中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

31 records (took 0.017 seconds)

    Multilayered printed circuit board and manufacturing method thereof
    23.
    发明申请
    Multilayered printed circuit board and manufacturing method thereof 审中-公开
    多层印刷电路板及其制造方法

    公开(公告)号：US20090038837A1

    公开(公告)日：2009-02-12

    申请号：US12078176

    申请日：2008-03-27

    Applicant: Shuhichi Okabe ,  Jin-Yong An ,  Seok-Kyu Lee ,  Soon-Oh Jung ,  Jong-Kuk Hong ,  Hae-Nam Seo

    Inventor： Shuhichi Okabe ,  Jin-Yong An ,  Seok-Kyu Lee ,  Soon-Oh Jung ,  Jong-Kuk Hong ,  Hae-Nam Seo

    IPC: H05K1/11 ,  B32B38/10

    CPC classification number: H05K3/462 ,  H05K3/205 ,  H05K3/243 ,  H05K3/421 ,  H05K3/4623 ,  H05K3/4644 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2201/096

    Abstract: A multilayered printed circuit board is disclosed. A method of manufacturing the multilayered printed circuit board, which includes: forming a metal layer and a lower-circuit-forming pattern in order on a carrier, and forming a lower circuit by filling a conductive material in the lower-circuit-forming pattern; removing the lower-circuit-forming pattern, stacking an insulation resin, and forming at least one via hole connecting with the lower circuit; forming at least one inner circuit and at least one interlayer connector connecting the inner circuit with the lower circuit on the insulation resin, to form a pair of circuit parts; and aligning the pair of circuit parts, attaching the pair of circuit parts to each other, and removing the carrier and the metal layer, allows the forming of fine-lined circuits and provides a thin board, while preventing bending and warpage in the board.

    Abstract translation: 公开了一种多层印刷电路板。 一种制造多层印刷电路板的方法，包括：在载体上依次形成金属层和下电路形成图案，并通过在下电路形成图案中填充导电材料形成下层电路; 去除下部电路形成图案，堆叠绝缘树脂，并形成与下部电路连接的至少一个通孔; 在所述绝缘树脂上形成至少一个内部电路和连接所述内部电路与所述下部电路的至少一个层间连接器，以形成一对电路部件; 并且将一对电路部件对准，将一对电路部件彼此连接，并且移除载体和金属层，允许形成精细的电路并提供薄板，同时防止板的弯曲和翘曲。

    Printed circuit board with embedded capacitors therein, and process for manufacturing the same
    25.
    发明授权
    Printed circuit board with embedded capacitors therein, and process for manufacturing the same 失效
    具有嵌入式电容器的印刷电路板及其制造方法

    公开(公告)号：US06910266B2

    公开(公告)日：2005-06-28

    申请号：US10609618

    申请日：2003-07-01

    Applicant: Seok-Kyu Lee ,  Jang-Kyu Kang ,  Hyun-Ju Jin ,  Byoung-Youl Min

    Inventor： Seok-Kyu Lee ,  Jang-Kyu Kang ,  Hyun-Ju Jin ,  Byoung-Youl Min

    IPC: H05K3/46 ,  H05K1/16 ,  H05K3/00 ,  H05K3/42 ,  H05K3/30

    CPC classification number: H05K1/162 ,  H05K3/0023 ,  H05K3/429 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2203/0568 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49155

    Abstract: Disclosed herein are a printed circuit board with embedded capacitors therein and a process for manufacturing the printed circuit board. The embedded capacitors are formed by applying a photosensitive insulating resin to a printed circuit board inner layer, and applying a high dielectric polymer capacitor paste thereto. The process for manufacturing a printed circuit board with embedded capacitors therein comprises the steps of: i) laminating photoresist dry films to a copper clad FR-4, exposing to light and developing the dry films, and etching copper foils of the copper clad FR-4 to form bottom electrodes for forming capacitors; ii) applying a photosensitive insulating resin to the surfaces of the bottom electrodes, and exposing to light and developing to etch the photosensitive insulating resin; iii) applying a capacitor paste to the etched regions and curing the capacitor paste; iv) plating the upper regions of the cured capacitor paste and the photosensitive insulating resin using an electroless copper plating process to form copper foil layers for top electrodes; v) laminating photosensitive dry films to the copper foil layers for top electrodes, and exposing to light and developing the photosensitive dry films to etch regions of the dry films except for the copper foil layers where the top electrodes are to be formed; and vi) etching the regions of the dry films except for the copper foil layers where the top electrodes are to be formed, and the dry films formed on the top electrodes are removed so that the capacitor paste is discretely positioned between the top electrodes and the bottom electrodes to form discrete capacitors.

