公开(公告)号：US20070179053A1

公开(公告)日：2007-08-02

申请号：US11634108

申请日：2006-12-06

Applicant: Hyun-chul Lee ,  Soon-ho Kim ,  Doo-hwan Lee ,  Yulia Potapova ,  Ok-young Lim ,  Eun-duck Park ,  Eun-yong Ko

Inventor： Hyun-chul Lee ,  Soon-ho Kim ,  Doo-hwan Lee ,  Yulia Potapova ,  Ok-young Lim ,  Eun-duck Park ,  Eun-yong Ko

IPC: B01J23/00 ,  B01J8/02 ,  H01M8/06

CPC classification number: B01J23/10 ,  B01J21/063 ,  B01J21/066 ,  B01J23/002 ,  B01J23/16 ,  B01J23/63 ,  B01J23/83 ,  B01J35/1014 ,  B01J35/1019 ,  B01J35/1023 ,  B01J37/0201 ,  B01J37/033 ,  B01J37/036 ,  B01J2523/00 ,  C01B3/16 ,  C01B2203/0227 ,  C01B2203/0288 ,  C01B2203/1064 ,  C01B2203/107 ,  C01B2203/1082 ,  C01F17/0025 ,  C01G25/00 ,  C01P2006/12 ,  H01M8/0618 ,  Y02P20/52 ,  Y02P70/56 ,  B01J2523/3712 ,  B01J2523/48 ,  B01J2523/828 ,  B01J2523/31

Abstract: A composite oxide support containing ceria and an oxide of M1(M1 being Al, Zr or Ti) such that the atomic ratio of cerium to M1 is in the range of 1:4 to 1:40; a method of preparing the composite oxide support; a catalyst for low temperature water gas shift reaction, having a transition metal active component supported on the composite oxide support by an incipient wetness method; and a method of preparing the catalyst for low temperature water gas shift reaction are provided. The catalyst for low temperature water gas shift reaction prepared by using the composite oxide support can effectively remove carbon monoxide from the hydrogen produced from the low temperature water gas shift reaction at a lower temperature with a higher carbon monoxide conversion rate, compared with conventional catalysts for water gas shift reaction.

Abstract translation: 一种复合氧化物载体，其含有二氧化铈和M 1（M 1 H 2）的氧化物为Al，Zr或Ti，使得铈与M 1的原子比例< / SUB>在1:4至1:40的范围内; 制备复合氧化物载体的方法; 用于低温水煤气变换反应的催化剂，其具有通过初始润湿方法负载在复合氧化物载体上的过渡金属活性组分; 并提供了制备用于低温水煤气变换反应的催化剂的方法。 通过使用复合氧化物载体制备的用于低温水煤气变换反应的催化剂可以在较低温度下从低温水煤气变换反应产生的氢气以一氧化碳转化率较高的方式有效地除去一氧化碳，与常规催化剂相比， 水煤气变换反应。

公开(公告)号：US20070132536A1

公开(公告)日：2007-06-14

申请号：US11637664

申请日：2006-12-13

Applicant: Doo-Hwan Lee ,  Byoung-Youl Min ,  Myung-Sam Kang ,  Moon-Il Kim ,  Hyung-Tae Kim

Inventor： Doo-Hwan Lee ,  Byoung-Youl Min ,  Myung-Sam Kang ,  Moon-Il Kim ,  Hyung-Tae Kim

IPC: H01F5/00

CPC classification number: H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06589 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/10515 ,  Y10T29/4913 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

Abstract: A printed circuit board having embedded electronic components and a manufacturing method thereof are disclosed. With the printed circuit board having embedded electronic components, including a core sheet, a first electronic component mounted on one side of the core sheet, a second electronic component mounted on the other side of the core sheet and overlapping the first electronic component, a first insulation layer stacked on one side of the core sheet and covering the first electronic component, a second insulation layer stacked on the other side of the core sheet and covering the second electronic component, and a circuit pattern formed on the surface of the first insulation layer or the second insulation layer, the density of the printed circuit board having embedded components is improved, as a plurality of electronic components are embedded simultaneously, and when a thin CCL substrate or a metal substrate is used as the core, a metal substrate in particular, the heat-releasing property and mechanical strength are improved, including increased bending strength in a thermal-stress environment, as electronic components are mounted on both sides of the core sheet.

