公开(公告)号：US06632536B2

公开(公告)日：2003-10-14

申请号：US09752019

申请日：2000-12-28

Applicant: Stephen L. Buchwalter ,  Gareth Geoffrey Hougham ,  Kang-Wook Lee ,  John J. Ritsko ,  Mary Elizabeth Rothwell ,  Peter M. Fryer

Inventor： Stephen L. Buchwalter ,  Gareth Geoffrey Hougham ,  Kang-Wook Lee ,  John J. Ritsko ,  Mary Elizabeth Rothwell ,  Peter M. Fryer

IPC: B32B904

CPC classification number: B82Y30/00 ,  G02F1/13439 ,  Y10T428/31663

Abstract: New etch barriers of indium-tin-oxide in the manufacturing process of thin film transistor-liquid crystal display are self-assembled monolayers, such as n-alkylsilanes. A typical process of applying a self-assembled monolayer is to ink a hydrolyzed n-octadecyltrimethoxysilane solution on to a stamp and then to transfer the solution onto ITO. The surface of the stamp may be polar enough to be wet with polar self-assembled monolayer solutions of an akylsilane. A non-polar stamp surface may be treated with oxygen plasma to obtain a wettable polar surface.

Abstract translation: 在薄膜晶体管 - 液晶显示器的制造过程中，铟锡氧化物的新的蚀刻屏障是自组装单层，例如正烷基硅烷。 施加自组装单层的典型方法是将水解的正十八烷基三甲氧基硅烷溶液油墨印刷到印模上，然后将溶液转移到ITO上。 印模的表面可以足够极性以使其与烷基硅烷的极性自组装单层溶液一起润湿。 可以用氧等离子体处理非极性印模表面，以获得可润湿的极性表面

公开(公告)号：US5599582A

公开(公告)日：1997-02-04

申请号：US475412

申请日：1995-06-07

Applicant: Eleftherios Adamopoulos ,  Jungihl Kim ,  Kang-Wook Lee ,  Tae S. Oh ,  Terrence R. O'Toole ,  Sampath Purushothaman ,  John J. Ritsko ,  Jane M. Shaw ,  Alfred Viehbeck ,  George F. Walker

Inventor： Eleftherios Adamopoulos ,  Jungihl Kim ,  Kang-Wook Lee ,  Tae S. Oh ,  Terrence R. O'Toole ,  Sampath Purushothaman ,  John J. Ritsko ,  Jane M. Shaw ,  Alfred Viehbeck ,  George F. Walker

IPC: B32B7/10 ,  B32B15/08 ,  B32B15/088 ,  B32B27/00 ,  C08G73/00 ,  C08G73/10 ,  H01B3/30 ,  H01L21/52 ,  H05K1/03 ,  H05K3/46 ,  B05D5/10

CPC classification number: C08G73/1089 ,  C08G73/1003 ,  C08G73/1007 ,  C08G73/101 ,  H01B3/306 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31721

Abstract: The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate. A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer-copper interface.

Abstract translation: 本公开描述了一种多层制品，其包括粘附到其上的末端不饱和粘合聚酰亚胺的基底，其中与基底相对的粘合剂的表面粘附到聚酰亚胺上，该制品进一步的特征在于具有一组或多个交替层 的末端不饱和粘合聚酰亚胺和聚酰亚胺。 在另一个实施方案中，制品具有粘附到金属基底或诸如集成电路的电路部件的至少一个粘合聚酰亚胺层，或用于在电路中形成电连接的装置，例如电路上的金属管道或布线网络 嵌入在陶瓷和/或聚合物基材内。 还描述了一种新型粘合聚酰亚胺，其是粘合聚酰亚胺，例如用不饱和杂环单胺如氮杂腺嘌呤，氨基苯并三唑，氨基嘌呤或氨基吡唑并嘧啶和任选的酸酐，氨基乙炔，乙烯胺或氨基膦封端的ODPA-APB。 新型聚酰亚胺还可以在聚合物主链或链中含有不饱和杂环基团，作为用于合成聚酰亚胺的芳族二胺的部分或完全替代物。 本发明中的这种新型粘合聚酰亚胺作为聚合物基材（铜，聚合物，玻璃陶瓷）界面的粘合剂层以及用于聚合物 - 铜界面的铜扩散阻挡层。

