公开(公告)号：US10519557B2

公开(公告)日：2019-12-31

申请号：US15412809

申请日：2017-01-23

Applicant: MacDermid Enthone Inc.

Inventor： Vincent Paneccasio, Jr. ,  Kyle Whitten ,  Thomas B. Richardson ,  Ivan Li

IPC: C25D3/38 ,  C08G65/333 ,  H05K3/18 ,  H05K3/42 ,  C25D7/12 ,  C08G65/24 ,  C08L71/03 ,  H01L21/768 ,  H01L21/48 ,  H01L21/288

Abstract: An aqueous electrolytic composition and a process for electrodeposition of copper on a dielectric or semiconductor base structure using the aqueous electrolytic composition. The process includes (i) contacting a metalizing substrate comprising a seminal conductive layer on the base structure with an aqueous electrolytic deposition composition; and (ii) supplying electrical current to the electrolytic deposition composition to deposit copper on the substrate. The aqueous electrolytic composition comprises: (a) copper ions; (b) an acid; (c) a suppressor; and (d) a quaternized poly(epihalohydrin) comprising n repeating units corresponding to structure 1N and p repeating units corresponding to structure 1P:

公开(公告)号：US20190091724A1

公开(公告)日：2019-03-28

申请号：US15717275

申请日：2017-09-27

Applicant: MacDermid Enthone Inc.

Inventor： Keith Paul Parsons ,  Herrick Man Hin Yu

IPC: B05D5/02 ,  B29C45/14 ,  B29C69/02 ,  B05D3/06 ,  B05D3/02

Abstract: Textured hardcoat films are disclosed for preferable use in film insert moulding. Texture in the hardcoat film is created through the use of a textured protective overlayer, which can impart texture to the curable coating of the hardcoat film. This process preferably avoids the need to alter the composition of the curable coating to allow for texture and preferably produces a hardcoat film with a matte and reduced-glare finish. An apparatus and a method embodying the invention are disclosed.

公开(公告)号：US20190010624A1

公开(公告)日：2019-01-10

申请号：US15641756

申请日：2017-07-05

Applicant: MacDermid Enthone Inc.

Inventor： John Commander ,  Kyle Whitten ,  Vincent Paneccasio, JR. ,  Shaopeng Sun ,  Eric Yakobson

IPC: C25D3/16 ,  H01L21/768 ,  C25D5/02 ,  C25D7/12

Abstract: Compositions and methods of using such compositions for electroplating cobalt onto semiconductor base structures comprising submicron-sized electrical interconnect features are provided herein. The interconnect features are metallized by contacting the semiconductor base structure with an electrolytic composition comprising a source of cobalt ions, a suppressor, a buffer, and one or more of a depolarizing compound and a uniformity enhancer. Electrical current is supplied to the electrolytic composition to deposit cobalt onto the base structure and fill the submicron-sized features with cobalt. The method presented herein is useful for superfilling interconnect features.

公开(公告)号：US20180016685A1

公开(公告)日：2018-01-18

申请号：US15667002

申请日：2017-08-02

Applicant: MacDermid Enthone Inc.

Inventor： Trevor Pearson ,  Terrence Clark ,  Roshan V. Chapaneri

IPC: C25C1/10 ,  C25C7/02 ,  C25B11/12 ,  C25B1/21 ,  C23C18/20 ,  C23C18/30 ,  C23C18/22 ,  C25D5/54 ,  C25B9/06

CPC classification number: C25C1/10 ,  C23C18/2086 ,  C23C18/2093 ,  C23C18/22 ,  C23C18/30 ,  C25B1/21 ,  C25B9/06 ,  C25B11/12 ,  C25C7/02 ,  C25D5/54

Abstract: An electrolytic cell and a method of electrochemical oxidation of manganese(II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises (1) an electrolyte solution of manganese(II) ions in a solution of 9 to 15 molar sulfuric acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, and woven carbon fibers.

公开(公告)号：US20240271307A1

公开(公告)日：2024-08-15

申请号：US18568465

申请日：2022-05-25

Applicant: MacDermid Enthone Inc.