Abstract translation: 公开了一种具有嵌入式电子部件的印刷电路板及其制造方法。 利用具有嵌入式电子部件的印刷电路板，包括芯片，安装在芯片的一侧的第一电子部件，安装在芯片的另一侧并与第一电子部件重叠的第二电子部件，第一电子部件 绝缘层，其堆叠在所述芯片的一侧并覆盖所述第一电子部件;堆叠在所述芯片的另一侧并覆盖所述第二电子部件的第二绝缘层，以及形成在所述第一绝缘层的表面上的电路图案 或第二绝缘层，随着多个电子部件被同时嵌入，具有嵌入部件的印刷电路板的密度得到改善，并且当使用薄CCL基板或金属基板作为芯时，特别是金属基板 ，提高了散热性能和机械强度，包括在热应力环境中增加弯曲强度 因为电子部件安装在芯片的两侧。

公开(公告)号：US20060017435A1

公开(公告)日：2006-01-26

申请号：US10975736

申请日：2004-10-28

Applicant: Myung-Sam Kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Sang-Duck Kim ,  Doo-Hwan Lee

Inventor： Myung-Sam Kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Sang-Duck Kim ,  Doo-Hwan Lee

IPC: G01R33/02

CPC classification number: G01R33/04 ,  H05K1/165 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/086 ,  H05K2201/10151

Abstract: A Printed Circuit Board (PCB) having a weak magnetic field sensor of the present invention includes a base plate on which a first excitation circuit and a first detection circuit are formed on each of the sides thereof, soft magnetic core bodies laminated on the top and bottom of the base plate, respectively, and formed of a plurality of soft magnetic cores, and outer layers that are laminated on the soft magnetic core bodies, respectively, and on which a second excitation circuit and a second detection circuit connected to the first excitation circuit and the first detection circuit through via holes are formed so as to surround the soft magnetic cores, respectively. The present invention is characterized in that the soft magnetic cores, the excitation circuit and the detection circuit formed on one side of the base plate are perpendicular to the soft magnetic cores, the excitation circuit and the detection circuit formed on the other side of the base plate.

Abstract translation: 本发明的具有弱磁场传感器的印刷电路板（PCB）包括：基板，其基板在其基板上形成有第一激励电路和第一检测电路，软磁芯体层叠在顶板上， 底板分别由多个软磁芯和层叠在软磁体上的外层构成，第二激励电路和第二检测电路分别连接到第一激励 电路和通过通孔的第一检测电路分别形成为围绕软磁芯。 本发明的特征在于，形成在基板的一侧上的软磁芯，激励电路和检测电路垂直于软磁芯，激励电路和检测电路形成在基座的另一侧 盘子。

公开(公告)号：US20060001422A1

公开(公告)日：2006-01-05

申请号：US10965613

申请日：2004-10-14

Applicant: Myung-Sam kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Jae-Kul Lee ,  Doo-Hwan Lee

Inventor： Myung-Sam kang ,  Chang-Sup Ryu ,  Won-Cheol Bae ,  Jae-Kul Lee ,  Doo-Hwan Lee

IPC: G01R33/00

CPC classification number: G01R33/04 ,  H05K1/165 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/086 ,  H05K2201/10151

Abstract: Disclosed is a printed circuit board with a weak magnetic field sensor according to the present invention, which includes a substrate having first excitation circuits and first detection circuits formed on both sides thereof. First laminates are layered on both sides of the substrate, and have soft magnetic cores with a predetermined shape formed thereon. Second laminates are layered on the first laminates, and have second excitation circuits and second detection circuits, connected through via holes to the first excitation circuits and first detection circuits, respectively, so that the first and second excitation circuits and first and second detection circuits are wound around the soft magnetic cores, formed thereon. The soft magnetic cores each include a magnetic core and non-magnetic metal layers formed on both sides of the magnetic core.

Abstract translation: 公开了根据本发明的具有弱磁场传感器的印刷电路板，其包括具有形成在其两侧上的第一激励电路和第一检测电路的基板。 第一层压体层叠在基板的两侧，并且具有形成在其上的预定形状的软磁芯。 第二层叠体层叠在第一层叠体上，并具有分别通过通孔与第一激励电路和第一检测电路连接的第二激励电路和第二检测电路，使得第一和第二激励电路以及第一和第二检测电路 缠绕在其上形成的软磁芯上。 软磁芯各自包括形成在磁芯两侧的磁芯和非磁性金属层。

公开(公告)号：US08692391B2

公开(公告)日：2014-04-08

申请号：US12972310

申请日：2010-12-17

Applicant: Tae Sung Jeong ,  Doo Hwan Lee ,  Seung Eun Lee

Inventor： Tae Sung Jeong ,  Doo Hwan Lee ,  Seung Eun Lee

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H05K1/18

CPC classification number: H01L24/11 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/2919 ,  H01L2224/32155 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/83001 ,  H01L2224/838 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Disclosed herein are an embedded ball grid array substrate and a manufacturing method thereof. The embedded ball grid array includes: a core layer having a cavity therein; a semiconductor device embedded in the cavity of the core layer; a first circuit layer having a circuit pattern including a wire bonding pad formed thereon; a second circuit layer having a circuit pattern including a solder ball pattern formed thereon; and a wire electrically connecting the semiconductor device to the wire bonding pad.

