公开(公告)号：US08514345B2

公开(公告)日：2013-08-20

申请号：US13111262

申请日：2011-05-19

申请人： Masato Onoue ,  Shinji Suminoe ,  Koji Sakai

发明人： Masato Onoue ,  Shinji Suminoe ,  Koji Sakai

IPC分类号： G02F1/1333 ,  G02F1/1335 ,  F21V7/04

CPC分类号： G02B6/009 ,  G02B6/0068 ,  G02B6/0073 ,  G02F2001/133317

摘要： A backlight unit comprising: a light guide plate for causing light to exit in a planar manner from an upper surface of the light guide plate, the light having entered the light guide plate from an LED; a substrate provided along an end surface of the light guide plate and having an LED mounted on a counter surface of the substrate, the counter surface facing the end surface of the light guide plate; a frame provided along the substrate and attached to the substrate on a rear surface of the substrate, the rear surface being opposite to the counter surface; and one or a plurality of insulating members arranged in such a manner that the one or the plurality of insulating members and the frame sandwich the substrate, the one or the plurality of insulating members each fixing a screw point of a screw inserted from the frame into a through-hole provided through the frame and the substrate.

摘要翻译： 一种背光单元，包括：导光板，用于使光从所述导光板的上表面以平面方式退出，所述光从LED进入所述导光板; 沿着所述导光板的端面设置的基板，具有安装在所述基板的相对面上的LED，所述反面朝向所述导光板的端面; 沿所述基板设置并且在所述基板的后表面上附着到所述基板的框架，所述后表面与所述对置表面相对; 以及一个或多个绝缘构件，其布置成使得所述一个或多个绝缘构件和框架夹持所述基板，所述一个或多个绝缘构件将将从所述框架插入的螺钉的螺钉点固定到 通过所述框架和所述基板设置的通孔。

公开(公告)号：US08111371B2

公开(公告)日：2012-02-07

申请号：US12599837

申请日：2008-07-02

申请人： Shinji Suminoe ,  Tomohiko Yamamoto ,  Akira Tomiyoshi ,  Naoto Inoue

发明人： Shinji Suminoe ,  Tomohiko Yamamoto ,  Akira Tomiyoshi ,  Naoto Inoue

IPC分类号： G02F1/1333

CPC分类号： H05B33/0872 ,  G02F1/133603 ,  G09G3/3426 ,  G09G2320/041 ,  H05B33/0821

摘要： An illumination device includes an LED package, an LED driver including an FET, and a thermistor disposed on a substrate. A plurality of such LED packages are disposed on the substrate such that a first area and a second area, each determined by vertices corresponding to LED packages, are defined on the substrate. The thermistor is disposed in the first area, and the FET is disposed in the second area, which is outside of the first area. The thermistor detects a temperature in the first area. Such a configuration allows the thermistor to detect, in accordance with the temperature in the area, the temperature of heat transferred from the LED packages, without being affected by heat generated by the FET. This makes it possible to efficiently make temperature corrections to stabilize color temperature and luminance.

摘要翻译： 照明装置包括LED封装，包括FET的LED驱动器和设置在基板上的热敏电阻。 多个这样的LED封装被布置在基板上，使得在基板上限定了由与LED封装相对应的顶点确定的第一区域和第二区域。 热敏电阻设置在第一区域中，并且FET设置在第一区域外的第二区域中。 热敏电阻检测第一个区域的温度。 这种配置允许热敏电阻根据区域中的温度检测从LED封装传递的热量的温度，而不受FET产生的热的影响。 这使得可以有效地进行温度校正来稳定色温和亮度。

公开(公告)号：US20110304798A1

公开(公告)日：2011-12-15

申请号：US12797748

申请日：2010-06-10

申请人： Atsuyuki TANAKA ,  Takeshi MASUDA ,  Shinji SUMINOE ,  Kohji ITOH

发明人： Atsuyuki TANAKA ,  Takeshi MASUDA ,  Shinji SUMINOE ,  Kohji ITOH

IPC分类号： G02F1/1335 ,  F21V1/00

CPC分类号： G02F1/133603 ,  G02F1/133605 ,  G02F1/133606 ,  G02F1/133608

摘要： An illumination device 10 includes a diffusion plate 13 for diffusing light emitted from light sources 17, which diffusion plate 13 is fixed on first partition walls 11 and provided on upper sides of light source blocks 18. The arrangement makes it possible to provide a high-quality illumination device and a high-quality liquid crystal display device in each of which unevenness in luminance and color is restrained so that a luminance distribution becomes constant.