公开(公告)号：US20240084617A1

公开(公告)日：2024-03-14

申请号：US18274543

申请日：2022-01-28

Applicant: Yoo Kyeong LEE ,  Kang Wook LEE

Inventor： Yoo Kyeong LEE ,  Kang Wook LEE

IPC: E04H15/06 ,  B60P3/39 ,  E04H15/48 ,  E04H15/58

CPC classification number: E04H15/06 ,  B60P3/39 ,  E04H15/48 ,  E04H15/58

Abstract: The present invention relates to a hard rooftop tent mounted and used on the roof of a vehicle or trailer. To this end, according to the present invention, automatic erection is performed by erection means installed directly on first and second partition walls constituting front and rear upright skeleton walls among the front and rear upright skeleton walls and both side walls formed as one unit between a lower case and an upper case to form and eliminate an inner activity space through the unlocking operation of locking means. Accordingly, the erection structure of the front and rear upright skeleton walls is considerably simplified. Furthermore, the front and rear upright skeleton walls and the side walls can be securely accommodated and stored inside the lower and upper cases made of hard materials. Furthermore, the moisture water generated due to dew condensation can be easily removed through a trench.

公开(公告)号：US09219035B2

公开(公告)日：2015-12-22

申请号：US14153478

申请日：2014-01-13

Applicant: Ho-jin Lee ,  Kang-wook Lee ,  Myeong-soon Park ,  Ju-il Choi ,  Son-kwan Hwang

Inventor： Ho-jin Lee ,  Kang-wook Lee ,  Myeong-soon Park ,  Ju-il Choi ,  Son-kwan Hwang

IPC: H01L23/48 ,  H01L23/528 ,  H01L21/768 ,  H01L25/065 ,  H01L25/00 ,  H01L23/522

CPC classification number: H01L23/528 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/5226 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06181 ,  H01L2224/13009 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48145 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/15311 ,  H01L2924/00012

Abstract: Methods of forming an integrated circuit device include forming an interlayer dielectric layer on a first surface of a semiconductor substrate and then forming an interconnect hole that extends through the interlayer dielectric layer and into the semiconductor substrate. A first sidewall spacer layer is formed on a sidewall of the interconnect hole. The semiconductor substrate at a bottom of the interconnect hole is isotropically etched to define an undercut recess in the semiconductor substrate. This etching step is performed using the first sidewall spacer layer as an etching mask. The interconnect hole and the uncut recess are then filled with a through-via electrode. A second surface of the semiconductor substrate is removed for a sufficient duration to expose the uncut recess containing the through-via electrode.

Abstract translation: 形成集成电路器件的方法包括在半导体衬底的第一表面上形成层间电介质层，然后形成延伸穿过层间电介质层并进入半导体衬底的互连孔。 第一侧壁间隔层形成在互连孔的侧壁上。 在互连孔的底部的半导体衬底被各向同性蚀刻以在半导体衬底中限定底切凹部。 该蚀刻步骤使用第一侧壁间隔层作为蚀刻掩模进行。 然后用通孔电极填充互连孔和未切割凹部。 去除半导体衬底的第二表面足够的持续时间以露出包含通孔电极的未切割凹部。

公开(公告)号：US20150221615A1

公开(公告)日：2015-08-06

申请号：US14683195

申请日：2015-04-10

Applicant: KI-TAE PARK ,  KANG-WOOK LEE ,  YOUNG-DON CHOI ,  YUN-SANG LEE

Inventor： KI-TAE PARK ,  KANG-WOOK LEE ,  YOUNG-DON CHOI ,  YUN-SANG LEE

IPC: H01L25/065 ,  H01L23/00

CPC classification number: H01L25/0657 ,  G11C5/06 ,  H01L23/34 ,  H01L23/5384 ,  H01L23/64 ,  H01L24/17 ,  H01L2224/16 ,  H01L2224/1712 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2225/1058 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2924/19106 ,  H01L2924/00

Abstract: A stacked semiconductor apparatus and method of fabricating same are disclosed. The apparatus includes upper and lower semiconductor devices having a similar pattern of connection elements. When stacked connected the resulting plurality of semiconductor devices includes a serial connection path traversing the stack, and may also include parallel connection paths, back-side mounted large components, and vertical thermal conduits.

