed and feed to replenish reagents and/or adjust parameters such as pH, ionic strength, salinity and the like.

公开(公告)号：US20120258408A1

公开(公告)日：2012-10-11

申请号：US13438443

申请日：2012-04-03

Applicant: Steven T. MAYER ,  David W. PORTER ,  Bryan L. BUCKALEW ,  Robert RASH

Inventor： Steven T. MAYER ,  David W. PORTER ,  Bryan L. BUCKALEW ,  Robert RASH

IPC: C25D17/00 ,  G03F7/20 ,  C25D5/00

CPC classification number: C25D5/00 ,  C25D5/04 ,  C25D5/18 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D17/007 ,  C25D17/008 ,  C25D17/06 ,  C25D17/12 ,  C25D21/10 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/76873

Abstract: Methods of electroplating metal on a substrate while controlling azimuthal uniformity, include, in one aspect, providing the substrate to the electroplating apparatus configured for rotating the substrate during electroplating, and electroplating the metal on the substrate while rotating the substrate relative to a shield such that a selected portion of the substrate at a selected azimuthal position dwells in a shielded area for a different amount of time than a second portion of the substrate having the same average arc length and the same average radial position and residing at a different angular (azimuthal) position. For example, a semiconductor wafer substrate can be rotated during electroplating slower or faster, when the selected portion of the substrate passes through the shielded area.

Abstract translation: 在一方面，在控制方位均匀性的同时，在基板上电镀金属的方法包括在电镀期间为电镀设备提供基板，该电镀设备被配置为在电镀期间旋转基板，以及在将基板相对于屏蔽件旋转的同时使金属电镀， 在选择的方位角位置的衬底的选定部分在屏蔽区域中停留不同于具有相同平均弧长和相同平均径向位置并且位于不同角度（方位角）处的基底的第二部分的时间量， 位置。 例如，当基板的选定部分通过屏蔽区域时，半导体晶片基板可以在电镀期间更快或更快地旋转。

公开(公告)号：US20120138471A1

公开(公告)日：2012-06-07

申请号：US13305384

申请日：2011-11-28

Applicant: Steven T. MAYER ,  David W. PORTER

Inventor： Steven T. MAYER ,  David W. PORTER

IPC: C25D5/10 ,  C25B9/00

CPC classification number: C25D3/60 ,  C25C1/20 ,  C25C7/00 ,  C25D3/56 ,  C25D5/022 ,  C25D5/48 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D21/12 ,  C25D21/14 ,  C25D21/18

Abstract: An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of Sn—Ag alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use.

Abstract translation: 用于连续同时电镀具有基本上不同的标准电沉积电位（例如，用于沉积Sn-Ag合金）的两种金属的装置包括阳极室，用于容纳包含第一少量贵金属（例如锡）的离子的阳极电解液， 但不是第二个，更高贵的金属（例如银）和活性阳极; 阴极室，用于容纳包含第一金属（例如锡）的离子，第二，更贵金属（例如银）的离子和底物的阴极电解液; 位于阳极室和阴极室之间的分离结构，其中分离结构基本上防止更贵族金属从阴极电解液转移到阳极电解液; 流体特征和相关联的控制器，其耦合到所述装置并且被配置为执行连续电镀，同时在延长的使用期限内保持基本恒定的电镀浴组分的浓度。