摘要翻译： 照明装置10包括用于漫射从光源17发射的光的扩散板13，该漫射板13固定在第一分隔壁11上并设置在光源块18的上侧。该布置使得可以提供高分辨率 高质量的照明装置和高质量的液晶显示装置，其中抑制了亮度和颜色的不均匀性，使得亮度分布变得恒定。

公开(公告)号：US20110109834A1

公开(公告)日：2011-05-12

申请号：US13002050

申请日：2009-04-07

申请人： Kohji Itoh ,  Shinji Suminoe ,  Masato Onoue ,  Daisuke Takeda

发明人： Kohji Itoh ,  Shinji Suminoe ,  Masato Onoue ,  Daisuke Takeda

IPC分类号： G02F1/13357 ,  F21V21/00 ,  H05K7/00 ,  H05K7/20

CPC分类号： G02B6/008 ,  G02B6/0021 ,  G02B6/0046 ,  G02B6/0083 ,  G02B6/0085 ,  G02F1/133603 ,  G02F1/133608 ,  G02F2001/133314 ,  G02F2001/133628 ,  H05K7/20963

摘要： Accommodating spots (13) for accommodating circuit elements (25) are formed for the respective circuit elements (25) in an opposing surface (11U), which is one surface of a backlight frame (11) opposed to a circuit element mounting surface (23B) on which the circuit elements (25) are mounted.

摘要翻译： 在与电路元件安装表面（23B）相对的背光框架（11）的一个表面的相对表面（11U）中为各个电路元件（25）形成用于容纳电路元件（25）的容纳点（13） ），其上安装有电路元件（25）。

公开(公告)号：US20100225572A1

公开(公告)日：2010-09-09

申请号：US12599853

申请日：2008-07-16

申请人： Shinji Suminoe ,  Yuhsaku Ajichi

发明人： Shinji Suminoe ,  Yuhsaku Ajichi

IPC分类号： G09G3/36 ,  G02F1/13357

CPC分类号： G02B6/0035 ,  G02B6/0028 ,  G02B6/0046 ,  G02B6/0078 ,  G02B6/008

摘要： A backlight (illumination device; 2) of the present invention includes: multiple light sources (5); and multiple light guides (7, 17, . . . ) for causing surface emission of light from the light sources (5). Each of the light guides (7, 17, . . . ) includes: a light-emitting section (7b, 17b, . . . ) having a light-emitting surface (7a); and a light guide section (7c) for guiding, to the light-emitting section (7b, 17b, . . . ), light from the light sources (5), a light-emitting section (7b) of a first light guide (7) being provided above a light guide section (17c) of a second light guide (17) adjacent to the first light guide (7). A light amount adjusting section (11) for reducing the amount of light incident on it is provided between the light-emitting section (7b) of the first light guide (7) and the light-emitting section (17b) of the second light guide. This allows for production of an illumination device having further improved luminance uniformity.

摘要翻译： 本发明的背光（照明装置; 2）包括：多个光源（5）; 以及用于引起来自光源（5）的光的表面发射的多个光导（7,17）。 每个光导（7,17）包括：具有发光表面（7a）的发光部（7b，17b ...）; 以及导光部（7c），用于将来自光源（5）的光，第一导光体的发光部（7b）引导到发光部（7b，17b ...） 7）设置在与第一光导（7）相邻的第二导光体（17）的导光部（17c）的上方。 在第一导光体（7）的发光部（7b）与第二导光体（7b）的发光部（17b）之间设置用于减少入射到其上的光量的光量调节部（11） 。 这允许生产具有进一步改善的亮度均匀性的照明装置。