公开(公告)号：US20130077374A1

公开(公告)日：2013-03-28

申请号：US13659146

申请日：2012-10-24

Applicant: Ki-Tae PARK ,  Kang-Wook LEE ,  Young-Don CHOI ,  Yun-Sang LEE

Inventor： Ki-Tae PARK ,  Kang-Wook LEE ,  Young-Don CHOI ,  Yun-Sang LEE

IPC: H01L23/538 ,  G11C5/06 ,  H01L23/34

CPC classification number: H01L25/0657 ,  G11C5/06 ,  H01L23/34 ,  H01L23/5384 ,  H01L23/64 ,  H01L24/17 ,  H01L2224/16 ,  H01L2224/1712 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2225/1058 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2924/19106 ,  H01L2924/00

Abstract: A stacked semiconductor apparatus and method of fabricating same are disclosed. The apparatus includes upper and lower semiconductor devices having a similar pattern of connection elements. When stacked connected the resulting plurality of semiconductor devices includes a serial connection path traversing the stack, and may also include parallel connection paths, back-side mounted large components, and vertical thermal conduits.

公开(公告)号：US20120292375A1

公开(公告)日：2012-11-22

申请号：US13566467

申请日：2012-08-03

Applicant: Pascal P. Blais ,  Paul F. Fortier ,  Kang-Wook Lee ,  Jae-Woong Nah ,  Soojae Park ,  Robert L. Toutant ,  Alain A. Warren

Inventor： Pascal P. Blais ,  Paul F. Fortier ,  Kang-Wook Lee ,  Jae-Woong Nah ,  Soojae Park ,  Robert L. Toutant ,  Alain A. Warren

IPC: B23K37/04

CPC classification number: B23K1/0016 ,  H01L21/563 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/73204 ,  H01L2224/75704 ,  H01L2224/75985 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15787 ,  H01L2924/3511 ,  H01L2924/01026 ,  H01L2924/00

Abstract: A method and apparatus for making chip assemblies is disclosed that prevent or reduce the cracking and delamination of ultra low-k dielectrics in the back-end-of-line in Si chips that can occur during the chip assembly process. The method and apparatus apply pressure to the top and bottom surfaces of a substrate during the chip bonding process so that the bending and warping of the assembled modules are reduced. The reduced bending and warping prevent or reduce the cracking and delamination of ultra low-k dielectrics.

Abstract translation: 公开了一种用于制造芯片组件的方法和装置，其防止或减少在芯片组装过程中可能发生的Si芯片中后端的超低k电介质的开裂和分层。 该方法和装置在芯片接合过程期间对基板的顶表面和底表面施加压力，使得组装的模块的弯曲和翘曲减小。 减小的弯曲和翘曲防止或减少超低k电介质的开裂和分层。

公开(公告)号：US08278766B2

公开(公告)日：2012-10-02

申请号：US12805321

申请日：2010-07-26

Applicant: Kang-Wook Lee ,  Se-Yong Oh ,  Young-Hee Song ,  Gu-Sung Kim

Inventor： Kang-Wook Lee ,  Se-Yong Oh ,  Young-Hee Song ,  Gu-Sung Kim

IPC: H01L23/48 ,  H01L23/52

CPC classification number: H01L25/50 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/02372 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05009 ,  H01L2224/06181 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A system-in-package, comprising a wafer level stack structure, including at least one first device chip including a first device region having a plurality of input/output(I/O) pads, and at least one second device chip including a second device region having a plurality of input/output(I/O) pads and a second peripheral region surrounding the second device region, wherein the size of the second device region is different from the size of the first device region, wherein the at least one first device chip and the at least one second device chip have approximately equal size; and a common circuit board to which the wafer level stack structure is connected.