Abstract translation: 本文公开了嵌入式球栅阵列基板及其制造方法。 嵌入式球栅阵列包括：其中具有空腔的芯层; 嵌入在芯层的空腔中的半导体器件; 第一电路层，具有包括在其上形成的引线接合焊盘的电路图案; 第二电路层，其具有包括形成在其上的焊球图案的电路图案; 以及将半导体器件电连接到引线接合焊盘的线。

公开(公告)号：US20130119553A1

公开(公告)日：2013-05-16

申请号：US13438483

申请日：2012-04-03

Applicant: Tae Sung JEONG ,  Jung Soo BYUN ,  Yul Kyo CHUNG ,  Doo Hwan LEE

Inventor： Tae Sung JEONG ,  Jung Soo BYUN ,  Yul Kyo CHUNG ,  Doo Hwan LEE

IPC: H01L23/498 ,  H01L21/78

CPC classification number: H01L29/0657 ,  H01L23/13 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/21 ,  H01L2224/211 ,  H01L2224/214 ,  H01L2924/10155 ,  H01L2924/12042 ,  H01L2924/15156 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09827 ,  H01L2924/00

Abstract: Disclosed herein is a semiconductor package including an electrical device having a first lateral surface; and a core substrate including a cavity in which the electrical device is positioned, wherein the core substrate is inclined in a thickness direction of the core substrate and has a second lateral surface that defines the cavity.

Abstract translation: 本文公开了一种半导体封装，其包括具有第一侧表面的电气装置; 以及包括其中定位所述电气装置的空腔的芯基板，其中所述芯基板在所述芯基板的厚度方向上倾斜并且具有限定所述空腔的第二侧表面。

公开(公告)号：US08206530B2

公开(公告)日：2012-06-26

申请号：US12351261

申请日：2009-01-09

Applicant: Doo-Hwan Lee ,  Kyung-Min Lee ,  Hyo-Bin Park

Inventor： Doo-Hwan Lee ,  Kyung-Min Lee ,  Hyo-Bin Park

IPC: B29C65/00 ,  B32B37/00

CPC classification number: H05K1/185 ,  B32B37/02 ,  B32B2038/0016 ,  B32B2310/0843 ,  B32B2457/08 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K2201/10674 ,  H05K2203/025 ,  H05K2203/1469 ,  Y10T156/10 ,  H01L2224/82

Abstract: A manufacturing method of a printed circuit board having an electro component is disclosed. The method in accordance with an embodiment of the present invention includes: seating an electro component, in which an electrode is formed on an upper side, on an upper side of a bonding sheet; seating an insulator, in which a cavity corresponding to the electro component has been formed, on the upper side of the bonding sheet; laminating a first insulating resin on an upper side of the insulator such that an upper side of the electro component is covered; polishing the first insulating resin such that the electrode is exposed; and forming a first circuit pattern, which is electrically connected to the exposed electrode, on the polished first insulating resin.

Abstract translation: 公开了具有电子部件的印刷电路板的制造方法。 根据本发明的实施例的方法包括：将粘合片的上侧上的在上侧形成电极的电子部件放置; 在所述接合片的上侧设置有与所述电子部件相对应的空腔的绝缘体; 在绝缘子的上侧层叠第一绝缘树脂，使得电子部件的上侧被覆盖; 抛光第一绝缘树脂使得电极暴露; 以及在抛光的第一绝缘树脂上形成与暴露的电极电连接的第一电路图案。

公开(公告)号：US20120075818A1

公开(公告)日：2012-03-29

申请号：US12972355

申请日：2010-12-17

Applicant: Sang Chul LEE ,  Jung Soo BYUN ,  Jin Seon PARK ,  Doo Hwan LEE

Inventor： Sang Chul LEE ,  Jung Soo BYUN ,  Jin Seon PARK ,  Doo Hwan LEE

IPC: H05K1/18 ,  B32B37/22

CPC classification number: H05K1/185 ,  H01L21/568 ,  H01L24/24 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/14 ,  H01L2924/3511 ,  H05K3/4652 ,  H05K2203/063 ,  H05K2203/1469 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00

Abstract: Disclosed is an embedded printed circuit board, in which electronic devices having different thicknesses can be embedded together, thus achieving highly dense electronic devices, and when electronic devices having considerably different thicknesses are embedded, two electronic devices which are comparatively thinner can be embedded in a perpendicular direction, thus reducing an embedding area and suppressing warping of the printed circuit board, and an insulating member the thickness of which is variably adjusted is interposed between base substrates, so that spaces between the electronic devices are completely filled therewith, thus solving the problem of void defects, resulting in reliable printed circuit boards, and, when a base substrate includes a core made of metal, the printed circuit board can less warp. Also a method of manufacturing the embedded printed circuit board is provided.