公开(公告)号：US20070075435A1

公开(公告)日：2007-04-05

申请号：US11540691

申请日：2006-10-02

申请人： Shinji Suminoe ,  Yoko Minamiguchi

发明人： Shinji Suminoe ,  Yoko Minamiguchi

IPC分类号： H01L23/52

CPC分类号： H01L23/49816 ,  H01L21/563 ,  H01L23/3128 ,  H01L24/10 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13561 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： On a substrate (2), a first package (4) is mounted through bumps (3), and a second package (6) is stacked on the first package (4). Each of the bumps (3) includes: a resin core (3a) having elasticity; and metal layers formed on an outer surface of the resin core. The bumps (3) are arranged so as to provide an electrical connection between the substrate (2) and the first package (4). With the above structure, a stacked semiconductor device is realized in which an IC chip breaks less likely during a mounting process.

摘要翻译： 在基板（2）上，通过凸块（3）安装第一封装（4），并且第二封装（6）堆叠在第一封装（4）上。 每个凸起（3）包括：具有弹性的树脂芯（3a）; 以及形成在树脂芯的外表面上的金属层。 凸起（3）被布置成在基板（2）和第一封装（4）之间提供电连接。 利用上述结构，实现了在安装过程中IC芯片不太可能发生堆叠的半导体器件。

公开(公告)号：US20060022320A1

公开(公告)日：2006-02-02

申请号：US11188785

申请日：2005-07-26

申请人： Hiroyuki Nakanishi ,  Shinji Suminoe

发明人： Hiroyuki Nakanishi ,  Shinji Suminoe

IPC分类号： H01R13/15 ,  H01L23/02

CPC分类号： H01L24/10 ,  H01L23/3114 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05023 ,  H01L2224/05548 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H05K1/0231 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0379 ,  H05K2201/09745 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2203/041 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A semiconductor apparatus includes: a first insulating layer formed on an IC chip; a metal wiring having one end connected to a chip electrode pad, and one other end on which an external connection terminal mounting electrode is provided; an electronic component connected to part of the external connection terminal mounting electrode; an external connection terminal, which is made of a conductive material, formed on one other part of the external connection terminal mounting electrode; a second insulating layer covering, at least, (a) part of the external connection terminal mounting electrode to which the electronic component is not mounted, and (b) the metal wiring; and a sealing resin for sealing the electronic component and the external connection terminal in such a manner that the external connection terminal is partially exposed so as to have an exposed portion.

摘要翻译： 半导体装置包括：形成在IC芯片上的第一绝缘层; 金属配线，其一端连接到芯片电极焊盘，另一端设置有外部连接端子安装电极; 连接到所述外部连接端子安装电极的一部分的电子部件; 在外部连接端子安装电极的另一个部分上形成由导电材料制成的外部连接端子; 覆盖至少（a）部分未安装电子部件的外部连接端子安装电极的第二绝缘层和（b）金属布线; 以及用于密封电子部件和外部连接端子的密封树脂，使得外部连接端子部分地露出以具有暴露部分。

公开(公告)号：US20050194686A1

公开(公告)日：2005-09-08

申请号：US11072238

申请日：2005-03-07

申请人： Yoshihide Iwazaki ,  Shinji Suminoe ,  Katsunobu Mori

发明人： Yoshihide Iwazaki ,  Shinji Suminoe ,  Katsunobu Mori

IPC分类号： H01L23/52 ,  H01L21/3205 ,  H01L21/44 ,  H01L21/60 ,  H01L23/12 ,  H01L23/31 ,  H01L23/48 ,  H01L23/485 ,  H01L23/525 ,  H05K3/34

CPC分类号： H05K3/3452 ,  H01L23/3114 ,  H01L23/525 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/1148 ,  H01L2224/13 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2201/2081 ,  H05K2203/0315 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/013

摘要： A semiconductor device according to the present invention comprises an electrode pad electrically conducted to an electric circuit formed on an element-formed surface of a silicon wafer; a wiring pattern re-wired by being electrically conducted to the electrode pad; and an oxide film formed on a surface of the wiring pattern, the oxide film being formed by subjecting the wiring pattern to oxidization. With the provision of oxide film, the semiconductor device prevents a decrease in reliability in terms of electric characteristic or the like, and also achieves reduction in fabrication cost compared to a conventional semiconductor device.