Abstract translation: 一种系统级封装，包括晶片级堆叠结构，其包括至少一个包括具有多个输入/输出（I / O）焊盘的第一器件区域的第一器件芯片，以及包括第二器件芯片的至少一个第二器件芯片 器件区域具有多个输入/输出（I / O）焊盘和围绕第二器件区域的第二外围区域，其中第二器件区域的尺寸不同于第一器件区域的尺寸，其中至少一个 第一器件芯片和至少一个第二器件芯片具有大致相等的尺寸; 以及连接晶片级堆叠结构的公共电路板。

公开(公告)号：US20120128516A1

公开(公告)日：2012-05-24

申请号：US13387465

申请日：2009-12-02

Applicant: Kang-Wook Lee ,  Jin-Ung Shin ,  Geun-Hyung Lee ,  Seoung-Min Kang

Inventor： Kang-Wook Lee ,  Jin-Ung Shin ,  Geun-Hyung Lee ,  Seoung-Min Kang

IPC: F04B17/00

CPC classification number: F04C18/3564 ,  F01C21/02 ,  F04C18/322 ,  F04C23/008 ,  F04C23/02 ,  F04C29/0071 ,  F04C29/0085 ,  F04C29/023 ,  F04C2230/603 ,  F04C2240/10 ,  F04C2240/30 ,  F04C2240/40 ,  F04C2240/52 ,  F04C2240/60 ,  F04C2270/12

Abstract: The present invention relates to a compressor in which a rotary member suspended on a stationary member is rotated to compress the refrigerant. As the rotary member is suspended on a first stationary member and rotatably supported on a second stationary member spaced apart from the first stationary member, components can be easily centered and assembled with the structural stability. In addition, the oil stored in a hermetic container is supplied to a lubrication passage provided between the rotary member and the stationary member. This reduces a friction loss between the components and achieves the operation reliability. Moreover, the oil is easily introduced into a vane mounting hole in which a vane is linearly reciprocated. This reduces the friction and abrasion of the vane and improves the operation reliability.

Abstract translation: 本发明涉及一种压缩机，其中悬挂在静止构件上的旋转构件旋转以压缩制冷剂。 由于旋转构件悬挂在第一静止构件上并且可旋转地支撑在与第一固定构件间隔开的第二固定构件上，因此可以容易地使组件以结构稳定性居中和组装。 此外，存储在密封容器中的油被供给到设置在旋转构件和固定构件之间的润滑通道。 这减少了部件之间的摩擦损失并实现了操作的可靠性。 此外，油容易地引入到叶片线性往复运动的叶片安装孔中。 这降低了叶片的摩擦和磨损，提高了操作的可靠性。

公开(公告)号：US20120128511A1

公开(公告)日：2012-05-24

申请号：US13388116

申请日：2009-12-02

Applicant: Kang-Wook Lee ,  Jang-Woo Lee ,  Bum-Dong Sa ,  Jin-Ung Shin

Inventor： Kang-Wook Lee ,  Jang-Woo Lee ,  Bum-Dong Sa ,  Jin-Ung Shin

IPC: F04B35/04

CPC classification number: F01C21/02 ,  F04C18/322 ,  F04C18/3564 ,  F04C23/008 ,  F04C23/02 ,  F04C29/0071 ,  F04C29/0085 ,  F04C29/023 ,  F04C2230/603 ,  F04C2240/10 ,  F04C2240/30 ,  F04C2240/40 ,  F04C2240/52 ,  F04C2240/60 ,  F04C2270/12

Abstract: The present invention relates to a compressor in which a rotary member suspended on a stationary member is rotated to compress the refrigerant. The rotary member is suspended on a first stationary member and rotatably supported on a second stationary member spaced apart from the first stationary member to thereby achieve the structural stability, improve the operation reliability and reduce the vibration. The components can be easily centered and assembled with an excellent assembly property. In addition, a mounting structure of an elastically-supported vane is improved to ensure the lubrication performance and the operation reliability. Moreover, a mounting structure of a roller-incorporated vane is improved to reduce vibration and prevent refrigerant leakage, which leads to high compression efficiency.

Abstract translation: 本发明涉及一种压缩机，其中悬挂在静止构件上的旋转构件旋转以压缩制冷剂。 旋转构件悬挂在第一固定构件上并且可旋转地支撑在与第一固定构件间隔开的第二固定构件上，从而实现结构稳定性，提高操作可靠性并减少振动。 组件可以容易地集中和组装，具有优异的组装性能。 此外，改进了弹性支撑叶片的安装结构，以确保润滑性能和操作可靠性。 此外，改进了带辊子的叶片的安装结构以减少振动并防止制冷剂泄漏，这导致高的压缩效率。