Abstract translation: 公开了一种嵌入式印刷电路板，其中可以将具有不同厚度的电子器件嵌入到一起，从而实现高密度电子器件，并且当嵌入具有相当不同厚度的电子器件时，可以将相对较薄的两个电子器件嵌入 垂直方向，从而减少了嵌入区域并抑制了印刷电路板的翘曲，并且将其厚度可变地调节的绝缘构件插入在基底之间，使得电子器件之间的空间被完全填充，从而解决了问题 的空隙缺陷，导致可靠的印刷电路板，并且当基底包括由金属制成的芯时，印刷电路板可以较少翘曲。 还提供了一种制造嵌入式印刷电路板的方法。

公开(公告)号：US20110287807A1

公开(公告)日：2011-11-24

申请号：US13050289

申请日：2011-03-17

Applicant: Ho Jin JUNG ,  Doo Hwan LEE ,  Seon Jun KIM ,  Young Hak PARK

Inventor： Ho Jin JUNG ,  Doo Hwan LEE ,  Seon Jun KIM ,  Young Hak PARK

IPC: H04M1/00

CPC classification number: H04B1/0064 ,  H04B1/3805 ,  H04B1/3816 ,  H04B1/401 ,  H04W88/06

Abstract: A communication method and apparatus of a dual standby mode mobile terminal for improving the emission performance are provided. The mobile terminal includes a master switch for connecting a master antenna to a master Radio Frequency (RF) unit for communication with a first network, a slave switch for connecting a slave antenna to a slave RF unit for communication with a second network, a slave control unit for controlling communication with the second network and for detecting attachment of a slave Subscriber Identity Module (SIM), and a master control unit for controlling communication with the first network, for detecting attachment of a master SIM, and for controlling the master and slave switches to establish/release either the connection between the master antenna and the master RF unit or the connection between the slave antenna and the slave RF unit.

Abstract translation: 提供了一种用于提高排放性能的双待机模式移动终端的通信方法和装置。 移动终端包括用于将主天线连接到用于与第一网络通信的主射频（RF）单元的主开关，用于将从天线连接到用于与第二网络通信的从RF单元的从设备开关，从站 控制单元，用于控制与第二网络的通信并且用于检测从用户识别模块（SIM）的附接;以及主控制单元，用于控制与第一网络的通信，用于检测主SIM卡的附件，以及用于控制主站和 从站交换机建立/释放主天线和主RF单元之间的连接或从天线和从RF单元之间的连接。

公开(公告)号：US08053130B2

公开(公告)日：2011-11-08

申请号：US11627570

申请日：2007-01-26

Applicant: Soon-ho Kim ,  Doo-hwan Lee ,  Hyun-chul Lee

Inventor： Soon-ho Kim ,  Doo-hwan Lee ,  Hyun-chul Lee

IPC: H01M8/06 ,  H01M8/04 ,  H01M8/10 ,  H01M8/22

CPC classification number: H01M8/04022 ,  C01B3/384 ,  C01B2203/0233 ,  C01B2203/066 ,  C01B2203/0811 ,  C01B2203/0822 ,  C01B2203/0827 ,  C01B2203/0888 ,  C01B2203/1217 ,  C01B2203/1223 ,  C01B2203/1229 ,  C01B2203/1235 ,  C01B2203/1241 ,  C01B2203/1247 ,  C01B2203/1258 ,  C01B2203/1294 ,  C01B2203/1685 ,  C01B2203/169 ,  C01B2203/1695 ,  H01M8/04216 ,  H01M8/0618 ,  H01M8/0631 ,  H01M2008/1095 ,  Y02P20/128

Abstract: A fuel cell system that includes a liquid fuel tank containing a non-sulfur-containing liquid fuel and water; a reformer generating a hydrogen-rich gas from the liquid fuel and water received from the liquid fuel tank; a reformer burner heating the reformer by burning a gaseous fuel received from a gaseous fuel tank, and a fuel cell stack generating electrical energy from the hydrogen-rich gas received from the reformer. The liquid fuel tank is connected to the gaseous fuel tank, and the liquid fuel mixed with water is supplied to the reformer by the pressure of the gaseous fuel tank.

Abstract translation: 一种燃料电池系统，包括含有不含硫的液体燃料和水的液体燃料箱; 从液体燃料产生富氢气体的重整器和从液体燃料箱接收的水; 重整器燃烧器，通过燃烧从气体燃料箱接收的气体燃料来加热重整器，以及从从重整器接收的富氢气体产生电能的燃料电池堆。 液体燃料箱连接到气体燃料箱，并且与水混合的液体燃料通过气体燃料箱的压力被供应到重整器。