    Abstract translation: 这里公开了一种其中具有嵌入式电容器的印刷电路板和用于制造印刷电路板的工艺。 嵌入式电容器通过将印刷电路板内层施加感光绝缘树脂，并向其施加高介电聚合物电容器膏而形成。 制造具有嵌入式电容器的印刷电路板的方法包括以下步骤：i）将光致抗蚀剂干膜层压到铜包覆FR-4上，曝光并显影干膜，并蚀刻铜包覆FR- 4以形成用于形成电容器的底部电极; ii）将感光绝缘树脂施加到底部电极的表面，并暴露于光和显影以蚀刻感光绝缘树脂; iii）将电容器膏施加到蚀刻区域并固化电容器糊; iv）使用化学镀铜工艺电镀固化的电容器浆料和感光绝缘树脂的上部区域，以形成用于顶部电极的铜箔层; v）将感光性干膜层压到用于顶部电极的铜箔层上，暴露于光并显影感光干膜以蚀刻除了要形成顶部电极的铜箔层之外的干膜的区域; 以及vi）蚀刻除了要形成顶部电极的铜箔层之外的干膜的区域，并且除去形成在顶部电极上的干膜，使得电容器糊料离散地位于顶部电极和 底部电极形成分立电容。

    Method of manufacturing printed circuit board
    27.
    发明授权
    Method of manufacturing printed circuit board 有权
    制造印刷电路板的方法

    公开(公告)号：US07971352B2

    公开(公告)日：2011-07-05

    申请号：US12213465

    申请日：2008-06-19

    Applicant: Shuhichi Okabe ,  Jin-Yong An ,  Seok-Kyu Lee ,  Soon-Oh Jung ,  Jong-Kuk Hong ,  Hae-Nam Seo

    Inventor： Shuhichi Okabe ,  Jin-Yong An ,  Seok-Kyu Lee ,  Soon-Oh Jung ,  Jong-Kuk Hong ,  Hae-Nam Seo

    IPC: H01R9/00 ,  H05K3/00

    CPC classification number: H05K3/4682 ,  H05K3/108 ,  H05K3/205 ,  H05K3/3473 ,  H05K2201/0367 ,  H05K2203/0376 ,  H05K2203/043 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149

    Abstract: A method of manufacturing a printed circuit board having solder balls. The method may include: stacking a second carrier, in which at least one hole is formed, over one side of a first carrier; forming at least one solder bump by filling the hole with a conductive material; forming a circuit pattern layer, which is electrically connected with the solder bump, on the second carrier; and exposing the solder bump by removing the first carrier and the second carrier. Using this method, uniform hemispherical solder balls with fine pitch can be formed as a part of the manufacturing process, without having to attach the solder balls separately. Carriers may be used to serve as supports during the manufacturing process, whereby deformations can be prevented in the board.

    Abstract translation: 一种制造具有焊球的印刷电路板的方法。 该方法可以包括：在第一载体的一侧堆叠形成有至少一个孔的第二载体; 通过用导电材料填充孔而形成至少一个焊料凸块; 在所述第二载体上形成与所述焊料凸块电连接的电路图案层; 以及通过去除所述第一载体和所述第二载体来暴露所述焊料凸块。 使用这种方法，可以形成具有细间距的均匀的半球形焊球作为制造过程的一部分，而不必分别附接焊球。 可以在制造过程中使用载体作为支撑体，从而可以防止板的变形。

    Method of manufacturing printed circuit board
    29.
    发明申请
    Method of manufacturing printed circuit board 有权
    制造印刷电路板的方法

    公开(公告)号：US20090151160A1

    公开(公告)日：2009-06-18

    申请号：US12213465

    申请日：2008-06-19

    Applicant: Shuhichi Okabe ,  Jin-Yong An ,  Seok-Kyu Lee ,  Soon-Oh Jung ,  Jong-Kuk Hong ,  Hae-Nam Seo

    Inventor： Shuhichi Okabe ,  Jin-Yong An ,  Seok-Kyu Lee ,  Soon-Oh Jung ,  Jong-Kuk Hong ,  Hae-Nam Seo

    IPC: H05K3/10 ,  H05K3/36

    CPC classification number: H05K3/4682 ,  H05K3/108 ,  H05K3/205 ,  H05K3/3473 ,  H05K2201/0367 ,  H05K2203/0376 ,  H05K2203/043 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149

    Abstract: A method of manufacturing a printed circuit board having solder balls. The method may include: stacking a second carrier, in which at least one hole is formed, over one side of a first carrier; forming at least one solder bump by filling the hole with a conductive material; forming a circuit pattern layer, which is electrically connected with the solder bump, on the second carrier; and exposing the solder bump by removing the first carrier and the second carrier. Using this method, uniform hemispherical solder balls with fine pitch can be formed as a part of the manufacturing process, without having to attach the solder balls separately. Carriers may be used to serve as supports during the manufacturing process, whereby deformations can be prevented in the board.

    Abstract translation: 一种制造具有焊球的印刷电路板的方法。 该方法可以包括：在第一载体的一侧堆叠形成有至少一个孔的第二载体; 通过用导电材料填充孔而形成至少一个焊料凸块; 在所述第二载体上形成与所述焊料凸块电连接的电路图案层; 以及通过去除所述第一载体和所述第二载体来暴露所述焊料凸块。 使用这种方法，可以形成具有细间距的均匀的半球形焊球作为制造过程的一部分，而不必分别附接焊球。 可以在制造过程中使用载体作为支撑体，从而可以防止板的变形。

Patent Agency Ranking