Inventor： Donald Desalvo ,  Ron Blake ,  Carmichael Gugliotti ,  William J. Decesare ,  Richard A. Bellemare ,  James Watkowski ,  Ernest Long

IPC: C25D5/18 ,  C25D3/38 ,  C25D5/02 ,  C25D7/00 ,  H05K3/42

CPC classification number: C25D5/18 ,  C25D3/38 ,  C25D5/02 ,  C25D7/00 ,  H05K3/421 ,  H05K3/424

Abstract: A method of copper electroplating in the manufacture of printed circuit boards. The method is used for filling through-holes and blind micro-vias with copper. The method includes the steps of: (1) preparing an electronic substrate to. receive copper electroplating thereon: (2) forming at least one of one or more through-holes and/or one or more blind micro-vias in the electronic substrate; and (3) electroplating copper in the at one or more through-holes and/or one or more blind micro-vias by contacting the electronic substrate with an acid copper electrolyte. The acid copper electrolyte is used to plate the one or more through-holes and/or the one or more blind micro-vias using a complex waveform including pulse reverse plating. DC plating and/or synchronous pulse plating. The complex waveforms can be used for filling through-holes and blind microvias with copper without defects.

公开(公告)号：US11873568B2

公开(公告)日：2024-01-16

申请号：US17834265

申请日：2022-06-07

Applicant: MacDermid Enthone Inc.

Inventor： Kyle M. Whitten ,  Stephan I. Braye ,  Jianwen Han ,  Pingping Ye ,  Thomas B. Richardson ,  Elie H. Najjar

IPC: C25D3/38 ,  C25D5/00 ,  B82Y40/00 ,  B82Y30/00

CPC classification number: C25D3/38 ,  C25D5/605 ,  B82Y30/00 ,  B82Y40/00

Abstract: A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl. The copper electroplating solution is used to deposit copper having a high density of nanotwinned columnar copper grains on a substrate. The linear or branched polyhydroxyl may comprise a reaction product between 2,3-epoxy-1-propanol and aminic alcohol or ammonium alcohol.

公开(公告)号：US11807951B2

公开(公告)日：2023-11-07

申请号：US17524450

申请日：2021-11-11

Applicant: MacDermid Enthone Inc.

Inventor： Shaopeng Sun ,  Kyle Whitten ,  Stephan Braye ,  Elie Najjar

IPC: C25D3/16 ,  C25D5/02 ,  C25D5/18 ,  C25D7/12 ,  B32B15/04 ,  B32B3/26 ,  C25D5/00 ,  C25D7/00

CPC classification number: C25D3/16 ,  B32B3/26 ,  B32B15/04 ,  B32B15/043 ,  C25D5/02 ,  C25D5/18 ,  C25D5/611 ,  C25D7/00 ,  C25D7/123 ,  Y10T428/1291 ,  Y10T428/12931 ,  Y10T428/12937 ,  Y10T428/12993 ,  Y10T428/2495 ,  Y10T428/24942 ,  Y10T428/265

Abstract: An electroplated cobalt deposit and a method of electrodepositing cobalt on a surface to produce a level deposit across the surface of the substrate. The cobalt electrolyte contains (1) a source of cobalt ions; (2) boric acid; (3) a pH adjuster; and (4) an organic additive, which contains a suppressor. The electroplated cobalt deposit exhibits a level surface such that the thickness difference across substantially the entire surface of the substrate of less than about 200 nm.

公开(公告)号：US11643742B2

公开(公告)日：2023-05-09

申请号：US17591071

申请日：2022-02-02

Applicant: MacDermid Enthone Inc.

Inventor： Fengting Xu ,  Jean W. Chevalier ,  Ernest Long ,  Richard A. Bellemare ,  Michael M. Ryl

IPC: C25D3/64 ,  C25D3/32 ,  C25D3/12 ,  C25D3/46 ,  C25D5/12 ,  H01R43/26

CPC classification number: C25D3/46 ,  C25D3/32 ,  C25D3/64 ,  C25D5/12 ,  H01R43/26

Abstract: An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.

公开(公告)号：US20220298665A1

公开(公告)日：2022-09-22

申请号：US17834265

申请日：2022-06-07

Applicant: MacDermid Enthone Inc.

Inventor： Kyle M. Whitten ,  Stephan I. Braye ,  Jianwen Han ,  Pingping Ye ,  Thomas B. Richardson ,  Elie H. Najjar

IPC: C25D3/38 ,  C25D5/00

Abstract: A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl. The copper electroplating solution is used to deposit copper having a high density of nanotwinned columnar copper grains on a substrate. The linear or branched polyhydroxyl may comprise a reaction product between 2,3-epoxy-1-propanol and aminic alcohol or ammonium alcohol.

公开(公告)号：US11280014B2

公开(公告)日：2022-03-22

申请号：US16893956

申请日：2020-06-05

Applicant: MacDermid Enthone Inc.

Inventor： Fengting Xu ,  Jean W. Chevalier ,  Ernest Long ,  Richard A. Bellemare ,  Michael M. Ryl

IPC: C25D3/46 ,  C25D3/32 ,  C25D5/12 ,  H01R43/26

Abstract: An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.