摘要翻译： 根据本发明的半导体器件包括电导体，该电极焊盘导电到形成在硅晶片的元件形成表面上的电路; 通过对电极焊盘进行导电而重新布线的布线图案; 以及形成在所述布线图案的表面上的氧化膜，所述氧化膜通过对所述布线图案进行氧化而形成。 通过提供氧化膜，半导体器件防止电特性等的可靠性降低，并且与现有的半导体器件相比，也可以实现制造成本的降低。

公开(公告)号：US20050104165A1

公开(公告)日：2005-05-19

申请号：US11023389

申请日：2004-12-29

申请人： Toshiya Ishio ,  Hiroyuki Nakanishi ,  Katsunobu Mori ,  Yoshihide Iwazaki ,  Shinji Suminoe

发明人： Toshiya Ishio ,  Hiroyuki Nakanishi ,  Katsunobu Mori ,  Yoshihide Iwazaki ,  Shinji Suminoe

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L23/552 ,  H01L29/06 ,  H01L21/302

CPC分类号： H01L23/552 ,  H01L23/3114 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L29/0657 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor chip of the present invention is so arranged that a front face on which an element circuit is formed has electrode pads and a side face and a back face are coated with a shielding layer for shielding electromagnetic waves. With this, it is possible to provide a semiconductor element capable of being easily manufactured into a smaller semiconductor device compared with a conventional semiconductor device equipped with a shielding cap; a semiconductor device; and a method for manufacturing a semiconductor element.

摘要翻译： 本发明的半导体芯片被布置成使得其上形成有元件电路的正面具有电极焊盘，并且侧面和背面涂覆有用于屏蔽电磁波的屏蔽层。 由此，与配备有屏蔽盖的现有的半导体装置相比，可以提供能够容易地制造成较小的半导体装置的半导体元件; 半导体器件; 以及半导体元件的制造方法。

公开(公告)号：US06380620B1

公开(公告)日：2002-04-30

申请号：US09373535

申请日：1999-08-13

申请人： Shinji Suminoe ,  Kenji Toyosawa ,  Yasuaki Isobe

发明人： Shinji Suminoe ,  Kenji Toyosawa ,  Yasuaki Isobe

IPC分类号： H01L2310

CPC分类号： H01L23/36 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012

摘要： An inner lead and an outer lead are formed only on an insulating tape. A semiconductor chip and the inner lead are connected by the flip chip method by providing an anisotropic conductive material therebetween. A radiating plate is bonded to the insulating tape with use of an adhesive so that the radiating plate covers all regions where solder balls connected with the outer leads are formed. Unlike the TAB type, the inner lead is not uncovered with the insulating tape, whereby deformation of the inner lead is suppressed as much as possible. With this arrangement, the following effect can be achieved. Namely, in a semiconductor device of the BGA type, heat generated during package manufacture can be efficiently emitted, and hence package defects caused by heat and stress during manufacture can be suppressed. As a result, smaller and thinner packages can be manufactured, while pitch narrowing and multiple-port structure can be achieved.

摘要翻译： 内引线和外引线仅在绝缘带上形成。 通过在其间提供各向异性导电材料，通过倒装芯片方法连接半导体芯片和内引线。 使用粘合剂将辐射板粘合到绝缘带上，使得辐射板覆盖形成与外引线连接的焊球的所有区域。 与TAB类型不同，内部引线不会被绝缘带覆盖，从而尽可能地抑制内部引线的变形。 通过这种布置，可以实现以下效果。 也就是说，在BGA型半导体器件中，可以有效地发出封装制造时产生的热量，能够抑制制造时的热和应力引起的封装缺陷。 结果，可以制造更小和更薄的包装，同时可以实现节距变窄和多端口结构。